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GPTC sees wet process equipment orders soar on advanced packaging boom in 2025

Monica Chen, Taipei; Rodney Chan, DIGITIMES Asia Tuesday 19 November 2024 0

Credit: DIGITIMES

Driven by rising demand for chip-on-wafer-on-substrate (CoWoS) and other advanced packaging equipment, Taiwan-based semiconductor automation and wet process equipment maker Grand Process Technology (GPTC) anticipates strong orders from TSMC, ASE Technology...

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