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Tuesday 6 February 2024
China SiC capabilities push means global competition: Q&A with SAS chairperson Doris Hsu (II)
With the government's support, Chinese companies have scaled the silicon carbide (SiC) segment and secured partnerships with some international IDMs. In the second part of an interview...
Tuesday 6 February 2024
Japan's semiconductor renaissance (2): advanced packaging and materials
The Japanese government's efforts to attract foreign semiconductor investment have been very effective, with almost every major international semiconductor manufacturer responding...
Monday 5 February 2024
Veeco advances quantum tech with GEN20-Q MBE system
Veeco Instruments has announced the shipment of a GEN20-Q molecular beam epitaxy (MBE) system to Hermes-Epitek, a semiconductor and optoelectronics client situated in Taiwan's Hsinchu...
Friday 2 February 2024
Topco Scientific considering moving Arizona site to Texas or Mexico
Semiconductor materials supplier Topco Scientific is following in the footsteps of Taiwan Semiconductor Manufacturing Company (TSMC), aiming to set up a plant site in North America,...
Wednesday 31 January 2024
India special report: Taiwan and India can complement each other in the chip industry
India is well-positioned to become a major global semiconductor market thanks to strong economic growth, a favorable demographic dividend for domestic consumption, and increasing...
Wednesday 31 January 2024
China approaches automotive chip autonomy with domestic standards guidance
The Chinese Ministry of Industry and Information Technology (MIIT) recently issued the new Guidelines for the Construction of the National Automotive Chip Standard System.
Tuesday 30 January 2024
WSJ: White House to announce billions in subsidies for TSMC, Intel in March
US President Joe Biden is expected to officially announce subsidies amounting to billions of dollars to major semiconductor manufacturers on March 7, according to the Wall Street...
Tuesday 30 January 2024
AI is Samsung's best counterpunch to Intel-UMC challenge
Intel's latest moves are getting the attention of Samsung: Intel accelerated its development of the 2nm process and was the first to purchase High-NA extreme ultraviolet (EUV) lithography...
Monday 29 January 2024
Japan's semiconductor renaissance (1): manufacturing and equipment
In the second half of the 1990s, Samsung Electronics came to the forefront of Dataquest's DRAM manufacturer rankings. NEC and Toshiba were in second and third place, and other Japanese...
Monday 29 January 2024
Research Insight: UMC's alliance with Intel starts new chapter in foundry competition
Intel and UMC's announcement to work together in developing 12nm processes has been lauded as a creative move. DIGITIMES Research believes that because of the complementary nature...
Monday 29 January 2024
Weekly news roundup: Huawei seeks complete independence from Android with 'Pure-Blooded Harmony'
These are the most-read DIGITIMES Asia stories in the week of January 22-26:
Monday 29 January 2024
India roundup: Corning facility to land in southern India
Corning signed an MoU with the government of Tamil Nadu to make cover glass for mobile devices as India saw surging electronics exports thanks to Apple suppliers.
Thursday 25 January 2024
Chinese government support produces 100 domestic EDA vendors, but few will survive
China's multitude of government-supported (electronic design automation) EDA vendors are facing the prospect of elimination.
Thursday 25 January 2024
OpenAI refuses to queue for AI chips; will build its fab faster to get them?
OpenAI CEO Sam Altman's plan to build...
Thursday 25 January 2024
APT opens new plant for advanced packaging process solutions
AblePrint Technology (APT), which has long focused on semiconductor packaging and offers pneumatic and thermal process solutions, has opened a new plant in Hsinchu, northern Taiwan,...