Glass core substrates (GCS) are poised to play a crucial role in next-generation advanced chip packaging. In response, Japanese and South Korean semiconductor supply chain players...

Ibiden, the Japanese electronic component supplier, used to be seen as an Intel supply chain partner.

Samsung Electro-Mechanics (Semco) has commenced mass production at its ABF substrate plant in Vietnam, following a KRW 1 trillion (US$ 720 million) investment announced in 2021. This...

South Korea's leading IC design company, LX Semicon, is reportedly downsizing its Silicon Carbide (SiC) semiconductor R&D operations.

Taiwan's three leading IC substrate makers — Unimicron, Nan Ya PCB, and Kinsus — have posted mixed results for May.

Intel has announced the industry's first Glass Core Substrate (GCS) technology for next-generation advanced packaging, which has once again attracted market discussion due to the...

The market for ABF substrates is unlikely to see shortages return until the first quarter of 2026, according to T. J. Tseng, chairman of Unimicron Technology.

Abundant supply in China has domestic SiC substrate prices falling sharply since early 2024, according to industry sources.

Samsung Electro-Mechanics (Semco) is reportedly expediting the development of its semiconductor packaging-use Glass Core Substrate (GCS) business by advancing the construction of...

Despite slowing ABF substrate market growth, demand is expected to be fueled by rising demand for HPC and AI device applications.

The IC substrate sector is predicted to return to growth in the second half of 2024, with the growth momentum continuing in 2025, according to industry sources.

Despite ongoing geopolitical tensions and inventory adjustments, the global PCB industry is poised for a resurgence, buoyed by robust demand for AI and HPC.

Subsidiaries of the Samsung Group will collaborate to invest in the research and development of Glass Core Substrates (GCS) to expedite their commercialization, aiming to rival Intel,...

As global chipmaking leaders like Intel are optimistic about introducing glass substrates for advanced IC packaging, Japan-based PCB suppliers are capitalizing on the emerging tech...

Unimicron Technology's production yield rates for high-end ABF substrates remain lower than those of Ibiden. This presents a challenge to the Taiwanese company, despite being the...