Semiconductor Manufacturing International (SMIC) is expected to enter volume production of chips built using 14nm FinFET process technology in the first half of 2019, fulfilling the...
While chipmakers and brand vendors of smartphones are striving to seek a preemptive presence in the segments of 5G IPs, patents and AP chips, the most critical 5G modem chip solutions...
PCB maker Apex International is expected to enjoy a strong first quarter of 2019, thanks to robust shipments of its automotive boards, according to company sources.
Taiwan-based Unitech Printed Circuit Board has taken the lead to incorporate smart manufacturing into the PCB sector, seeking to significantly boost yield rates and tap the market...
The world's top DRAM suppliers saw their operating margins climb to record highs in the third quarter of 2018, though their ASP increases started slowing down, according to DRAMeXchange...
Samsung Electro-Mechanics (SEMCO) under the Samsung group has been engaged in the development of fan-out panel-level packaging (FOPLP) technology for the production of application...
As international IDMs are moving at full throttles to develop lucrative high-voltage automotive MOSFETs, Taiwan mid-end and back-end supply chain players are gearing up to win long-term...
Wafer thinning technology is expected to play an increasingly crucial role in Taiwan's power discrete device supply chain, as the technology can work well to lower resistance and...
Leading mobile chipmaker Qualcomm has revealed that new iPhone models for 2018 may not adopt its modem chip solutions amid a patent royalty row between them. But supply chain sources...
Taiwan Semiconductor Manufacturing Company (TSMC) has started commercial production of chips built using 7nm process technology, according to company CEO CC Wei. The foundry is also...
Revenues of the global NAND flash industry dropped 3% sequentially to US$15.74 billion in the first quarter of 2018, when a seasonal slowdown in demand dragged down the memory prices,...
Lagging behind Taiwan Semiconductor Manufacturing Company (TSMC) in the development of fan-out wafer level packaging (FOWLP) technology, Taiwan's main OSAT (outsourced semiconductor...
Major China-based OSAT companies including Jiangsu Changjiang Electronics Technology (JCET), Tongfu Microelectronics and Tianshui Huatian Technology are all gearing up to compete...
IC substrate supplier Kinsus Interconnect Technology's net profits fell 78% on year to NT$491 million (US$16.8 million) in 2017. EPS for the year came to NT$1.10, down from NT$5.01...
Notebook hinge maker Sinher Technology is installing two more batch furnaces to expand in-house MIM (metal injection molding) production capacity to meet growing demand, bringing...
