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Thursday 3 September 2026
BYD Semiconductor scales 4D radar chip for L2-L4 driving, deepening its in-house automotive sensing stack
BYD Semiconductor has begun mass production of a new automotive-grade 4D millimetre-wave radar chip built around its Xuanji A3 intelligent-driving architecture, expanding its in-house...
Thursday 3 September 2026
Google to expand Taipei AI infrastructure center as Taiwan ties deepen
Google will expand its AI infrastructure research and development center in Taipei's Shilin district, adding 60% more office space, as it deepens work with Taiwan's supply chain on...
Thursday 3 September 2026
Broadcom puts 30GW, US$350 billion of custom AI silicon on the calendar through fiscal 2028
Broadcom used its third-quarter fiscal 2026 earnings call on September 2 to convert a quarter-by-quarter AI story into a dated, customer-by-customer deployment schedule running into...
Thursday 3 September 2026
VinFast reportedly pauses India manufacturing work on three EVs, a year after opening its Tamil Nadu plant
VinFast has suspended plans to manufacture three electric vehicles in India and ordered suppliers to halt work while it reassesses costs, according to two sources and a company memo...
Thursday 3 September 2026
Auras sees ASIC revenue reaching 50% in 2027, eyes microchannel cooling production in 2028
Cooling specialist Auras Technology is expanding from GPU platforms to ASIC-related products as its next growth driver, amid the ongoing shift toward liquid cooling in AI servers,...
Thursday 3 September 2026
Column: From automation to autonomy—what robotics still needs to make the leap
I visited Automation Taipei 2026 in mid-August, where the show looked lively and occupied a footprint 7% larger than in 2025. Physical AI and vision-language-action (VLA) models dominated...
Thursday 3 September 2026
SK Hynix wafer purchases jump 104% on AI demand
SK Hynix boosted its silicon wafer purchases in the second quarter of 2026 by more than doubling spending from the previous quarter as it moved early to secure raw materials amid rising...
Thursday 3 September 2026
Thailand AiPASS unlocks premium AI after lessons
Thailand has launched its TH-AI Passport and core AiPASS platform, taking a different path from South Korea's national AI push by buying access to overseas commercial AI tools such...
Thursday 3 September 2026
MiniMax, Z.ai revenues surge on API demand but adjusted losses widen
Two of China's first listed foundation-model developers are showing that demand for their technology can translate into rapidly growing revenue. Turning that demand into profit remains...
Thursday 3 September 2026
TIME AI 100 spotlights China's new AI guard, from Moonshot, Z.ai to AgiBot, Manus
TIME recently unveiled its 2026 list of the 100 most influential people in AI. Alongside leaders of major technology companies, the list includes a new generation of Chinese...
Thursday 3 September 2026
SEMICON Taiwan 2026: Physical AI drives new demand for multimodal robot sensing
The rise of physical AI is creating a new wave of demand for advanced sensors as robots move from controlled demonstrations toward practical deployment. Industry experts at SEMICON...
Thursday 3 September 2026
Yield has been semiconductor industry's oldest question; now it's Microsoft's test for AI
Microsoft brought the semiconductor industry's own measure of success back to it on Wednesday, and argued that AI will be judged by it.
Wednesday 2 September 2026
Sandisk says HBF can match HBM bandwidth with up to 16x the capacity
Sandisk says its NAND-based High Bandwidth Flash (HBF) technology can match HBM bandwidth while providing eight to 16 times the capacity at a similar cost, positioning flash memory...
Wednesday 2 September 2026
Lam Research exec says automated preventive maintenance key to fabs of the future
A senior Lam Research executive told an industry audience this week that the next major leap in semiconductor manufacturing will not come from removing humans entirely from fabs, but...
Wednesday 2 September 2026
DRAM giants target 3D stacking to break memory wall and power bottlenecks
At a shared stage at Semicon Taiwan 2026, executives from Samsung Electronics, SK Hynix, and Micron agreed that traditional 2.5D high-bandwidth memory (HBM) using interposers is approaching...