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Manz AG anticipates growth in advanced packaging amid CoWoS shortage

Janet Kang, Taipei; Heidi Tai, DIGITIMES Asia Tuesday 27 August 2024 0

GM of China & Taiwan Operation at Manz AG, Robert Lin. Credit: DIGITIMES

The semiconductor industry is experiencing a surge in demand for advanced packaging technologies, driven by the rapid growth of high-end AI servers and generative AI. This trend has led to a shortage in Chip-on-Wafer-on-Substrate (CoWoS) technology,...

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