TSMC to see CoWoS production capacity reach 60,000 wafers in 2025

Monica Chen, Hsinchu; Jessie Shen, DIGITIMES Asia Friday 16 August 2024 0

Credit: DIGITIMES

The just acquired 5.5G panel fab would enable TSMC to boost its overall production capacity for CoWoS packaging to 60,000 wafers per month in 2025, with a projected increase to 70,000-80,000 units in 2026, according to industry sources.

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