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NEWS TAGGED CHIPMOS
Friday 23 April 2010
ChipMOS reports 1Q10 revenues up on quarter, meets guidance
Packaging and testing service provider ChipMOS Technologies has announced consolidated revenues for the first quarter of 2010 grew 2.3% sequentially to NT$3.67 billion (US$115.7 million),...
Friday 2 April 2010
Prices for LCD driver IC backend services to rise in 2Q10
LCD driver IC packaging and testing house Chipbond Technology is integrating the different quotes offered by it and International Semiconductor Technology (IST) before their merger,...
Friday 19 March 2010
ChipMOS expects strong 1Q10
ChipMOS Technologies expects its revenues for the first quarter of 2010 to stay flat or increase by a single-digit percentage from the fourth quarter of 2009 thanks to increasing...
Friday 5 March 2010
TSMC, UMC wafer production in southern Taiwan affected by quake
Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics Corporation (UMC) have both disclosed the impact of a 6.4-magnitude earthquake that hit southern Taiwan...
Monday 1 March 2010
SPIL to drop out from LCD driver IC, DRAM segments; sell related equipment to ChipMOS
Siliconware Precision Industries (SPIL) has announced that it will take a 15.8% stake in ChipMOS Technologies in exchange for all of its of LCD driver IC packaging and testing equipment...
Tuesday 23 February 2010
ChipMOS likely to turn profitable in 1Q10
The sale of ChipMOS Technologies' accounts receivable from Spansion may allow the packaging and testing house to return to profits in the first quarter of 2010, according to industry...
Friday 15 January 2010
ChipMOS to sell Spansion debts to Citigroup
ChipMOS Technologies has announced it reached a definitive agreement with Citigroup, under which the memory packaging and testing company will sell the debts it holds in Spansion...
Thursday 31 December 2009
IC packaging and testing companies feeling relief after Tessera lost in lawsuit against DRAM makers
Taiwan-based IC packaging and testing companies, along with DRAM chip vendors, have felt a sense of relief after the US International Trade Commission (ITC) issued a final determination...
Thursday 24 December 2009
ChipMOS loses DRAM packaging patent lawsuit against Walton
Memory packaging and testing house Walton Advanced Engineering has prevailed in a lawsuit in Taiwan brought by rival ChipMOS Technologies pertaining to packaging technology used for...
Thursday 12 November 2009
ChipMOS expects 4Q09 revenues to stay flat or drop slightly on quarter
Packaging and testing house ChipMOS Technologies has said revenues for the fourth quarter of 2009 may remain flat or drop by single-digits compared to the third quarter. Demand for...
Monday 19 October 2009
ChipMOS 3Q09 revenues meet guidance despite 23% drop on year
Packaging and testing house ChipMOS Technologies saw consolidated revenues grow 14.1% sequentially to NT$3.35 billion (US$104.5 million) in the third quarter of 2009, and met the...
Monday 5 October 2009
ChipMOS raises 3Q09 revenue estimates
Packaging and testing house ChipMOS Technologies has announced it now expects revenues for the third quarter of 2009 to grow 13-15% sequentially, compared to its previous estimate...
Monday 24 August 2009
PTI buys Spansion facility in China
Memory packaging and testing service provider Powertech Technology (PTI) has announced it has acquired Spansion (Suzhou), the US-based NOR flash maker's packaging and testing facility...
Friday 21 August 2009
ChipMOS sees improved 2Q09 on sales from LCD business
ChipMOS Technologies has announced its net loss on a US GAAP basis narrowed to NT$1.21 billion (US$36.9 million) in the second quarter of 2009, compared to a loss of NT$1.98 billion...
Wednesday 22 July 2009
China IC firms more eager to develop patent portfolios, says CSIA
China-based Semiconductor Manufacturing International Corporation (SMIC) became the top recipient of wafer foundry patents approved by the China authorities in 2008, whereas Taiwan...