TSMC announced at the Open Innovation Platform (OIP) Ecosystem Forum in Europe that its CoWoS packaging technology will achieve certification by 2027, introducing a version with 9x...
The rise of artificial intelligence (AI) and the new energy / autonomous vehicle industry presents both challenges and exciting opportunities for the printed circuit board (PCB) and...
The U.S. government announced plans to invest up to $300 million in three advanced semiconductor packaging research projects located in Georgia, California, and Arizona. These projects...
UK-based epitaxial wafer and substrate provider IQE has reported that the overall market recovery is weaker than anticipated. As a result, the company expects its revenue for 2024...
Samsung Display (SDC) plans to accelerate the production of its 8.6G OLED panels for IT applications, which will first be utilized in Samsung Electronics' notebook products.
With SiC production capacity rising in China, prices have fallen dramatically, potentially leading to a restructuring of China's SiC industry and prompting Taiwan-based players to...
The second half of the year is typically a peak season for substrates. Despite market volatility, strong demand for AI continues to drive the global integrated circuit (IC) substrate...
Thanks to the AI tsunami, demand for AI chips from all sectors is continuing to surge. The Chip-on-Wafer-on-Substrate (CoWoS) architecture that dominates existing 2.5D and 3D packaging...
As global semiconductor firms invest in compound semiconductors, Japan-based companies are stepping up their efforts on gallium nitride (GaN) to expand its applications beyond electric...
Silicon carbide (SiC) once thrived amid substrate shortages. However, 2024 saw a significant shift where Chinese manufacturers dramatically ramp up production, resulting in a collapse...
Shin-Etsu Chemical announced its entry into the semiconductor manufacturing equipment market with new technology designed to eliminate the need for interposers. This innovation could...
The global advanced IC substrate market is poised for significant growth, according to recent industry reports. Global Information, Inc. (GII) projects the market to reach US$18.11...
As advanced packaging technologies and large-size integrated substrate solutions become key development areas for technology firms, glass substrate technology has emerged as a focal...
LG Innotek's equipment investments have significantly decreased in 2024, following two years of substantial investments to meet Apple's needs. The company has now achieved sufficient...
Niching Industrial, a Taiwan-based semiconductor materials and components distributor, has experienced a significant resurgence in orders for its three primary product lines –...
