Nvidia is expected to use TSMC's 3D SoIC (system on integrated chips) stacking and chiplet packaging technology in its high-end processors set to debut between 2024 and 2025, according...
Jiangsu Changjiang Electronics Technology (JCET), the largest China-based OSAT company, has reported revenue and net profits for 2022 both hit record highs of CNY33.76 billion (US$4.91...
The outlook of mid- to long-term demand for substrates supporting the packaging of HPC chips remains bright despite recent speculation that the market for related substrates is ove...
TSMC continues to experience cutbacks in orders from major customers including MediaTek and Apple, according to industry sources. Besides, the foundry has yet to ramp up wafer starts...
SK Hynix, the second-largest DRAM producer and one of the major NAND manufacturers, is evaluating the incentives extended by the US federal government and is looking to buy more time...
The Taiwan government's so-called "Chips Act" will benefit TSMC and a few other major chipmakers, as it does not cover the entire semiconductor ecosystem, according to sources at...
ACM Research, a leading developer of wafer processing technologies for semiconductor and advanced wafer-level packaging applications, has secured its first purchase order from a major...
As the CHIPS Act will soon begin receiving applications for wafer fab projects, the US government is asking applicants to provide detailed financial projections.
With Chinese automakers seeking to get low quotes from their auto component suppliers, the auto component makers reportedly have turned to request their suppliers of chips in oversupply...
Leading Chinese automaker BYD reportedly is enforcing production cuts in response to sluggish China market demand, casting clouds over the shipment prospects for automotive chips...
Canada and International Business Machines Corp. will seal a high-level agreement on expanding semiconductor cooperation on Friday, during US President Joe Biden's visit to Ottawa.
In a discussion with the famed AI scientist Fei-Fei Li at a forum on March 23, Pegratron chairman T.H. Tung remarked that the current stage of AI development is still not mature enough...
The US' escalation of the chip war with China has prompted more companies to shift their orders to Taiwan-based pure-play foundries. However, contract prices provided by TSMC and...
At the ongoing GPU Technology Conference (GTC), Nvidia unveiled its breakthrough in computational lithography. The new Nvidia cuLitho software library introduces accelerated computing...
China's Baidu recently announced the AI product "ERNIE Bot," which uses the second generation of Kunlun AI chip in its model. Besides focusing on AI chip development, Baidu is also...
