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Kaynes Semicon plans to package chips in India by July, highlighting Micron's delayed ATMP plant

Jingyue Hsiao, DIGITIMES Asia, Taipei Tuesday 1 April 2025 0

Credit: AFP

A senior executive from Kaynes Semicon revealed plans for the company to become the first in India to package chips by July, noting the delay in Micron's ATMP project.

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