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NEWS TAGGED PACKAGING
Tuesday 19 March 2024
TSMC to build two advanced packaging fabs in southern Taiwan
TSMC plans to set up two new advanced packaging fabs in Chiayi, southern Taiwan, a high-ranking Taiwanese government official has announced.
Thursday 14 March 2024
Taiwanese IC distributors to capitalize on handset and PC inventory shrinkage, AI chip boom in 2024
Taiwan's major IC distributors, including WPG Holdings, WT Microelectronics, Supreme Electronics, and Edom Technology, anticipate several significant trends for 2024 in the semiconductor...
Thursday 14 March 2024
APT upbeat about orders for advanced packaging
AblePrint Technology (APT), a company specializing in pneumatic and thermal process solutions for semiconductor packaging, is optimistic about the growing demand for advanced packaging...