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14 news items tagged wirebond

  • STATS ChipPAC has announced plans to expand its semiconductor assembly and test operation in South Korea. The Singapore-based backend house added that it has signed a non-binding...
  • Demand for copper wirebonding machines from IC backend service companies is expected to decline 50% in the fourth quarter of 2012 as compared to purchases in the third quarter, according...
  • The production value of Taiwan's copper wirebonding segment is expected to rise along with demand over the next three years, according to sources at equipment suppliers.
  • STATS ChipPAC has shipped over 300 million semiconductor packages with copper wirebond interconnect, according to the company. Its previous milestone with shipments of more than 100...
  • With more fabless IC firms adopting copper wire to package their products for cost reasons, packaging and testing house Siliconware Precision Industries (SPIL) has seen a substantial...
  • Advanced Semiconductor Engineering (ASE) is slowing down the expansion of its copper wirebonding capacity due to low market visibility, according to a Chinese-language Economic...
  • SPIL enters LED packaging market

    Tuesday 14 September 2010
    Siliconware Precision Industries (SPIL) has entered the LED packaging business and started LED shipments through wirebonding packaging technology to three US-based clients. It is...
  • ASE raises 2010 capex

    Tuesday 15 June 2010
    Advanced Semiconductor Engineering (ASE) has decided to boost its 2010 capex to US$600-700 million from US$450-500 million it earlier planned, said company COO Tien Wu at a recent...
  • Chip packaging and testing company Advanced Semiconductor Engineering (ASE) expects shipments to grow by 11-13% sequentially in the second quarter of 2010, driven particularly by...
  • Advanced Semiconductor Engineering (ASE) plans to add an additional 2,000 copper wirebonders by the end of 2010, while Siliconware Precision Industries (SPIL) will add 200-300 copper...
  • ASE and SPIL deny headhunting rumors

    Friday 16 October 2009
    Taiwan-based chip packaging houses Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have both come out to deny a Citi Investment Research report...
  • SPIL 2Q09 sales up more than 50%

    Wednesday 8 July 2009
    Siliconware Precision Industries (SPIL) has announced unaudited revenues for second-quarter 2009 grew 53.6% sequentially to NT$14.14 billion (US$431.24 million), beating market watchers'...
  • ASE, SPIL optimistic about 3Q09

    Tuesday 2 June 2009
    Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industry (SPIL) have fully utilized all wire bonders, with the former using 60-70% and the latter 70-80% of their...
  • Having already identified flip-chip (FC) substrates as a key sales driver in 2008, Nan Ya Printed Circuit Board (NPC) plans to relocate its low-margin production to China in order...
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