The market for ABF substrates is unlikely to see shortages return until the first quarter of 2026, according to T. J. Tseng, chairman of Unimicron Technology.
Samsung Electro-Mechanics (Semco) is reportedly expediting the development of its semiconductor packaging-use Glass Core Substrate (GCS) business by advancing the construction of...
The IC substrate sector is predicted to return to growth in the second half of 2024, with the growth momentum continuing in 2025, according to industry sources.
Despite ongoing geopolitical tensions and inventory adjustments, the global PCB industry is poised for a resurgence, buoyed by robust demand for AI and HPC.
Subsidiaries of the Samsung Group will collaborate to invest in the research and development of Glass Core Substrates (GCS) to expedite their commercialization, aiming to rival Intel,...
As global chipmaking leaders like Intel are optimistic about introducing glass substrates for advanced IC packaging, Japan-based PCB suppliers are capitalizing on the emerging tech...
Unimicron Technology's production yield rates for high-end ABF substrates remain lower than those of Ibiden. This presents a challenge to the Taiwanese company, despite being the...
BT substrate demand has begun to rise, driven by growing demand for mobile phones and memory chips, while ABF substrate demand is expected to pick up in the second half of 2024, according...
Although the semiconductor industry has experienced rapid growth in certain sectors such as high-bandwidth memory (HBM), the recovery remains slow. Particularly, companies that viewed...
Following a significant drop in sales of BT substrates and midrange ABF substrates in 2023 amid sluggish post-pandemic consumer electronics demand, Taiwan's Unimicron Technology is...