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Friday 16 October 2026
Nvidia-backed CoreWeave bond spike highlights debt risks in the AI infrastructure boom
A sharp sell-off across artificial intelligence infrastructure stocks has turned a quiet worry about debt into a main concern for Wall Street. The sudden drop in stock and bond prices...
Friday 16 October 2026
LG Innotek targets 2028 glass substrate supply as it expands beyond smartphones
LG Innotek expects to begin supplying glass substrates for advanced semiconductor packaging around 2028 and sees its chip substrate business improving in 2027, as the South Korean...
Friday 16 October 2026
AI buyers lock in capacity, driving Taiwan private investment to record NT$6.95T
Strong global demand for AI infrastructure hardware is prompting buyers to secure capacity through advance payments and long-term contracts, driving Taiwan's semiconductor, packaging...
Friday 16 October 2026
Japan's automakers turn to vehicle-road coordination to advance autonomous driving
Japan's automakers are presenting autonomous-driving systems that connect vehicles with road infrastructure as a route toward deployment, highlighting a strategic choice beyond vehicle-only...
Friday 16 October 2026
US pushes AI exports as chip industry flags supplier gaps and reshoring costs
At SEMICON West 2026, US officials and lawmakers promoted domestic manufacturing and AI export policies, while industry executives warned that supplier shortages, the premium for US-made...
Friday 16 October 2026
Meta releases Muse Spark Open weights, reversing its closed course with conditions
Meta on Thursday released the weights of Muse Spark Open, which it calls the most capable US open-weight model to date. The company said the multimodal model has 816 billion total...
Friday 16 October 2026
Hyundai Motor Group plans US$15.5 billion India investment from 2026
Hyundai Motor Group plans to invest approximately US$15.5 billion in India from 2026, expanding production, research, and partnerships as it positions the country as a base for domestic...
Friday 16 October 2026
Tong Yang sees stronger 4Q26 margins, but shipping, costs remain risks
Tong Yang Industry expects capacity utilization to reach 90%–95% in the fourth quarter of 2026, as North American aftermarket orders recover and support margins during the seasonal...
Friday 16 October 2026
AI traffic reshapes e-commerce as Shopline GMV rises 20% in 2026
As GenAI accelerates, e-commerce is shifting from traditional traffic management toward AI-assisted shopping and intelligent operations. Software-as-a-service (SaaS) e-commerce platform...
Friday 16 October 2026
AI investment risks rise as China models gain ground
As interest rates fluctuate, bond yields rise, and Chinese AI models intensify competition, market attention is shifting from technological development and infrastructure expansion...
Friday 16 October 2026
Samsung SDI targets 2027 LFP BBU battery production
Samsung SDI will begin mass-producing cylindrical lithium iron phosphate (LFP) batteries for AI servers as early as June 2027, marking the first adoption of cylindrical LFP backup...
Friday 16 October 2026
AI power crunch drives data center demand for self-generation
The focus of the global AI race has shifted from securing advanced chips to securing access to electricity, with electrical power now becoming the deciding factor for computing capacity...
Friday 16 October 2026
Cloud AI absorbs resources as non-AI semiconductors face prolonged downturn
Investment in AI data centers remains strong, but semiconductor growth is becoming increasingly concentrated in cloud AI, while the long-running decline in consumer technology prices...
Friday 16 October 2026
TSMC excludes CPUs from AI accelerator growth forecast
Taiwan Semiconductor Manufacturing (TSMC) is seeing rising demand for CPUs related to agentic artificial intelligence (AI), but has not yet included CPUs in its calculations of AI...
Friday 16 October 2026
Hesai moves beyond lidar as Kosmo targets physical AI's data bottleneck
As artificial intelligence increasingly blurs the boundary between the digital and physical worlds, complications associated with real-world deployment — particularly the extreme...