Ajinomoto raised its full-year forecast on August 6 as growing demand for AI servers and high-performance computing lifted sales of...
Daeduck Electronics plans to invest KRW497 billion(US$349.50 million) in semiconductor production facilities through 2027, its second...
Aurona said shipments of ABF substrate pads and CCL-related packaging materials both rose, extending its growth momentum in the second...
MediaTek said at its latest earnings call that its second-generation data-center ASIC product remains on schedule for mass production...
TSMC is reportedly developing a new advanced chip-packaging technology modeled on Intel's Embedded Multi-die Interconnect Bridge (EMIB),...
Samsung Electro-Mechanics (Semco) is broadening its collaboration with South Korean materials supplier SoulBrain beyond glass substrate...
Advanced Chip and Circuit Materials (ACCM) today introduced Celeritas SMC (Silicon-Matched Core), a production-ready core for advanced IC substrates engineered to match...
Introduction
