South Korea's export momentum stayed robust in September on the back of continued demand for semiconductors, keeping the outlook upbeat for economic growth and offering positive signs...
The next technologies tasked with breaking through the bottleneck of Moore's Law will be silicon photonics (SiPh) and co-packaged optics (CPO). Additionally, TSMC has resumed its...
TSMC is advancing system-level innovation by improving the 3D IC design ecosystem through enhanced collaboration with foundries, customers, and partners, according to a recent blog...
Once the undisputed leader in the semiconductor industry, Intel is now facing a monumental struggle for survival. The company's fall from grace has been marked by missteps in strategy,...
The Chinese government is reportedly intensifying efforts to discourage domestic companies from buying Nvidia AI processors, aiming to boost local suppliers like Huawei. According...
Fujifilm plans to strengthen its semiconductor materials capabilities with an investment of JPY 20 billion (US$ 140 million) to build facilities in Shizuoka and Oita, focusing on...
Global spending on 300mm fab equipment is expected to reach a record US$400 billion from 2025 to 2027, according to SEMI. The robust spending is being driven by the regionalization...
Business opportunities for peripheral chips can only advance further when AI servers become more popularized. The industry believes that the first wave of growth may occur in 2025.
Presently, the enhancement of AI chips' computing power heavily depends on advanced packaging technologies such as CoWoS and HBM, with the two technologies complementing each other...
According to Bloomberg, Tokyo Electron plans to recruit and train local engineers in India to support the country's growing semiconductor industry. This initiative aligns...
Following recent geopolitical tensions, concerns regarding the supply chain security of technology products have intensified globally. The United States has expressed intentions to...
SK Hynix is expediting the development of 16-layer HBM3E (High Bandwidth Memory) to reinforce its leading position in the competitive HBM market, as challenges from rivals like Samsung...
Samsung Electronics has reportedly delayed construction and equipment orders for its Pyeongtaek Phase 4 (P4) plant in South Korea and its second facility (T2) in Taylor, Texas. This...
Beijing is stepping up pressure on Chinese companies to buy locally produced artificial intelligence chips instead of Nvidia Corp. products, part of the nation's effort to expand...
