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Tuesday 17 August 2021
Microsoft to commercialize Azure datacenter in Taiwan in 2H22
Microsoft is scheduled to kick off operations at its new Azure datacenter in Taiwan in the second half of 2022, which may prompt other web service giants including Amazon Web Services...
Wednesday 21 July 2021
HPE expands GreenLake services in Taiwan
Hewlett-Packard Enterprise (HPE) has expanded its GreenLake services in Taiwan to add silicon on-demand and zero-trust cybersecurity solutions.
Tuesday 4 May 2021
Automotive protective component demand promising
Taiwan-based circuit protection component suppliers including Thinking Electronic Industrial, Polytronics Technology (PTTC) and Fuzetec Technology all expect sales generated from...
Friday 9 April 2021
Nexperia, UAES agree partnership for gallium nitride
Nexperia has announced a comprehensive partnership covering gallium nitride (GaN) power semiconductor devices with United Automotive Electronic Systems (UAES). The program will focus...
Thursday 18 February 2021
Taiwan leadframe makers to post revenue growth through 3Q21
Taiwan-based leadframe makers including Shuen Der Industry (SDI) and Jih Lin Technology are poised to post sequential revenue increases through the third quarter of 2021, thanks to...
Tuesday 25 August 2020
AAC Technologies to ship WLG hybrid, 7P smartphone lenses
China-based AAC Technologies will begin shipments for hybrid (glass and plastic combined) lenses based on WLG (wafer-level glass) technology and 7P (seven plastic) lenses for smartphones...
Monday 24 August 2020
Six pillars bolstering Moore's Law: Q&A with Intel chief architect Raja Koduri
At the inaugural Architecture Day held in late 2018, a new technical group headed by Intel senior vice president and chief architect Raja Koduri first came up with six strategic pillars...
Thursday 20 August 2020
PSMC launches 3D WoW production for AI memory chips
Powerchip Semiconductor Manufacturing (PSMC), the foundry subsidiary of Powerchip Technology, has announced volume production for AI memory chips using 3D wafer-on-wafer (WoW) tech...
Wednesday 19 August 2020
IBM announces 7nm processor
IBM has revealed the next generation of its POWER central processing unit (CPU) family, designed for enterprise hybrid cloud computing.
Thursday 2 July 2020
GaN and SiC power semiconductor markets set to pass US$1 billion mark in 2021, says Omdia
The emerging market for silicon carbide (SiC) and gallium nitride (GaN) power semiconductors is forecast to pass US$1 billion in 2021, energized by demand from hybrid & electric...
Friday 21 February 2020
ST, TSMC team up for GaN devices
STMicroelectronics and TSMC are collaborating to accelerate the development of gallium nitride (GaN) process technology and the supply of both discrete and integrated GaN devices...
Wednesday 25 December 2019
AAC Tech reportedly lands hybrid lens module orders from Huawei, Xiaomi
China-based AAC Technologies Holdings has reportedly landed orders for its hybrid lens modules from Huawei and Xiaomi for their upcoming flagship smartphones, a warning signal for...
Thursday 24 October 2019
Taiwan homegrown driverless car starts trial run on open road
Taiwan's first homegrown autonomous vehicle has been allowed to start trial run on an open road in the Nanliao Fishing Port area in northern Taiwan after passing 64 kinds of tests...
Friday 20 September 2019
Pure Storage debuts QLC flash storage array
Pure Storage at its Pure//Accelerate 2019 event launched an all-flash array storage, the FlashArray//C adopting a full-QLC-SSD configuration, looking to compete against competitors'...