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    China's optical supply chain gains ground in smart glasses
    7h 27min ago
    Exclusive: China's CAS microelectronics institute unveils DUV-based 3nm GAA development path
    7h 27min ago
    Samsung expands SRAM and IP support as memory shortages reshape chip design
    7h 27min ago
    AMD shifts China strategy from chips to developer ecosystems as Nvidia retreats
    7h 27min ago
    SK Hynix passes new performance bonus plan with cash and stock split evenly
    7h 27min ago
    NEWS TAGGED SUBSTRATE
    Thursday 17 September 2026
    DIGITIMES Insight: SiC substrate capacity expansion continued; 6-inch substrate prices expected to rebound in 2027
    DIGITIMES has observed that demand for silicon carbide (SiC) power devices has climbed rapidly in recent years as the EV market expands, triggering a massive wave of capacity expansion...
    Wednesday 16 September 2026
    Samsung and Qualcomm jointly developing organic bridges for 2.1D packaging
    Samsung Electro-Mechanics and Qualcomm are working together to develop an organic bridge for 2.1D packaging architectures. The partnership takes place as AI chips grow larger, denser,...
    Wednesday 16 September 2026
    Glass substrates, TGV set to reshape 2027 advanced packaging race
    As AI chip package sizes continue to expand, advanced packaging is moving up the technology ladder. Glass substrate and through-glass via (TGV) technologies have become a new competitive...
    Tuesday 15 September 2026
    AI server tracker: CCL makers outpace PCB and substrate suppliers as server demand grows
    Taiwan's copper-clad laminate (CCL) makers significantly outpaced printed circuit board (PCB) and IC substrate suppliers in August, as stronger server demand, pricing and product-mix...
    Tuesday 15 September 2026
    SiPh shifts optical module bottleneck upstream: from device manufacturing to laser-grade substrate supply

    The market value of optical modules used in data centers is projected to grow from US$12.6 billion in 2025 to US$45.4 billion by 2030...

    Tuesday 15 September 2026
    Phoenix Pioneer Technology AI power substrate order visibility extends to 1Q27

    IC substrate manufacturer Phoenix Pioneer Technology (PPt) turned profitable in the first half of 2026, driven by strong momentum in...

    Tuesday 15 September 2026
    Exclusive: China's 8-inch SiC suppliers turn to pricing discipline after 6-inch price war

    As the silicon carbide (SiC) industry shifts from 6-inch to 8-inch wafer manufacturing, leading China-based substrate suppliers are...

    Monday 14 September 2026
    DIGITIMES Insight: Taiwanese firms lead in FOPLP as overseas rivals race to catch up
    Taiwanese chip packaging firms are advancing fan-out panel-level packaging (FOPLP) and glass-substrate development as AI processors demand ever-larger reticle sizes and more complex...
    Saturday 12 September 2026
    Murata targets mass production of its AI power substrate next year
    Murata Manufacturing plans to begin mass production next year of iPaS, the power substrate it has spent several years developing for AI chips, a step that would carry the world's largest...
    Friday 11 September 2026
    Samsung Electro-Mechanics, LG Innotek vie in AI package substrates
    At South Korea's recent KPCA Show 2026, Samsung Electro-Mechanics and LG Innotek showcased their next-generation package substrate technologies. As AI semiconductors evolve toward...
    Thursday 10 September 2026
    Nanoprinting lithography shifts from round to square, increasing waveguide output
    Nanoimprint technology is shifting from round to square substrates. Qingdao GermanLitho noted that this transition has become vital for volume manufacturing as the industry demands...
    Thursday 10 September 2026
    AUO matching glass substrate size stokes TSMC collab speculation
    AUO is accelerating its transformation by extending its established large-format panel manufacturing capabilities into advanced semiconductor packaging.
    Thursday 10 September 2026
    Nvidia reportedly drives testing interface capacity crunch, pushes Taiwan suppliers
    AI chip demand is tightening high-end testing interface capacity, and supply-chain sources say Nvidia has raised prices to secure most of the probe card and test socket output from...
    Wednesday 9 September 2026
    LG Innotek tackles glass substrate microcrack issue as 2028 production race heats up

    LG Innotek is applying internally developed artificial intelligence to semiconductor glass substrate manufacturing, targeting microcracks,...

    Friday 4 September 2026
    Taisic unveils p-type SiC substrate for ultra-high-voltage grid, rail applications
    Taisic Materials, a compound semiconductor company under the Kenmec Group, unveiled a p-type silicon carbide (SiC) substrate on September 2, targeting ultra-high-voltage power applications,...
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    GlobalExhibition
    BIZ FOCUS
    Sep 14, 08:00
    Hauman Unveils Micro LED Testing Breakthrough for AI Optical Interconnects
    Monday 14 September 2026
    Scaling Photonics: Assembly, Test and Fiber Automation at SEMICON Taiwan
    Friday 11 September 2026
    Toward Technologies Redefines Relay Solutions at SEMICON Taiwan 2026
    Friday 11 September 2026
    DAS Expands in Taiwan and Unveils World First at SEMICON
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