Samsung Electro-Mechanics is in final-stage talks to supply multilayer ceramic capacitors (MLCCs) to a major US cloud provider for...

China's silicon carbide (SiC) supply chain is finding a new growth engine as AI strains data-center power systems, extending a market...

Technology giants are continuing to expand AI computing infrastructure, driving demand for high-performance optical interconnect components...

The race to commercialize glass core substrates in advanced semiconductor packaging is heating up — but the technology is moving...

China began approving a new batch of indium phosphide (InP) substrate exports in late May 2026, but optical communications supply chain...

TSMC is accelerating its advanced packaging roadmap for AI chips, expanding CoWoS capacity while publicly disclosing new progress in...

China has recently eased controls on some indium phosphide (InP) substrates, relieving a bottleneck in optical communications capacity...

China has allowed the release of a fresh supply of indium phosphide (InP) substrates, which are under export controls. A first 2026...

LG Innotek plans to invest more than KRW1 trillion in a new semiconductor substrate plant in Haiphong, Vietnam, reflecting rising demand...

China's export controls on the key semiconductor material indium phosphide (InP), imposed since February 2025, are threatening global...