Both third-generation semiconductor silicon carbide (SiC) power components and silicon-based insulated gate bipolar transistors (Si-based IGBT) are being used in electric vehicles...
The wide bandgap (WBG) features of third-generation semiconductors make them particularly suitable for recharging and radio frequency (RF) applications, as silicon carbide (SiC) has...
Rohm and Rohm Wako have announced a plan to build a new production facility at its manufacturing subsidiary in Malaysia, Rohm-Wako Electronics (Malaysia) to increase production capacity...
IDMs including TI, Infineon, STMicroelectronics and Microchip have all stepped up their deployments in the market for power devices using GaN, SiC and other third-generation semiconductor...
China auto and semiconductor makers are stepping up the development and production of their homegrown SiC chips and modules for EV applications, according to industry sources.
International IDMs, Taiwan's EMS leader Foxconn and China's semiconductor and EV vendor BYD Group are all keenly deepening their deployments in third-generation semiconductors GaN...
IDMs including Infineon, Rohm and STMicroelectronics are transitioning to 8-inch wafer fabrication for third-generation semiconductors such as GaN and SiC, according to industry so...
As the application market for third-generation semiconductors GaN and SiC devices is on track for rapid expansion, international IDMs including Cree, Infineon, SMT Microelectronics...
Rohm will inject a total of JPY400 billion (US$3.64 billion) into its expansion through 2025, the Japan-based chip vendor disclosed in its mid-term management plan.
Rohm recently held an opening ceremony announcing the completion of a new building at its Apollo plant in Chikugo, Japan. The facility is to enhance the company's production capacity...
Taiwan leadframe makers are likely to raise quotes for leadframes for packaging automotive chips and power modules by 5-10% to reflect increased material costs amid increasing demand...
SiC (silicon carbide) components pomise great potentials in EV applications, and are expected to account for 25% of automotive power semiconductor by 2025, according to Digitimes...
Rohm has unveiled its ultra-compact MOSFET chips sized 1.0x1.0mm, including RV8xxx- and BSS84XHZG-series that meet AEC-Q101 reliability standards for automotive electronics applica...
The emerging market for silicon carbide (SiC) and gallium nitride (GaN) power semiconductors is rapidly evolving from a startup-dominated business to one led by large-established...
China-based Leadrive Technology, specializing in third-generation semiconductor power modules for electric vehicles, has teamed up with Japan's IDM Rohm Semiconductor to set up an...
