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Monday 20 July 2026
AI boom pushes PCB, passive component lead times into a new normal

The global wave of AI data center construction continues to accelerate, driving structural growth across the PCB and passive component...

Monday 20 July 2026
Merck ramps up AI semiconductor materials push as Level Up nears completion

AI is redrawing the rules of semiconductor competition, pushing materials suppliers beyond simple chemical inputs and toward integrated...

Monday 20 July 2026
Micron's 10-year deal with GlobalWafers signals tighter 12-inch supply

Rising demand for AI data centers and high-bandwidth memory (HBM) is pushing semiconductor competition further upstream into silicon...

Monday 20 July 2026
Huahsu expands capacity to tap AI and advanced packaging demand
Huahsu, a semiconductor materials supplier established in 1997 through a joint investment by Japan's Asahi Kasei and Wah Lee, has launched a new capacity expansion plan as demand for...
Saturday 18 July 2026
Dutch report frames Chinese interference in chips, ports and aerospace as a systemic threat
Chinese foreign interference in the Netherlands' strategic industries should be treated as a systemic, long-term threat rather than a series of isolated incidents, according to "Beyond...
Friday 17 July 2026
South Korean suppliers ramp up hybrid bonding R&D beyond HBM5
As high-bandwidth memory (HBM) stacks add more layers, requirements for chip-to-chip bonding accuracy and signal transmission efficiency are becoming more demanding.
Friday 17 July 2026
EU lags in critical raw materials as AI, EV and SDV demand rises
Europe's push for supply-chain security is lagging as AI, software-defined vehicles, and electric vehicles drive demand for critical minerals and local production. For readers worldwide,...
Thursday 16 July 2026
AI chips are running hotter — and Niching is betting its future on keeping them cool
As AI chips and HPC chips continue to draw more power, major advanced packaging orders at ASE, Powertech Technology, and Amkor remain strong, lifting demand for heat spreaders. Semi-conductor...
Thursday 16 July 2026
Commentary: CXMT IPO binds China's DRAM supply chain into one ecosystem

CXMT's STAR Market IPO has become more than a fundraising exercise. The strategic placement roster shows how China's largest DRAM maker...

Thursday 16 July 2026
Exclusive: Advanced packaging outpaces front-end growth while NPO paves way for commercial CPO
Generative AI is accelerating demand for computing power, memory and data bandwidth, shifting semiconductor innovation beyond front-end processes toward advanced packaging, silicon...
Thursday 16 July 2026
TPV Technology expects first-half loss as costs rise and global competition intensifies
TPV Technology said it expects to remain in the red in the first half of 2026, underscoring how higher materials costs, supply chain shifts, and intense price competition could continue...
Wednesday 15 July 2026
Nam Liong posts strong Q2 as high-value materials drive growth
Nam Liong Global Corporation reported consolidated revenue of NT$245 million (US$8.4 million) for June 2026, down 2.56% from the previous month but up 21.66% year over year, reflecting...
Tuesday 14 July 2026
Taiwan AI suppliers ride global demand as substrate, and CCL markets tighten
Taiwan's AI hardware supply chain remained strong in June, as substrate and CCL makers posted sharp annual gains driven by demand for AI servers, ASICs, and high-performance computing...
Tuesday 14 July 2026
China launches first 8-inch 2D chip line to bypass EUV limits

Shanghai AtomIC Technology has launched what it describes as the world's first 8-inch pilot line for two-dimensional semiconductors, marking...

Monday 13 July 2026
Trans-Sun Materials posts record revenue on AI server and HPC demand

Trans-Sun Materials Technology posted record revenue for June, the second quarter and the first half of 2026, supported by rising demand...