Enosemi and Jabil form alliance to advance photonic chip packaging

Sherri Wang, DIGITIMES Asia, Taipei Tuesday 4 March 2025 0

Credit: Enosemi

In a landmark announcement on March 3, Enosemi and Jabil unveiled a sophisticated collaboration to pioneer advanced packaging process technology for Enosemi's cutting-edge photonic chips. As the computational demands of cloud infrastructure and artificial...

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