China-based display solutions supplier BOE Technology has unveiled a roadmap for diversification into making glass substrates for semiconductor packaging.

Provider of semiconductor materials such as silicon wafers, Shin-Etsu Chemical has many semiconductor material products ranked first or second in the market, but it is still concerned...

The second-quarter financial reports of tech giants have been gradually released, with Nvidia delivering results that exceeded expectations, maintaining year-over-year growth, quarter-over-quarter...

Taiwan-based makers have established an alliance targeting the supply of glass substrates, potentially a game changer for semiconductor packaging.

Mitsubishi Materials has announced the development of the world's largest rectangular silicon substrate, a technology gaining attention due to advancements in advanced packaging....

Glass Core Substrate (GCS) is becoming a trend that major players in the semiconductor supply chain are avidly pursuing. LG Innotek is reportedly contacting material, components,...

Glass substrate prices are expected to rise in the third quarter of 2024, reflecting the depreciation of the Japanese yen, the tight supply-demand balance, and profits made by some...

Driven by emerging applications such as electric vehicles (EV), AI, and high-performance computing (HPC), IC substrates have attracted significant attention in the semiconductor industry...

Gallium nitride (GaN), a third-generation compound semiconductor, has not developed as rapidly as silicon carbide (SiC). Nevertheless, this hasn't deterred new opportunists from joining...

Glass core substrates (GCS) are poised to play a crucial role in next-generation advanced chip packaging. In response, Japanese and South Korean semiconductor supply chain players...

Ibiden, the Japanese electronic component supplier, used to be seen as an Intel supply chain partner.

Samsung Electro-Mechanics (Semco) has commenced mass production at its ABF substrate plant in Vietnam, following a KRW 1 trillion (US$ 720 million) investment announced in 2021. This...

South Korea's leading IC design company, LX Semicon, is reportedly downsizing its Silicon Carbide (SiC) semiconductor R&D operations.

Taiwan's three leading IC substrate makers — Unimicron, Nan Ya PCB, and Kinsus — have posted mixed results for May.

Intel has announced the industry's first Glass Core Substrate (GCS) technology for next-generation advanced packaging, which has once again attracted market discussion due to the...