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    Trump-Xi meeting leaves InP and CVD export controls unresolved
    2h 5min ago
    Analysis: High oil prices lifted global EV demand as Chinese automakers expanded overseas
    2h 5min ago
    ODMs push consignment deals to defend AI server margins
    2h 5min ago
    Two Malaysian IC design firms win access to Arm under US$250 million pact
    2h 5min ago
    Edge AI is driving a new upgrade cycle in wearables
    2h 5min ago
    NEWS TAGGED SUBSTRATE
    Thursday 14 May 2026
    Samsung reportedly speeds up 3D NAND, packaging, and substrate plans
    Samsung Electronics is reportedly reviving delayed semiconductor initiatives across next-generation NAND flash, compound semiconductors, advanced packaging, and substrates —...
    Thursday 14 May 2026
    Korea races to narrow chip packaging gap with Taiwan and China

    AI server demand is pushing semiconductor packaging into a new growth cycle, but the market remains heavily concentrated among a small...

    Wednesday 13 May 2026
    Ajinomoto raises ABF substrate film prices 30%
    Ajinomoto has informed IC substrate makers that it will raise prices for its key ABF build-up film by 30%, with the new pricing expected to take effect in the third quarter of 2026...
    Tuesday 12 May 2026
    From substrates to servers, Taiwan industry gains from the AI infrastructure surge
    April results across Taiwan's electronics hardware supply chain underscored how deeply artificial intelligence infrastructure is reshaping demand patterns — from advanced materials...
    Monday 11 May 2026
    Tesla AI5 ignites Samsung-LG race for ABF substrates, robot parts

    LG Innotek is seeking to enter Tesla's AI semiconductor supply chain by targeting ABF-based FC-BGA substrate orders for the automaker's...

    Monday 11 May 2026
    AI surge drives Taiwan push for second-source PCB materials as market booms
    The global copper-clad laminate market expanded sharply as AI computing demand forced higher-spec hardware, and Taiwan's printed circuit board supply chain moved to secure second-source...
    Sunday 10 May 2026
    Taiwan's IntelliEPI warns of severe indium phosphide supply shortage
    As AI data centers demand ever-faster networking speeds and more advanced optical interconnects, one of the semiconductor industry's lesser-known materials is emerging as a major c...
    Wednesday 6 May 2026
    GCS Holdings says InP export controls remain top supply risk despite capacity and sourcing moves
    Export controls on indium phosphide (InP) risk prolonging supply strains in the compound semiconductor market, GCS Holdings warned, affecting optical and RF component makers worldwide...
    Tuesday 5 May 2026
    DDR6 server memory moves into early development as industry prepares for next-generation AI demand
    The development of next-generation server memory DDR6 is reportedly entering early hardware validation, as memory makers and supply chain partners begin pre-development work ahead...
    Monday 4 May 2026
    Win Semiconductors: GaAs and InP supply still meets production demand
    Rising raw material prices have pushed up gallium arsenide (GaAs) substrate costs, squeezing a key material used in power amplifiers (PA). Win Semiconductors said that its scale gives...
    Monday 4 May 2026
    AI chip demand ignites embedded substrate race among Samsung, Ibiden, Unimicron
    Samsung Electro-Mechanics (Semco) has moved early to commercialize embedded semiconductor substrates, but the window is rapidly closing as Japan's Ibiden and Taiwan's Unimicron prepare...
    Wednesday 29 April 2026
    Memory test capacity stays high as substrate prices may rise in 2Q26
    The memory industry cycle is on the upswing, driven by strong customer orders, rising OSAT prices, and high capacity utilization rates. Memory OSAT companies reported a surprisingly...
    Thursday 23 April 2026
    LandMark sees profit soar 650% in 1Q26, secures deal for 5-year InP substrate supply
    Driven by strong artificial intelligence (AI) and silicon photonics (SiPh) demand, optical communications epitaxy manufacturer LandMark Optoelectronics reported a more than sixfold...
    Wednesday 15 April 2026
    Tong Hsing Electronic expects revenue acceleration as fiber optics drives expansion
    Tong Hsing Electronic, a Taiwanese semiconductor packaging and substrate manufacturer specializing in CMOS image sensors, said on Monday that optical communication modules have become...
    Tuesday 14 April 2026
    Samsung Electro-Mechanics reportedly to expand AI packaging with MLCC embedded substrate line in Vietnam
    As AI chips demand higher performance and denser integration, advanced packaging and substrate technologies have become critical in the semiconductor race. Samsung Electro-Mechanics...
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    BIZ FOCUS
    Feb 9, 08:00
    iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
    Friday 6 February 2026
    2026 Market Outlook: Key Opportunities & Risks to Watch
    Thursday 5 February 2026
    Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
    Wednesday 4 February 2026
    Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
    biz
    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook