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NEWS TAGGED CHIPMOS
Friday 23 December 2022
Memory backend firms glad to see chipmakers cut back output
With Micron Technology cutting capex and scaling back output amid a gloomy outlook for its operations, other memory chipmakers are expected to follow suit. Such developments are welcomed...
Monday 19 December 2022
Blacklisted YMTC sees bumpy road ahead for 232-layer NAND mass production
China's largest memory maker Yangtz Memory Technologies (YMTC) will be deterred from entering mass production of its 232-layer 3D NAND flash and developing more advanced chips after...
Friday 4 November 2022
OSAT, suppliers cutting prices for DDIs to raise utilization
Taiwan's OSAT services providers and packaging materials suppliers are offering "more flexible" quotes for display driver ICs (DDIs) in a bid to raise their utilization rates, according...
Friday 4 November 2022
Memory backend service companies cautious with 2023 capex
Taiwan-based memory backend service companies have become more cautious with their capex for 2023 as memory demand has decelerated since the third quarter of 2022, according to industry...
Thursday 3 November 2022
DDI backend firms see warehouses filled with 'wafer bank'
Display driver IC (DDI) backend specialists are finding their warehouses filled with "wafer bank" inventories from fabless chipmaker customers that are keeping their inventory at...
Friday 7 October 2022
Memory chips to see demand recover faster than logic ICs
Memory makers such as Micron Technology and Kioxia are expected to see their business operations undermined by sharp declines in end-market demand for consumer electronics devices...
Tuesday 23 August 2022
Tape COF substrate makers conservative about 2H22 prospects
Taiwan's tape COF substrate suppliers JMC Electronics and Chipbond Technology are highly conservative about their business prospects for the second half of 2022 due mainly to sluggish...
Friday 15 July 2022
ChipMOS steps up investment in Taiwan
Taiwan's Ministry of Economic Affairs (MOEA) has received an application submitted by ChipMOS Technologies to invest a total of NT$12.5 billion (US$416.7 million) in the backend house's...
Tuesday 12 July 2022
Backend firms see slowdown in orders for OLED DDI
Taiwan-based backend firms have seen capacity utilization rates for OLED display driver IC (DDI) testing slip recently, according to industry sources, noting that inventory adjustments...
Wednesday 22 June 2022
Second-tier OSATs see uncertainty in order visibility for 2H22
Unlike ASE Technology and other first-tier OSATs who still see robust order momentum from their IDM customers, smaller-size players including Greatek Electronics, Lingsen Precision...
Tuesday 14 June 2022
Tape COF substrates in sluggish demand for large-size DDIs
Sluggish sales of large-size panels and continuous uncertainties in TV terminal demand have continued to erode shipments of large-size display driver ICs (DDI), resulting in revenue...
Friday 6 May 2022
Taiwan DDI backend firms remain optimistic about 2Q22
Taiwan-based display driver IC (DDI) backend specialists ChipMOS Technologies and Chipbond Technology remain upbeat about their business prospects in the second quarter of 2022, despite...
Wednesday 6 April 2022
OSATs to face uphill battle to bolster capacity utilization in 2H22
Taiwan's OSATs will find it a major task for them to prevent their capacity utilization rates from falling in the second half of 2022 though they are poised to experience steady business...
Friday 1 April 2022
ChipMOS, Chipbond to boost OLED DDI testing capacity by 15%
Taiwan-based display driver IC backend specialists including Chipbond Technology and ChipMOS Technologies plan to procure additional high-end testing equipment, mainly from Japan's...
Friday 18 March 2022
Backend demand for TV SoCs, large-size DDIs may rebound in 2H22
TV SoC and large-size display driver IC (DDI) packaging demand will have a chance to rebound in the second half of 2022, as the FIFA World Cup 2022 slated for November 21-December...