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Thursday 31 October 2024
Xiaomi CEO Lei Jun calls for understanding as advanced process inflation drives up smartphone prices
The era of advanced process inflation has arrived, with the price of 3nm processes continuing to rise. Key system-on-chip (SoC) components such as Qualcomm's Snapdragon 8 Elite and...
Thursday 31 October 2024
WinSemi sees support from satellite, Wi-Fi 7, optical communications despite weak China handset demand
GaAs foundry house Win Semiconductors (WinSemi) has offered a weak outlook for China's Android phone market in the fourth quarter of 2024, but expects significant results from satellite,...
Thursday 31 October 2024
Xiaomi targets Huawei and Apple with US$6.7 billion R&D push by 2025
Xiaomi, entering its fifth year in the high-end smartphone market, has once again rolled out its annual flagship phone, the Xiaomi 15, setting itself as a contender against Apple...
Wednesday 30 October 2024
EU slaps 45.3% tariff on Chinese EVs as China presses for unified talks
European electric vehicle sales fell short of expectations in the first half of 2024, capturing 14% of the market. Transport and Environment (T&E) points to fragmented green subsidies...
Wednesday 30 October 2024
TSMC reportedly halts supply to two suspected Huawei proxies, challenges from China’s intermediary networks persist
According to informed sources, TSMC has suspended supplies to at least two chip developers due to suspicions that these companies are attempting to circumvent the US government's...
Wednesday 30 October 2024
China pushing domestically developed AI chips and deployment of RISC-V structure, says DIGITIMES Research
DIGITIMES Research observes that China is rapidly advancing in the field of LLMs. Major technology giants such as Baidu, Alibaba, and Tencent have launched their self-developed LLMs...
Wednesday 30 October 2024
Samsung enters the SiPh race with I-Cube So/Eo, challenging TSMC and China's rising stars
Samsung Electronics and TSMC are ramping up the development of SiPh technology to handle the exponential data growth driven by AI applications. The Seoul Economic Daily reports...
Wednesday 30 October 2024
Google TPUs to achieve over 70% share in in-house developed cloud ASIC accelerator market in 2024, says DIGITIMES Research
According to DIGITIMES Research's report on cloud ASIC accelerators, the global shipment of self-developed cloud AI ASIC accelerators is projected to reach 3.45 million units in 2024,...
Tuesday 29 October 2024
China begins tightening rare earth supply
The Chinese government has significantly tightened restrictions on foreign companies, especially semiconductor manufacturers, making it much more difficult to acquire various rare...
Tuesday 29 October 2024
Unveiling Sophgo: TSMC's mysterious client and the compliance challenges facing Chinese firms
The ongoing controversy regarding Huawei's semiconductor dealings has led Sophgo, a Chinese client of TSMC, to clarify its relationship with Huawei. As the US imposes stricter export...
Tuesday 29 October 2024
BYD's October surge boosts Taiwan's supply chain gains in Q4
BYD's new energy vehicle (NEV) sales excelled in October, buoying the performance of its Taiwanese suppliers in the fourth quarter of 2024, according to market sources.
Tuesday 29 October 2024
Biden finalizes curbs on US investment in Chinese chip, AI tech
The Biden administration finalized restrictions on investments by US individuals and companies into advanced technology in China, including semiconductors, quantum computing, and...
Tuesday 29 October 2024
Automotive power semiconductor orders rise, yet market uncertainty persists
Taiwan-based makers have seen demand for power semiconductors pick up in China's automobile sector, but the automotive market remains challenging in the foreseeable future, according...
Tuesday 29 October 2024
China's 7nm smart driving chips gear up for production: SiEngine, Huixi eyes 2025-26 rollout
Several Chinese IC design houses are gearing up for volume production for smart driving applications in 2025 and 2026.
Monday 28 October 2024
Intel expands Chengdu facility with new server chip packaging and testing services
Intel announced plans to expand its Chengdu, Sichuan facility on October 28 to offer server chip packaging services. This expansion leverages the site's existing operations to address...