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Monday 21 September 2026
TSMC builds Kaohsiung hub to speed advanced packaging tests
TSMC is building an advanced packaging validation hub in southern Taiwan as rapid chip-on-wafer-on-substrate (CoWoS) expansion puts pressure on equipment and materials suppliers to...
Monday 21 September 2026
EV battery demand is going global, yet material supply remains overwhelmingly Chinese

For years, the global EV industry has been characterized by a persistent trend to diversify its manufacturing footprint beyond China...

Monday 21 September 2026
Syensqo showcased advanced materials enabling AI-era semiconductor manufacturing at SEMICON Taiwan 2026

Syensqo, a leading global supplier of advanced materials and chemical solutions, showcased its advanced materials portfolio for next-generation semiconductor manufacturing,...

Monday 21 September 2026
DIGITIMES Insight: AI chip upgrades shift substrate supply bottleneck from upstream materials to equipment
DIGITIMES Intelligence has observed that as the performance of AI accelerators and server CPUs continues to advance, chips are increasing not only in compute core counts and...
Monday 21 September 2026
Tyntek optical communications MPD ramps quarterly, 2027 capacity triples
Tyntek is rapidly expanding into optical communications as AI data-center demand drives a surge in high-speed transmission needs, with shipments set to rise significantly from the...
Monday 21 September 2026
Ampoc AI PCB orders surge as it expands into CPO

Printed circuit board (PCB) wet-process equipment maker Ampoc Far-East said demand for its in-house high-end equipment has surged on...

Monday 21 September 2026
India roundup: Semicon India 2026 puts commercial production and supplier investment in focus
India's semiconductor push is moving from policy to production, with new government funding, supplier investments, rising deal activity and expanding equipment, materials, testing...
Sunday 20 September 2026
Chinese memory supply is disruptive to pricing, Acer's Jason Chen says, as shortages ease
PC component shortages are easing, Acer chairman and CEO Jason Chen said, with memory tight only at the high end of DDR5 and CPUs no longer in short supply. Suppliers across the bill...
Saturday 19 September 2026
Memory recovery, price hikes lift Niching IC substrate outlook, order visibility through 2H27

Semiconductor packaging and testing materials distributor Niching Industrial hosted an investor conference on September 17. chief financial...

Saturday 19 September 2026
Interview: Advanced packaging shifts toward system-level co-design for AI

Advanced packaging remains one of the semiconductor industry's hottest technology areas in 2026. In Taiwan, terms such as co-packaged...

Saturday 19 September 2026
Ventec invests NT$1.5 billion in Kunshan expansion for AI, HDI orders

Copper-clad laminate (CCL) manufacturer Ventec International Group has approved an expansion budget of NT$1.5 billion (approx. US$47.11...

Friday 18 September 2026
Analysis: China's 15th five-year plan spotlights diamond for AI chip thermal management
China's Ministry of Industry and Information Technology (MIIT) and National Development and Reform Commission (NDRC) have highlighted ultra-wide bandgap (UWBG) semiconductor materials,...
Friday 18 September 2026
Corning to raise display glass substrate prices 15% from 4Q26
Corning, the US glass substrate supplier, will raise prices for its yen-denominated display glass substrate products by 15% or more worldwide starting in the fourth quarter of 2026,...
Friday 18 September 2026
CPO raises PCB downgrade concerns but switches stick with M8 CCL

As the industry shifts toward greater use of optical interconnects and less reliance on copper, market speculation has emerged that...

Friday 18 September 2026
Global chipmakers answer India's pitch with equipment, materials, and R&D — not fabs
The multinationals that filled Semicon India 2026 committed to almost every layer of the semiconductor value chain except the one India most wants: nobody announced a new fab. Applied...