Samsung Galaxy Ring, slated for potential release in the latter half of 2024, is expected to integrate with the company's AI-powered custom recipe platform, Samsung Food.
Samsung Electronics announced an increase in its 2024 HBM shipping volume and disclosed more details about the development of its HBM4 product, showing that its specifications are...
Following the plan to construct an advanced semiconductor packaging facility in Indiana, United States, SK Hynix recently detailed its site selection in West Lafayette, as reported...
South Korea-based panel makers are investing in transparent displays and trying to expand the technology's application into more applications, while China-based display panel makers...