Despite the imminent release of new models, such as the iPhone, Taiwan-based III-V compound semiconductor companies continue to identify flat client shipment pull-ins.
Chang Wah Electromaterials (CWE), a Taiwanese supplier of semiconductor and electronics materials and equipment, is transitioning from 12-inch wafer-level packaging to panel-level...
Samsung Electronics has implemented the Overall Performance Incentive (OPI) reward system for over 20 years. In response to employee demands and to retain talent, the company is reportedly...
Melexis, a Belgium-based microelectronics solutions provider, recently announced the opening of its largest wafer testing plant in Kuching, Sarawak, East Malaysia.
Chunghwa Precision Test (CHPT), a leading probe card manufacturer, anticipates strong performance in the second half of 2024, with growth driven by increasing demand for high-performance...
Pure-play foundry United Microelectronics (UMC) expects to post a mid-single-digit sequential increase in wafer shipments with about flat growth in ASPs in the third quarter of 2024,...
Taiwan's top-3 pure-play foundries -- TSMC, United Microelectronics (UMC), and Vanguard Semiconductor International (VIS) – are outperforming their global competitors, achieving...
ACM Research has introduced its Ultra C vac-p flux cleaning equipment, specifically designed for fan-out panel-level packaging (FOPLP). This new tool employs vacuum technology to...
Japan-based Orbray plans to go public by 2029, aiming to raise up to JPY 10 billion. The company intends to strengthen production at its Akita factories and targets JPY 40 billion...
The Biden Administration has announced that the CHIPS and Science Act will subsidize US$400 million to help Amkor, the largest semiconductor packaging and testing company in the US,...
Samsung Electronics announced its financial results for the second quarter of 2024, reporting revenue of KRW74.07 trillion (approximately US$53.3 billion) and an operating profit...
Backend house Powertech Technology (PTI), with its fan-out panel-level packaging (FOPLP) technology, is targeting AI SoC market potential, and expects AI-related revenue to account...
Win Semiconductors (WinSemi) expects to post a single-digit sequential revenue decrease in the third quarter of 2024, due to slowing demand from China's Android smartphone market.