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Monday 24 August 2026
AI energy bottleneck is driving semiconductor materials innovation, says Applied Materials
Rising demand for artificial intelligence (AI) computing is driving a new wave of technological transformation in the semiconductor industry, while energy is emerging as the next bottleneck...
Monday 24 August 2026
Advanced packaging substrates hit limits; ceramic cores rise to challenge glass materials
As hardware demands for artificial intelligence continue to surge, beyond increased size and complexity in chip packaging, advanced packaging substrates face mounting challenges: larger...
Monday 24 August 2026
German auto industry hardens stance against Chinese competition
Germany's top auto industry lobby, the German Association of the Automotive Industry (VDA), is overhauling its strategy as it hardens its stance on China. The group has said China...
Monday 24 August 2026
Taiwan semiconductor materials hit golden opportunity
Rising concerns over potential supply chain chokepoints for critical raw materials have driven the formation of the SEMI Taiwan Materials Alliance. Wei-Wang Chen, General Manager of...
Monday 24 August 2026
Fujifilm opens new post-CMP cleaner plant at Oita to meet AI chip demand
Fujifilm has completed a new production building at its Oita Factory in Japan to make post-CMP cleaners, expanding capacity for materials used in advanced semiconductors amid rising...
Monday 24 August 2026
SEMI launches alliance to ride semiconductor materials boom
SEMI launched a semiconductor materials alliance on August 21, bringing together more than 400 companies to build a more resilient and competitive supply chain as Taiwan extends its...
Monday 24 August 2026
Taiwan speeds chip materials push with consumables, ITRI says

Taiwan is accelerating its drive for semiconductor materials self-reliance by starting with consumables and building toward higher-value...

Monday 24 August 2026
ASE's Huang urges AI profits to fund R&D for CPO, PLP

As chip processes move to 2nm and advanced packaging accelerates heterogeneous integration, semiconductor materials are shifting from...

Monday 24 August 2026
Taiwan semiconductor materials team up to build local supply chain

Taiwan's semiconductor materials industry is entering a new window of opportunity as advanced semiconductor process and packaging technologies...

Monday 24 August 2026
India-based Raana Semiconductors in talks to raise US$10.4 million Series A for crystal-growth expansion
According to Inc42, Indian semiconductor startup Raana Semiconductors is in advanced discussions to raise about INR100 crore (US$10.44 million) in a Series A funding round,...
Monday 24 August 2026
AI packaging demand exposes supply-chain gaps for Taiwan materials makers
AI demand is pushing semiconductor manufacturing deeper into advanced packaging, and ASE vice president Hiro Huang said suppliers are meeting less than half of overall demand. He warned...
Monday 24 August 2026
Taiwan's 'invisible champions' in chip materials are about to become visible, says GlobalWafers' Doris Hsu

Advanced process technology and new device architectures are reshaping the semiconductor supply chain — and the pressure is shifting...

Monday 24 August 2026
India roundup: India's chip push moves beyond fabs as yield, supply chains and new technology become the next test
India's semiconductor strategy is entering a more demanding phase, shifting from attracting fabs and assembly plants toward building the capabilities needed to sustain them. From wafer...
Monday 24 August 2026
AI chip boom lifts South Korean semiconductor materials makers' profits in 2Q26
The AI semiconductor investment boom is increasingly spilling over into the materials supply chain. South Korea's major semiconductor materials suppliers broadly improved profitability...
Saturday 22 August 2026
Manz Asia says yield is key to glass core mass production
As AI chips continue to grow in size, the shift in advanced packaging from 300 mm wafers to square panels is becoming clearer, driving parallel development of new packaging technologies...