Japan-based semiconductor equipment supplier Disco plans to establish its presence in India, as India plans to build a chipmaking ecosystem amid the global diversification in semic...
The potential of advanced packaging technology to upgrade chip performance has attracted many Japanese equipment and material suppliers to allocate their resources in this highly...
Major Japan-based semiconductor equipment saw their market capitalization more than double in 2023, with other suppliers reporting nearly doubling of their market valuations, highlighting...
According to Nikkei, Japan-based semiconductor equipment provider Disco is anticipated to invest over JPY40 billion (US$273.8 million) to build a plant in Kure, Hiroshima...
Japan's Disco Corp, with its 70-80% share of the global wafer cutting and grinding equipment market, experienced a remarkable threefold increase in market value within a year in 20...
Ahead of the annual investor event held in Gujarat, a top official of India's western state said it had talked with several chipmakers in Japan, South Korea, and the US, looking to...
TSMC has recently initiated a new round of orders with advanced packaging equipment suppliers including Apic Yamada, Disco, Gudeng Precision Industrial and Scientech, according to...
After some semiconductor manufacturers are looking to invest in India, other players in the chip supply chain have begun exploring the feasibility of setting up shop in India, a country...
TSMC has stepped up its pace of orders with backend equipment suppliers, as the foundry commences its chip-on-wafer-on-substrate (CoWoS) packaging capacity expansion plan, according...
With US officials acknowledging that Washington has indeed been in talks with the Japanese and Dutch governments regarding new restrictions on semiconductor equipment exports to China,...
Japanese semiconductor equipment maker Disco has decided to increase the production capacity of its cutting and polishing equipment for wafers and electronic components. To do so,...
Applied Materials and Japan-based Disco have announced a joint effort to develop wafer thinning processes for fabricating through-silicon vias (TSVs) in 3-dimensional (3D) semicond...
