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NEWS TAGGED SUBSTRATE
Saturday 10 October 2026
Semco moves glass substrates to package-level testing
Samsung Electro-Mechanics (Semco) has reportedly completed initial reliability testing of its 100mm glass substrates and moved to package-level verification using customer chips, marking...
Saturday 10 October 2026
JNTC bets US$259 million on glass substrates ahead of 2028 ramp
South Korea's JNTC plans to invest KRW347 billion (approx. US$259 million) in glass substrate manufacturing as it reports a sharp reduction in copper-filling time for thick glass cores,...
Thursday 8 October 2026
Hanmi wins rare Samsung order amid US$5 billion chip substrate expansion
South Korea's Hanmi Semiconductor has secured a KRW24.48 billion (approx. US$18.3 million) equipment order from Samsung Electro-Mechanics, a rare deal with a Samsung Group affiliate...
Tuesday 6 October 2026
Samsung secures customer backing for US$5B substrate expansion
Samsung Electro-Mechanics is investing KRW6.78 trillion (approx. US$5 billion) to expand FCBGA capacity in South Korea and Vietnam. The projects are backed by customer funding and...
Tuesday 6 October 2026
3.2T optical upgrade triggers PCB redesign, shrinking supplier pool to 3
As AI computing clusters continue to expand, performance requirements for scale-out interconnects between racks are rising rapidly. This is pushing traditional pluggable optical transceivers...
Monday 5 October 2026
AMD's Lisa Su back in Taiwan as AI capacity crunch spreads beyond TSMC
AMD CEO Lisa Su arrived in Taiwan on October 5 for a lightning visit, less than five months after her May trip. No major public events are scheduled, but meetings with key suppliers...
Monday 5 October 2026
Cheap SiC substrates ignite demand wave, reshape ecosystem
Prices for low-cost 6-inch silicon carbide (SiC) substrates, after years of capacity expansion and brutal price wars, are now showing clear signs of bottoming out in the second half...
Thursday 1 October 2026
BOE eyes closer ties with Samsung, LG as it pushes into chip packaging
China's BOE Technology is seeking closer ties with Samsung Electronics and LG Electronics as the display maker expands beyond panels into semiconductor glass substrates and advanced...
Thursday 1 October 2026
Machvision's dual-track strategy enters early growth as semiconductor, substrate visibility reaches 3 years
Machvision said its "dual-track, four-line" strategy has entered an early growth phase as demand for AI servers, high-speed transmission, and advanced packaging continues to rise....
Thursday 1 October 2026
Unimicron expands ABF substrate capacity with NT$10B Hukou land deal
Unimicron has moved again to ease tight ABF substrate supply, buying a Hukou site from Bridgestone Taiwan for more than NT$10 billion (US$313.65 million). The deal highlights how AI...
Wednesday 30 September 2026
Broadcom-Toppan venture opens Singapore's first high-end FC-BGA substrate plant
Advanced Substrate Technologies (AST), a joint venture between Japan's Toppan Holdings and Broadcom, officially opened a manufacturing facility in Singapore on September 29, 2026,...
Tuesday 29 September 2026
Samsung Electro-Mechanics to invest US$5 billion in ABF substrate expansion
Samsung Electro-Mechanics said it will invest KRW6.78 trillion (about US$5 billion) in South Korea and Vietnam to expand ABF substrate production for AI servers and high-performance...
Tuesday 22 September 2026
Daeduck nears long-term supply deals as Doosan expands capacity amid tight T-glass supply
South Korea's PCB and semiconductor substrate supply chain is expanding capacity as demand from servers and data centers rises, with customers moving to secure long-term supply while...
Monday 21 September 2026
Leading Interconnect Semiconductor starts Shenzhen advanced packaging substrate plant

Leading Interconnect Semiconductor, a Zhen Ding Technology subsidiary, has broken ground on an AI advanced packaging substrate project...