Manz AG, a global high-tech engineering company with a comprehensive technology portfolio, showcases its high-density packaging production solutions at the SEMICON Southeast Asia 2023 on May 23-25 in Penang, Malaysia. The participation of this exhibition reflecting the company's focus on a total production solution of high-density packaging technologies that fulfill the high global demand for automotive chips. Highlighted within the Manz booth will be recent advancements in developing leading-edge Fan-Out Panel Level Packaging (FOPLP) solutions for ensuring higher efficiency and lower manufacturing cost.
Manz has built the industrial largest 700 x 700 mm process area FOPLP redistribution layer (RDL) production lines. Combined with this work, the company provides Total Fab planning from customized process development, equipment construction to the integration of upstream and downstream manufacturing production lines. The full range of service helps automotive chipmakers facing the critical technological challenges of fine-pitch copper line formation in redistribution layers of FOPLP process. These innovative solutions satisfy the demand for high production yields, excellent Cu-plating uniformity, and high-density packages to deliver high performance power management ICs for electric vehicles. With our full strength to drive FOPLP production solutions forward, we assist customers to pursue breakthrough production methodology as well as ESG targets by increasing energy efficiency, and waste reduction.
Despite semiconductor market showing slowdown in 2023, automotive IC sector looks to sustain the strong growth. According to Prismark, Advanced Driver-Assistance Systems (ADAS) and electric powertrain systems both have expected to grow at CAGR of 13% and 18% from 2022 to 2027, respectively. In the past two-year, the automotive semiconductor market has experienced silicon chips shortage, IC substrates capacity constraints and the packaging material cost rising. Facing the new normal of post pandemic and geopolitical instability, the IDMs, OSAT, IC Substrates and PCB makers aggressively turn to lower cost and high Interconnect innovation for a novel boosting of scale. FOPLP gets attractive because it could save IC substrate usage, reach the design of fine-pitch patterning, meet the requirements of high electric conductivity, and improve high heat dissipation.
FOPLP increases the performance of PMICs.
Electric vehicle architectures are rapidly evolving to accommodate high power density devices, multiple power electronics and controller ICs. The RDL technology provides high density of fine pitch metal interconnects that redistribute the I/O access to integrate multiple dies into one single package. With the line width and spacing (L/S) specification of 5/5µm ranges, Manz RDL production solutions enable a significant reduction in thickness, weight, and manufacturing costs of the packaging while performing complex pattering and complicated layers design to satisfy high density packaging requirements.
Build FOPLP RDL production lines with the largest 700 x 700 mm process area in the industry.
Manz AG has drawn on its core competencies of wet chemistry, automation, metrology, and inspection technologies to develop the industrial largest process dimension of 700 x 700 mm RDL production lines. The RDL process takes one-third of the overall manufacturing cost of FOPLP technology. That's why Manz's equipment has a crucial role to play. Collaborating with key customers, Manz AG has already built complete production lines not only for a pilot run but also a ramp-up of mass production to verify the precision adjustment of the Cu-plating process applied in large area of redistribution layers and overcome the major technical challenges including uniformity of cu-plating pattering, high resolution and high electrical connectivity.
Excellent uniformity, high thickness and fast speed of Cu-plating increase production yields plus assist customers for ESG targets.
Cu-plating is an integral part of the RDL process. Manz integrates its own pre-and-post chemical wet processes to ensure excellent electroplating panel surface uniformity at 92%. The Cu thickness could reach 100 μm and above. These newly developed processes increase chip density, heat dissipation and a high current density of up to 5 ASD to ensure higher process speed to boost overall manufacturing capacity. The unique automatic gentle handling and jig-free vertical electroplating systems, which can save the material purchase cost, as well as reduce the consumption of electroplating chemicals and the cost of maintenance to help customers achieving ESG targets.
Total Fab Solutions enable highly profitable business models for FOPLP.
Manz actively expands the reach of its Total Production Solutions to provide the services to build from single equipment to automated production lines with the integration of upstream and downstream manufacturing lines. This approach enables the tight collaboration among Manz and the global IDM, OSAT and semiconductor foundry service providers to develop a comprehensive plan for success by increasing competitiveness and maintaining the strong positioning of supply chains.
Manz AG, leveraging an open-architecture and modular design concept, provides a comprehensive technology portfolio fulfilling the requirements of RDL process optimization and the flexibility to fit different stages of FOPLP production expansion. Seeing the huge growth of global automotive chip demand, Manz AG's production solutions transform FOPLP as the prevailing technology in the advanced packaging market.
Manz FOPLP RDL production solutions with proven records for mass production
Manz Jig-free Vertical Electroplating ━ a key tool to optimize the production
PMIC Packaging by FOPLP production line
