News tagged substrate at DIGITIMES

NEWS TAGGED SUBSTRATE

Wednesday 30 September 2026

Broadcom-Toppan venture opens Singapore's first high-end FC-BGA substrate plant

Advanced Substrate Technologies (AST), a joint venture between Japan's Toppan Holdings and Broadcom, officially opened a manufacturing facility in Singapore on September 29, 2026,...

Tuesday 29 September 2026

Samsung Electro-Mechanics to invest US$5 billion in ABF substrate expansion

Samsung Electro-Mechanics said it will invest KRW6.78 trillion (about US$5 billion) in South Korea and Vietnam to expand ABF substrate production for AI servers and high-performance...

Tuesday 22 September 2026

Daeduck nears long-term supply deals as Doosan expands capacity amid tight T-glass supply

South Korea's PCB and semiconductor substrate supply chain is expanding capacity as demand from servers and data centers rises, with customers moving to secure long-term supply while...

Monday 21 September 2026

Leading Interconnect Semiconductor starts Shenzhen advanced packaging substrate plant

Leading Interconnect Semiconductor, a Zhen Ding Technology subsidiary, has broken ground on an AI advanced packaging substrate project...

Monday 21 September 2026

ByteDance's China AI chip push hits substrate shortage

China's fast-rising AI models are running into a compute supply bottleneck as demand for advanced packaging substrates surges, with...

Monday 21 September 2026

DIGITIMES Insight: AI chip upgrades shift substrate supply bottleneck from upstream materials to equipment

DIGITIMES Intelligence has observed that as the performance of AI accelerators and server CPUs continues to advance, chips are increasing not only in compute core counts and...

Friday 18 September 2026

Resonac grows 300mm SiC crystal, marking a substrate milestone

Resonac has grown and processed a 300mm silicon carbide (SiC) single crystal. This development could shape the future of power electronics used worldwide in electric vehicles, renewable...

Thursday 17 September 2026

Google reportedly weighs CoWoS backup for 2027 TPU as EMIB-T substrate yields lag

Google's Humufish TPU project, scheduled to enter mass production by the end of 2027, is set to adopt Intel's EMIB-T advanced packaging technology with support from ASIC partner MediaTek...

Thursday 17 September 2026

DIGITIMES Insight: SiC substrate capacity expansion continued; 6-inch substrate prices expected to rebound in 2027

DIGITIMES has observed that demand for silicon carbide (SiC) power devices has climbed rapidly in recent years as the EV market expands, triggering a massive wave of capacity expansion...

Wednesday 16 September 2026

Samsung and Qualcomm jointly developing organic bridges for 2.1D packaging

Samsung Electro-Mechanics and Qualcomm are working together to develop an organic bridge for 2.1D packaging architectures. The partnership takes place as AI chips grow larger, denser,...

Wednesday 16 September 2026

Glass substrates, TGV set to reshape 2027 advanced packaging race

As AI chip package sizes continue to expand, advanced packaging is moving up the technology ladder. Glass substrate and through-glass via (TGV) technologies have become a new competitive...

Tuesday 15 September 2026

AI server tracker: CCL makers outpace PCB and substrate suppliers as server demand grows

Taiwan's copper-clad laminate (CCL) makers significantly outpaced printed circuit board (PCB) and IC substrate suppliers in August, as stronger server demand, pricing and product-mix...

Tuesday 15 September 2026

SiPh shifts optical module bottleneck upstream: from device manufacturing to laser-grade substrate supply

The market value of optical modules used in data centers is projected to grow from US$12.6 billion in 2025 to US$45.4 billion by 2030...

Tuesday 15 September 2026

Phoenix Pioneer Technology AI power substrate order visibility extends to 1Q27

IC substrate manufacturer Phoenix Pioneer Technology (PPt) turned profitable in the first half of 2026, driven by strong momentum in...

Tuesday 15 September 2026

Exclusive: China's 8-inch SiC suppliers turn to pricing discipline after 6-inch price war

As the silicon carbide (SiC) industry shifts from 6-inch to 8-inch wafer manufacturing, leading China-based substrate suppliers are...

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