South Korean AI semiconductor startup DeepX is reportedly set to become a new customer of AsicLand, an IC design company that partners with TSMC.

With the intensifying competition in the AI memory chip market, leading memory vendors like SK Hynix, Micron Technology, and Samsung Electronics are gearing up for proxy patent battles...

Taiwan-based automotive power and safety parts manufacturer Global PMX disclosed its plans for EVs, hybrid vehicles, and fuel-cell EVs at a recent shareholders' meeting. The company...

As AI applications expand to portable devices such as notebooks, demand for the latest generation of graphics memory, GDDR7, is gaining momentum, especially after AI chip leader Nvidia...

SK Hynix's M15X DRAM plant in Chungbuk-Cheongju, which is under construction, is expected to be completed ahead of schedule.

China-based MCU companies have been actively developing the automotive market in recent years.

Intel invested in China-based Dongguan Luxshare Technology, a subsidiary of Luxshare Precision, amid deepening Intel-Luxshare ties as demands for high-speed interconnect products...

Japan has been one of the fastest countries to embrace the use of new artificial intelligence tools and has the potential to accelerate its economy and tech sector by going further,...

Chinese EV manufacturers may feel resentment toward the additional tariffs imposed by the EU, but in reality, they still have multiple options to maintain sales growth.

Geopolitics and the Group of Two (G2) dynamic have attracted Taiwan's ICT supply chain much attention.

Display technology upgrades have been the main theme in the long-term development of the TV industry.

These are the most-read DIGITIMES Asia stories in the week of June 10 – June 14.

Leapfrogging is no longer on Samsung's agenda at least temporarily.

IC inspection lab Materials Analysis Technology (MA-tek) has disclosed plans to establish a third Japanese location in Hokkaido, in addition to its current facilities in Nagoya and...

Samsung Electronics is introducing the 1.4 nm process, BackSide Power Delivery Network (BSPDN), and Silicon Photonics (SiPh) technologies by 2027 to enhance its AI solution strategy...