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Wednesday 30 October 2024
Samsung set to introduce high-NA EUV equipment by early 2025
Samsung Electronics is reportedly preparing to introduce its first High-NA EUV (extreme ultraviolet lithography) equipment in early 2025, signaling a major advancement for the South...
Wednesday 30 October 2024
Samsung enters the SiPh race with I-Cube So/Eo, challenging TSMC and China's rising stars
Samsung Electronics and TSMC are ramping up the development of SiPh technology to handle the exponential data growth driven by AI applications. The Seoul Economic Daily reports...
Wednesday 30 October 2024
Cloud AI taking off in SEA; multilingualism and digital divide to drive innovation
Cloud AI development is surging in Southeast Asia (SEA), with major cloud service providers rapidly expanding their infrastructure investments in the region. The area's multilingual...
Wednesday 30 October 2024
Glass substrates poised to transform advanced packaging: Q&A with Corning commercial technology director Xavier Lafosse
The rapid development of AI has dramatically increased demand for AI chips, but current organic substrate technology faces challenges, including thermal expansion mismatches and warping,...
Wednesday 30 October 2024
Macronix chairman doubts 2025 demand recovery but better than 2024
Macronix International, a mask ROM and flash memory chipmaker, expects its operations to improve in 2025 compared to this year, but demand will not fully recover, according to company...
Wednesday 30 October 2024
Microsoft's GitHub unit cuts AI deals with Google, Anthropic
Microsoft Corp.'s GitHub has agreed to bake artificial intelligence models from Anthropic and Alphabet Inc.'s Google into a coding assistant used by millions of software developers...
Wednesday 30 October 2024
Nuvoton advances edge AI and IoT with NuEzAI platform, targets 2025 growth
The edge AI market continues its upward trajectory, with microcontroller (MCU) maker Nuvoton Technology capitalizing on new opportunities through AI and green energy sectors.
Wednesday 30 October 2024
Taiwan's official reassures green energy supply can support AI development
Taiwan can generate enough green energy to fuel AI sector growth, says Economic Affairs Minister J.W. Kuo, addressing Nvidia CEO Jensen Huang's projection of 10 billion kWh in annual...
Wednesday 30 October 2024
Loongson to tape out GPU as early as 2025
According to industry reports, China-based CPU developer Loongson Technology is expected to tape out a general-purpose GPU as early as 2025. Reportedly, this GPU will be built using...
Tuesday 29 October 2024
Taiwan's power woes could deter foreign investment, warns Delta founder
Despite repeated assurances from authorities that Taiwan won't face power shortages, concerns about energy supply continue to loom over the island's industrial development. Bruce...
Tuesday 29 October 2024
Taiwan should establish digital sovereignty, benchmark foundational model
In today's digital economy, the development of national-level computing power has become an important measure of global competitiveness. Computing power, as a pillar of digital infrastructure,...
Tuesday 29 October 2024
MiTAC-Synnex chair Matthew Miau reflects on 50 years of innovation, K.T. Li's legacy, and Taiwan's AI opportunities
Taiwan stands at a pivotal moment in the AI revolution. Having established itself as a leader in AI hardware manufacturing, Taiwan will also have a chance to lead in the next wave...
Tuesday 29 October 2024
Japanese companies develop 3D analog IC for ADAS, overcoming cost and technical challenges
Oki Electric Industry and Nisshinbo Micro Devices have announced the development of an analog IC for advanced driver assistance systems (ADAS) in vehicles, reports Nikkei.
Monday 28 October 2024
Taiwan launches first domestically-made high-altitude balloon to boost communication resilience
Taiwan's Ministry of Digital Affairs (MODA) launched the first test of a domestically-made high altitude platform station(HAPS) in Taitung, aiming to bolster the island's communication...
Monday 28 October 2024
Intel expands Chengdu facility with new server chip packaging and testing services
Intel announced plans to expand its Chengdu, Sichuan facility on October 28 to offer server chip packaging services. This expansion leverages the site's existing operations to address...