Malaysia is fast becoming a semiconductor hub in Southeast Asia, with efforts being devoted particularly to expanding its advanced packaging, IC design, and AI sectors.
China's BYD Co. rolled out its third electric vehicle in Japan as it tries to href="https://www.bloomberg.com/news/articles/2024-03-01/byd-bolsters-japan-push-with-revamped-evs-dealership-network"...
Tesla recently achieved a weekly production capacity of 1,300 Cybertrucks, but customers have not received their vehicles on schedule due to problems with their windshield wipers.
Electric Vehicle (EV) manufacturer VinFast is undeterred by the global slowdown in EV growth and the company's underperformance in the US market, as it continues its expansion in...
The global semiconductor manufacturing industry is anticipated to increase capacity by 6% in 2024 and 7% in 2025 to accommodate the unrelenting growth in chip demand.
Dixon Technologies, an India-based EMS giant, unveiled its Capex plan for the next three years. Besides production expansion in mobile phones and display modules, the company plans...
Despite a recent weakening in demand for LCD TV panels and a lack of upward momentum in prices, producing panels according to demand is expected to prevent significant price drops...
TAC optical film manufacturer TacBright Optronics held a shareholders' meeting on the 5th, successfully passing various proposals. TacBright pointed out that in 2024, with the larger...
Data center leasing is emerging as a promising opportunity amid the rising demand for AI. Subsidiaries of the Hon Hai Technology Group (Foxconn) are gearing up to build advanced data...
India has surpassed Japan and Australia, becoming Asia's second-largest data center hub after China. Data center capacities in the country are expected to nearly double in the next...
AMD has a close and solid relationship with TSMC on the 3nm technology, and the two companies are already working on several new product developments, according to Lisa Su, chairperson...
Nvidia is reportedly planning to adopt Fan-Out Panel Level Packaging (FOPLP) technology for its GB200 AI server chips ahead of schedule, aimed at addressing the tight production capacity...
