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NEWS TAGGED SEMICONDUCTOR EQUIPMENT
Tuesday 20 March 2012
Japan February 2012 chip-gear orders down 5.7%, says SEAJ
Japan-based manufacturers of semiconductor equipment posted JPY99.8 billion (US$1.2 billion) in orders in February 2012 (three-month average basis), down 5.7% from a year earlier,...
Friday 16 March 2012
ASML unseats Applied in semiconductor equipment ranking, says VLSI
VLSI Research has released its 2011 top semiconductor equipment suppliers ranking. During the year, Advantest closed its acquisition of Verigy in July and Applied Materials acquired...
Monday 12 March 2012
Fab equipment spending poised to hit record in 2013, says SEMI
Semiconductor fab equipment spending will remain flat at US$38.85 billion in 2012, but climb to a record US$45.5 billion in 2013, according to estimates made by SEMI.
Friday 9 March 2012
Topco sees February revenues up on month, down on year
Topco Scientific, which distributes semiconductor materials and equipment, reported February revenues of NT$1.03 billion (US$35 million), up 7.49% on month but down 7.63% on year...
Friday 24 February 2012
North America fab tool book-to-bill up in January 2012, says SEMI
North American-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.95 for January 2012, up from 0.85 in the prior month and scoring the highest since May...
Monday 20 February 2012
Japan chip gear book-to-bill ratio at 1.06 in January 2012, says SEAJ
Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.06 in January 2012, down from 1.20 in December but up from 0.99 a year earlier, according to...
Monday 20 February 2012
KLA-Tencor shipping next-node wafer inspection tools
Fab-tool vendor KLA-Tencor has announced the availability of its latest wafer defect inspection systems, and is shipping the products to its clients in the foundry, logic and memory...
Monday 30 January 2012
SEMI book-to-bill ratio grows three months in a row
North American-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.88 for December 2011, up for the third consecutive month, according to SEMI. A book-to-bill...
Tuesday 20 December 2011
Japan fab tool book-to-bill nears 1.0, says SEAJ
Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.97 for November 2011, up from 0.83 in October, according to new figures from the Semiconductor...
Friday 16 December 2011
Chip equipment spending to decline following two years of growth, says Gartner
Worldwide semiconductor capital equipment spending is expected to total US$51.7 billion in 2012, a 19.5% decline from projected 2011 spending of US$64.2 billion, according to Gartn...
Friday 16 December 2011
North America November chip-gear orders up 5%, says SEMI
North America-based manufacturers of semiconductor equipment posted US$973.3 million in orders in November 2011 (three-month average basis), up 5% from the revised level of US$926.8...
Monday 21 November 2011
Japan chip gear book-to-bill ratio rises in October, says SEAJ
Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.83 for October 2011, up from 0.75 in September, according to new figures from the Semiconductor...
Friday 18 November 2011
North America October chip-gear orders up 1%, says SEMI
North America-based manufacturers of semiconductor equipment posted US$939.4 million in orders in October 2011 (on a three-month average basis), up 1.4% from the revised September...
Tuesday 15 November 2011
Chip equipment makers conservative about 4Q11 business
Taiwan-based semiconductor equipment suppliers generally hold a conservative business outlook for the fourth quarter of 2011, citing seasonal effects as well as macroeconomic uncertainties...
Monday 14 November 2011
Applied Materials completes Varian takeover
Applied Materials has completed its acquisition of Varian Semiconductor Equipment Associates. This takeover enhances Applied's portfolio with ion implantation technology, a market...