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Wednesday 31 December 2025
GigaDevice Semiconductor seeks up to HK$4.68B in Hong Kong listing

Chinese chip designer GigaDevice Semiconductor is pressing ahead with plans to list its shares in Hong Kong, seeking to raise as much...

Wednesday 31 December 2025
Geopolitics reshapes tech landscape as Southeast Asia emerges as data center, manufacturing, and AI hub
In 2025, rising geopolitical tensions reshaped global technology and manufacturing, boosting Southeast Asia as a key hub for data centers, advanced manufacturing, and AI. The Johor-Singapore...
Wednesday 31 December 2025
Samsung reportedly plans 50% HBM output surge through 2026

Samsung Electronics plans to boost its high-bandwidth memory (HBM) production capacity by approximately 50% through late 2026, according...

Wednesday 31 December 2025
Top tech topics in 2025 (2): turbulent year for end-device and downstream applications
2025 proved turbulent for downstream applications and end-user devices. Tariffs and geopolitical tensions dominated the first half, while AI gained momentum later in the year. Global...
Wednesday 31 December 2025
TSMC reportedly speeds up Arizona 3nm fab plans as Samsung woos US clients in Texas

According to South Korean media reports and industry sources, TSMC is moving to pull forward the production schedule at its second Arizona...

Wednesday 31 December 2025
South Korean PCB industry faces cost challenges as AI drives raw material prices up
The South Korean printed circuit board (PCB) industry is struggling as soaring gold and copper prices, up 50% and 30% respectively since early 2025, increase production costs. Despite...
Wednesday 31 December 2025
BOE 8.6G AMOLED production line in Chengdu to begin production early
BOE announced on December 30 that its first 8.6G AMOLED production line in Chengdu, China, has begun early production, five months ahead of the original schedule, shifting from construction...
Wednesday 31 December 2025
YMTC goes full speed toward HBF next
Amid rising US-China tech tensions and tight semiconductor supply chains, YMTC disclosed advances in 3D NAND flash memory and plans to develop high bandwidth flash (HBF) technology...
Wednesday 31 December 2025
China orders 50% domestic equipment requirement for new chip capacity

China is requiring semiconductor manufacturers to source at least 50% of their equipment from domestic suppliers when adding new production capacity,...

Wednesday 31 December 2025
Mitsubishi launches XForce in Taiwan, confirms EV partnership with Foxtron
Yulon Motor Group's subsidiaries China Motor (CMC) and Yulon Nissan Motor are showcasing new car models at the Taipei Auto Show, which runs from December 31 to January 4 at the Taipei...
Wednesday 31 December 2025
YMTC pushes for equipment localization despite elusive profitability
As China's leading 3D NAND maker, Yangtze Memory Technologies (YMTC) has recently been regarded as the most aggressive company in promoting the adoption of domestic equipment. Its...
Wednesday 31 December 2025
The chip industry in 2025: Boom, rivalry, and a fragile new order
In 2025, generative AI investments are reshaping the global semiconductor industry. Nvidia, TSMC, and their supply chains emerge as the biggest winners. But the boom brings new challenges...
Wednesday 31 December 2025
ByteDance balances Nvidia, Huawei chips in China's localization squeeze

ByteDance is planning to procure a mix of Nvidia H200 accelerators and Huawei Technologies Ascend chips to meet its growing artificial...

Wednesday 31 December 2025
Samsung faces scrutiny over Taiwan probe, denies memory market ties
Samsung Electronics has expanded an internal investigation into alleged employee misconduct at its Taiwan subsidiary, a move the company characterizes as an isolated matter despite...
Tuesday 30 December 2025
TSMC hits its 2nm milestone on schedule as China flexes military muscle
TSMC today announced that its highly anticipated 2nm (N2) technology began volume production in the fourth quarter of 2025, meeting its roadmap targets precisely on schedule.