Soaring gold and copper prices, as well as losses resulting from the appreciation of the NT dollar, are likely to affect packaging and testing firms' gross margins in the fourth quarter...
IC packaging and testing house Advanced Semiconductor Engineering (ASE) plans to budget US$700 million in capex for 2011, flat on year, an unnamed company executive has been cited...
Supply of copper foils will likely fall short of demand in 2011 and 2012, being constrained by major makers' relatively conservative expansion plans, according to Tony Ke, president...
Taiwan-based Co-Tech Copper Foil expects its production of thin copper foils of below 0.5 oz will account for 62% of its total output in October 2010 compared to 57-58% currently.
Advanced Semiconductor Engineering (ASE) is slowing down the expansion of its copper wirebonding capacity due to low market visibility, according to a Chinese-language Economic...
Chip packaging and testing house Greatek Electronics, which mainly focuses on the consumer electronics segment, expects monthly revenues to top NT$10 billion (US$314 million) between...
Siliconware Precision Industries (SPIL) has revealed that another 600 copper wirebonders will be installed at its production sites in China and Taiwan during the third quarter. Total...
Taiwan-based Co-Tech Copper Foil plans to venture into the production of copper foil for car-use lithium batteries and will install needed facilities in the first quarter of 2011,...
Prices of copper foil and copper clad laminates (CCLs) are expected to drift lower in July 2010 due to a decline in copper prices on the international market, according to industry...
Chip packaging house Siliconware Precision Industries (SPIL) will raise 2010 capex budget by at least 30% from US$450 million to about US$585 million due to increased procurement...
Advanced Semiconductor Engineering (ASE) has decided to boost its 2010 capex to US$600-700 million from US$450-500 million it earlier planned, said company COO Tien Wu at a recent...
Most Taiwan-based CCL (copper clad laminate) makers, including Elite Materials (EMC), Nanya Plastics, Taiwan Union Technology (TUC) and Iteq, are running at full capacity at the moment...
Higher gold prices have prompted chip packaging houses to consider transferring rising material costs to customers. Advanced Semiconductor Engineering (ASE) started adjusting quotes...
Prices for copper foil, the raw material of copper clad laminates (CCL), are likely to drop 3-4% in June due to recent weakening copper prices, according to industry sources in Tai...
United Test and Assembly Center (UTAC) has seen sales generated from copper wire bonding account for 20% of its total revenues, according to company CEO Lee Joon Chung. Apart from...
