With COF (chip on film) package technology increasingly emerging as a mainstream packaging method for driver ICs for smartphone-use LCD and OLED panels, Taiwan players in the IC packaging...
ChipMOS Technologies (Shanghai), of which Tsinghua Unigroup is a major stakeholder, is expected to secure backend orders for 3D NAND flash chips developed by Yangtze River Storage...
Speculation has circulated in the industry that Taiwan-based Chipbond Technology plans to sell part of its stake in its China-based subsidiary Chipmore Technology to BOE Technology...
The market of large-size LCD panels have been improving recently. LCD driver IC packaging and testing firm Chipbond Technology has stated the possibility of a better second quarter...
Chipbond Technology has posted a filing with the Taiwan Stock Exchange (TSE) stating it has not issued revenues guidance for the first quarter of 2011.
Chipbond Technology will likely see revenues for the third quarter of 2010 remain flat on quarter, missing its guidance of 5-10% growth, according to market watchers. The driver-IC...
Packaging and testing house Chipbond Technology has reported better-than-expected revenue and profit results for the second quarter of 2010, reflecting strong market demand for LCD...
Chipbond Technology has revealed it is currently running at near full capacity for COF (chip-on-film) and COG (chip-on-glass), and utilization for bumping has risen to 85-90%. Customers...
LCD driver IC packaging house Chipbond Technology has announced net profits of NT$398 million (US$13 million) or NT$1.20 per share, for the first quarter of 2010, compared with losses...
LCD driver IC packaging house Chipbond Technology announced on April 1 the completion of its merger with International Semiconductor Technology (IST), with Chipbond being the surviving...
LCD driver IC packaging house International Semiconductor Technology (IST) has announced that its board of directors on December 25 approved a deal to merge with Chipbond Technology,...
Niching Industrial is expected to post sequential revenue growth of 10-15% sequentially in the third and fourth quarters of 2009, according to market watchers. The semiconductor material...
Gold bumping service provider, Chipbond Technology, which also offers COF/COG (chip-on-film/chip-on glass) turnkey services, has identified outsourcing of LCD driver-IC bumping and...
Renesas Technology is closing production lines and plans to release bump and chip on glass (COG) orders to Chipbond Technology, while NEC Electronics already started releasing chip...
Taiwan-based semiconductor material supplier Niching Industrial has begun small volume shipments of emboss spacers for chip on film (COF) tape winding. Japan-based Actech is currently...
