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NEWS TAGGED 12-INCH
Tuesday 11 January 2011
Ilitek controls over 50% share of China's handset TFT LCD driver IC market
LCD driver IC design house ILI Technology (Ilitek) currently controls more than half of China's market for handset TFT LCD driver ICs, and expects shipments to continue to increase...
Thursday 6 January 2011
TSMC reportedly sees Nvidia orders increase by 60%
Taiwan Semiconductor Manufacturing Company (TSMC) reportedly has seen its Nvidia orders increase by 60% mainly because of strong demand for Tegra 2 processors. TSMC declined to comment...
Monday 27 December 2010
More details of Asustek 12-inch Eee Pad revealed
Asustek Computer is set to announce its 12-inch Eee Slate EP121 tablet PC featuring an Intel Core i5 processor with Windows 7 at Consumer Electronics Show (CES) 2011 and will start...
Tuesday 21 December 2010
Rexchip ramping up production for 2Gb DDR3
Rexchip Electronics is expected to output 20,000 12-inch wafers for 2Gb DDR3 memory in December, and allocate its entire capacity to produce 2Gb chips in the first quarter of 2011.
Thursday 16 December 2010
TSMC might consider 18-inch fab rather than another 12-inch
Instead of building a fourth 12-inch (300mm) fab, Taiwan Semiconductor Manufacturing Company (TSMC) might prefer to have its first 18-inch (450mm) production fab to be called "Fab...
Monday 6 December 2010
TSMC monthly 12-inch capacity to hike 37% in 2010, 30% in 2011, says chairman
Taiwan Semiconductor Manufacturing Company (TSMC) is expanding its monthly 12-inch capacity to 240,000 wafers at the end of 2010, rising by 37% from a year earlier, and the capacity...
Friday 12 November 2010
Taiwan-based LCD driver IC designers to adopt 12-inch processes soon
LCD driver IC design houses will transition into 12-inch processes at the end of 2010 to the first quarter of 2011. Chipbond Technology is currently the only backend chip packager...
Friday 5 November 2010
MPI sees LED equipment order visibility through 1Q11
MJC Probe (MPI) has seen its order visibility for LED probers and sorters extend to the first quarter of 2011, according to company president Steve Chen.
Tuesday 26 October 2010
Macronix scales up investment budget for 12-inch capacity expansion
Macronix International's board of directors has approved a budget of NT$27.5 billion (US$900 million) to expand capacity at its 12-inch fab, an increase of NT$7 billion from the company's...
Tuesday 5 October 2010
ChipMOS to expand into 12-inch gold bumping
Packaging and testing house ChipMOS Technologies (Bermuda) has revealed plans to add a new, 12-inch gold bumping production line in Taiwan with the installation set to complete by...
Wednesday 29 September 2010
Cando to triple touch panel module monthly capacity at Suzhou plant by the end of 2010
Cando, a subsidiary of AU Optronics (AUO), expects its touch panel module plant in Suzhou, China to have a monthly capacity of 600,000 units at the end of 2010, increasing from the...
Friday 17 September 2010
Macronix signs NT$18 billion syndicated loan
NOR flash and mask ROM chipmaker Macronix International has obtained a syndicated loan worth NT$18 billion (US$564 million) from 15 banks, to fund the smooth operation of its new...
Wednesday 15 September 2010
STATS ChipPAC opens new plant for 300mm eWLB wafer manufacturing
STATS ChipPAC on September 15 celebrated the opening of a new manufacturing facility to process 300mm wafers using embedded wafer-level BGA (eWLB) technology. The Singapore-based...
Wednesday 28 July 2010
Macronix to spend NT$30 billion on 12-inch fab over two years, says president
Macronix International will invest a total of almost NT$30 billion (US$936 million) in its recently-acquired 12-inch wafer fab at the Hsinchu Science Park (HSP), northern Taiwan in...
Tuesday 20 July 2010
Nanya steps up 12-inch fab expansion
DRAM maker Nanya Technology has ramped up wafer starts at its 12-inch fab to 40,000 units a month since July, and converted half of the production to 50nm, according to the company...