TSMC adjusts CoWoS capacity plans amid Trump 2.0 uncertainty

Monica Chen, Taipei; Charlene Chen, DIGITIMES Asia Monday 18 November 2024 0

Credit: DIGITIMES

Rising global uncertainties following Donald Trump's presidential victory have led TSMC to recalibrate its ambitious expansion plans for Chip-on-Wafer-on-Substrate (CoWoS) packaging technology, particularly as the semiconductor industry faces new geopolitical...

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