BIWIN Storage Technology Co., Ltd. (referred to as BIWIN) focuses on the research and development, packaging and testing, and manufacturing of memory chips. It is recognized as a...
IC test interface specialists MPI and WinWay Technology have observed an increase in orders requiring high-spec testing that involves more complex and longer processing at higher...
Spirox and its subsidiary Southport have unveiled a new SiC substrate testing system, which is now being tested in collaboration with customers such as GlobalWafers and Wafer Works...
As the semiconductor industry gears up for substantial growth driven by the burgeoning fields of AI and High-Performance Computing (HPC), supply chain stakeholders are keenly eyeing...
The Automotive Research & Testing Center (ARTC) in Taiwan broke ground on the island's first high-speed self-driving technology testing site in July 2023. With support from Taiwan's...
IC analysis and inspection lab Material Science Service (MSScorps) has seen a surge in materials analysis demand from semiconductor customers who are actively pursuing advanced process...
At Qualcomm's latest annual product launch event, CEO Cristiano Amon pointed to a new era of generative AI entering smartphones and PCs, and expanding to extended reality (XR) and...
High-speed data transmission has come into the spotlight along with cloud-based AI accelerator chips as one of the most vital capabilities in the electronics industry, and silicon...
Geosat announces the recent successful navy testing of its prototype commercial-grade land-based reconnaissance drone. Responding to the specific requirements made by the Navy, Geosat...
The availability of charging infrastructure is one of the hurdles EVs must cross before full-scale adoption arrives. In the US, more carmakers said they will use Tesla's charging...
The US reportedly may impose stricter restrictions on Chinese chipmakers and Nvidia's downgraded AI H800 processors. In light of this, Taiwanese testing companies and probe card providers...
At the TSMC 2023 OIP Ecosystem Forum, TSMC announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform (OIP) 3DFabric Alliance. The 3Dblox 2.0...
Taiwanese OSAT providers stated that the trend of connectivity in everything will continue in 2024, and it will be combined with trends such as cloud AI, edge computing, and high-speed...
Taiwan-based IC backend houses have witnessed an improvement in their sales performance during the third quarter. However, it is anticipated that a significant rebound in demand may...
