中文網
  • 繁體
  • 简体
    •
    Trending
    CONNECT WITH US
    SK Hynix questions PIM as heat and packaging emerge as HBM limits
    2h 8min ago
    Doosan develops 13µm ultra-thin CCL for memory chip substrates
    2h 8min ago
    Apple reportedly seeks lower OLED panel prices through larger orders
    2h 8min ago
    Huawei and Apple foldable phones set off a supply chain rush in September
    2h 8min ago
    2027 tri-fold phones enter a new phase as materials and durability become key battlegrounds
    2h 8min ago
    NEWS TAGGED CHIPS + COMPONENTS
    Friday 27 March 2026
    In-depth: Google TurboQuant cuts LLM memory 6x, resets AI inference cost curve

    Google has introduced TurboQuant, a compression algorithm that reduces large language model (LLM) memory usage by at least 6x while boosting...

    Friday 27 March 2026
    GlobalFoundries sues Tower Semiconductor over chip manufacturing patents

    GlobalFoundries has filed multiple lawsuits against rival Tower Semiconductor, alleging infringement of 11 patents related to chip manufacturing...

    Friday 27 March 2026
    SK Hynix targets KRW100 trillion net cash as AI demand surges, eyes US listing

    SK Hynix plans to build more than KRW100 trillion (approx. US$66 billion) in net cash to support long-term investment in artificial intelligence...

    Friday 27 March 2026
    US advances chip tracking mandate after US$2.5B smuggling case exposes export gaps

    In a rare show of bipartisan unity, a key US congressional committee voted 42-0 on Thursday to advance the Chip Security Act (CSA). The...

    Friday 27 March 2026
    Adata secures NT$12B syndicated loan to drive expansion, debuts Trusta for edge AI infrastructure
    Taiwan's memory module giant Adata Technology has secured a NT$12 billion (US$375 million) syndicated loan led by Bank of Taiwan, strengthening its mid-term working capital while advancing...
    Friday 27 March 2026
    Eikei targets automotive and AI markets, establishes Slovakia subsidiary
    Automotive printed circuit board (PCB) manufacturer Eikei Group announced plans to establish a subsidiary in Slovakia, aiming to diversify geopolitical risks across its three major...
    Friday 27 March 2026
    Air Liquide launches first advanced materials plant in Taiwan for sub-3nm chips
    Paris-headquartered Air Liquide has inaugurated a new advanced materials plant in Taichung, marking its first large-scale production base in Taiwan for deposition and etching materials...
    Friday 27 March 2026
    Semicon China 2026: AI drives semiconductor market to US$1.8 trillion by 2030, China leads capacity and equipment
    AI computing is pushing the semiconductor industry into a structural growth phase, reshaping global capacity and technology pathways, according to Lily Feng, President of SEMI China,...
    Friday 27 March 2026
    SK Hynix keeps HBM shipments steady, targets HBM4E sample this year

    SK Hynix expects stable growth in its high-bandwidth memory (HBM) business this year and plans to keep shipments in line with initial...

    Friday 27 March 2026
    DRAM and NAND costs hit 90% of smartphone prices, squeezing low-end profits
    Core component costs for smartphones are surging at unprecedented rates, threatening the survival of low-priced models in the market. Nikkei reports that prices for two essential...
    Friday 27 March 2026
    TSMC prioritises AI, core clients; 3nm capacity remains constrained
    Cloud AI demand is tightening advanced-node supply, with TSMC's 3nm capacity emerging as the most constrained segment at the end of the first quarter of 2026, according to IC design...
    Friday 27 March 2026
    Samsung and SK Hynix expand microscope procurement to boost HBM yield
    As AI compute demand surges, the rising need for high-bandwidth memory (HBM) testing and failure analysis is reshaping semiconductor inspection equipment markets, affecting chipmakers,...
    Friday 27 March 2026
    Semicon China 2026: AI efficiency fuels demand growth under Jevons paradox, AMD warns
    At SEMICON China 2026, AMD VP and Head of Corporate Strategy and Partnerships Mario Morales delivered a stark warning: while the AI market is rapidly expanding toward a projected US$1.7...
    Friday 27 March 2026
    Micron inaugurates Tongluo site, targets fiscal 2028 DRAM, HBM output

    Micron Technology, on March 26, held an inauguration ceremony for its Tongluo site in Miaoli County, marking a milestone following the...

    Friday 27 March 2026
    UPS and Applied Materials boost Taiwan semiconductor logistics with new Taoyuan hub
    Targeting the growing needs of Taiwan's high-tech and semiconductor sectors, UPS has officially launched its Taoyuan International Logistics Center (TILC) with a total investment nearing...
    206/430 pages
    biz
    BIZ FOCUS
    Aug 25, 08:00
    Conquer Advances Circuit Protection for AI Power With 50 Years of Expertise
    Tuesday 25 August 2026
    CYP Launches 4K60 Seamless Matrix Switcher to Simplify Multi-Source Operation
    Monday 24 August 2026
    STMicroelectronics Unveils ISO 21780-Compliant 48V Pre-Driver with 8-Channel Flexibility
    Monday 24 August 2026
    iCometrue to Showcase Glass-Based AI Multichip Packaging Solutions at SEMICON Taiwan 2026
    reportAIglasses