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Friday 12 June 2026
SuperAI Singapore: Arm and Cerebras push system-wide fixes to cut inference AI bottlenecks

Breaking the inference barrier requires a rethink of the whole system architecture, not just faster compute. This was the key takeaway...

Friday 12 June 2026
Power semiconductors race to cut resistance for GPU cooling
Power semiconductors are taking on a central role as AI data centers move from 800V high-voltage input down through multiple power-conversion stages to the ultra-low voltages used...
Friday 12 June 2026
Lenovo reportedly plans second PC price hike as memory costs squeeze supply chain
Chinese PC major Lenovo is reportedly set to raise prices across its entire product line from July 2026, with increases broadly in line with its first round of adjustments in March...
Friday 12 June 2026
DDR4 shortage tightens as Nanya capacity fills and prices climb

DDR4 memory supply remains tight, with the shortage affecting buyers worldwide, from cloud and server operators to industrial and networking...

Thursday 11 June 2026
Amkor Korea weighs KRW1 trillion Gwangju expansion amid reported TSMC order growth

Amkor Technology Korea is considering investing about KRW1 trillion (approx. US$650 million) to expand its chip packaging and testing...

Thursday 11 June 2026
Applied Materials CEO: AI reshapes semiconductor innovation
Applied Materials said artificial intelligence (AI) is reshaping the global semiconductor industry and could drive years of heavy investment in chipmaking, packaging, and materials...
Thursday 11 June 2026
Applied Materials expands Singapore base as AI supply-chain bottlenecks loom
Applied Materials is expanding manufacturing and research in Singapore as artificial intelligence (AI) drives a wider shift in semiconductor planning, supply chains, and investment...
Thursday 11 June 2026
Commentary: TSMC's pricing power stays intact as AI demand keeps fabs full
Market chatter about TSMC has intensified, with reports that its advanced process and packaging prices will rise again in the second half of 2026 and 2027, while some Google TPU production...
Thursday 11 June 2026
Nvidia takes PCB material competition upstream as HVLP4 copper foil gap widens
AI infrastructure demand is lifting high-end PCB orders, but fresh bottlenecks are emerging in the upstream copper-clad laminate (CCL) supply chain. T-glass glass fiber cloth remains...
Thursday 11 June 2026
AI boom drives capital inflows, but Taiwan sees low systemic risk
Taiwan's export growth has accelerated to its strongest pace in nearly 16 years on the back of AI and higher prices for electronic components, drawing large amounts of capital into...
Thursday 11 June 2026
US lawmakers push ITC to enforce patent case involving TSMC

Congressional Republicans are urging stronger exclusion orders in the ongoing Section 337 investigation tied to TSMC's advanced-node...

Thursday 11 June 2026
CPO delays may shift AI networking demand, not derail it

Concerns have emerged in recent weeks that the commercialization of co-packaged optics (CPO), a technology widely viewed as the future...

Thursday 11 June 2026
Montage Tech samples 9200 MT/s DDR5 RCD06 chip for AI server memory upgrade
Montage Technology has begun sampling its sixth-generation DDR5 registering clock driver chip (RCD06) to customers, marking a step forward in the performance upgrade of next-generation...
Thursday 11 June 2026
Taiwan Mask sells Zhunan plant to Siliconware Precision Industries for NT$2.8 billion
Taiwan Mask (TMC), a Taiwanese photomask manufacturing process company, has approved the sale of its Plant 6 in Zhunan, Taiwan. The company said the move is primarily a strategic measure...
Thursday 11 June 2026
MicroIP's new Kaohsiung R&D base points to broader AI push in southern Taiwan
MicroIP has opened a nearly 300-ping southern R&D center at Kaohsiung's PIER F, with plans to expand smart manufacturing and smart transportation applications. The move signals...