ABF substrates have seen robust demand for processing 5G networking chips and high-performance computing chips since the start of 2019, but shipments of BT substrates for mobile chips...

The output value of Japan's PCB industry dropped 6.9% from a year earlier to JPY219.79 billion (US$2.06 billion) in the first half of 2019, with that of the flexible PCB sector experiencing...

Chip-on-film (COF) substrate supplier JMC Electronics has enjoyed robust demand for semi-additive tape COF packaging services, boasting clear order visibility through the first half...

PCB and IC substrate supplier Unimicron Technology has set aside a capex of approximately NT$16.2 billion (US$514.5 million) for 2020, up from NT$9.2 billion for 2019, to strengthen...

Among Taiwan IC substrates makers, Unimicron and Na Ya PCB are expected to benefit the most from AMD release of its EPYC Rome 7002 server CPU adopting TSMC 7nm node and supporting...

IC substrate suppliers are moving to allocate part of their substrate-like PCBs (SLP) capacity to support production of ABF substrates that see robust demand, according to industry...

Rigid-flexible PCB maker Dynamic Electronics has dismissed a recent Chinese-language report indicating the company plans to sell its factory site in Taiwan to a fellow Taiwan-based...

Taiwan-based backend houses and COF substrate suppliers will see orders from Huawei pick up in July or August, according to industry sources.

Clear order visibility for diverse IC packaging materials is seen through the end of the third quarter of the year thanks mainly to increasingly robust demand from OSAT (outsourced...

Taiwan's handset TDDI IC supply chain for Huawei, including designers, backend COF service providers and substrate suppliers, have turned guardedly optimistic about their business...

The ever-growing demand for high-performance computing (HPC) chips to support 5G and AI applications is ushering in a long-missed market recovery for ABF substrates needed for high-end...

Chip-on-film (COF) substrate suppliers JMC Electronics is expected to see its revenue and profit climb to record-high levels in the second quarter of 2019, driven mainly by a rally...

Tong Hsing Electronic Industries, which provides ceramic substrates and niche-IC backend services, has elected its new board of directors with Yageo chairman Pierre Chen becoming...

Chang Wah Technology (CWTC) continues to enhance its pre-mold quad flat no-lead (QFN) leadframe offerings, and has developed pre-mold metal substrate (PMMS) technology for the emerging...

Unimicron Technology is scheduled to break ground for a new plant in Taoyuan, northern Taiwan in July followed by equipment move-in a year later. The new facility is designed for...

Taiwan-based JMC Electronics, which uses both subtrative and semi-additive processes to manufacture chip-on-film (COF) substrates, has strength to better compete with its larger international...

Chip-on-film (COF) substrate suppliers JMC Electronics expects to post flat growth or a slight decrease sequentially in third-quarter revenues, due to a cutback in orders in the wake...

China's Shennan Circuit has managed to generate profits from its IC substrate business, and has expanded its IC substrate offerings to include those for handset-use application processors...

CCL firm Elite Materials (EMC) has expressed optimism about its revenue and profit performance in 2019, driven mainly by rising product ASPs.

Unimicron Technology and Kinsus Interconnect Technology both have plans to expand additional new capacities for ABF (ajinomoto build-up film) substrates judging from robust demand...

Suppliers engaged in the supply chain for chip-on-film (COF) packaging remain optimistic about demand coming from the smartphone sector, citing the rising popularity of bezel-less...

The supply of ajinomoto build-up film (ABF) substrates has been tight, and will continue to fall short of demand in the second half of 2019, according to industry sources.

PCB and IC substrate maker Nanya Printed Circuit Board saw its net loss improve to NT$278 million (US$8.9 million) in the first quarter from loss of NT$677.9 million during the same...

Unimicron Technology has disclosed plans to invest a total of NT$20 billion (US$644.7 million) in R&D and expanding production capacity for advanced flip-chip (FC) substrates...

Huawei has demanded more supplies from Taiwan-based chip-on-film (COF) substrate manufacturers including JMC Electronics and Chipbond Technology (formerly Simpal Electronics), and...