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Japan takes ambitious action on advanced packaging technology to capture Chiplet and AI chip opportunities

Chiang, Jen-Chieh, analysis; Judy Lin, DIGITIMES Asia Friday 3 May 2024 0

Rapidus CEO (L) and Chairman (R) Credit: AFP

The potential of advanced packaging technology to upgrade chip performance has attracted many Japanese equipment and material suppliers to allocate their resources in this highly specialized field to gain their entry into the high-margin market of advanced...

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