ProMOS Technologies was originally scheduled to determine a buyer for its 12-inch fab located in Taichung, central Taiwan, in an open bid held today (November 29). However, as bidders...
ProMOS Technologies will hold an open bid to liquidate its 12-inch fab at the Central Taiwan Science Park (CTSP) on November 29. Some industry watchers believe that Vanguard International...
Powerchip Technology may tear down its P3 12-inch fab and sell the production equipment and land separately if it cannot liquidate the plant in one lot. Potential buyers including...
Faced with increased competition from Powerchip Technology in the LCD driver IC foundry sector, Vanguard International Semiconductor (VIS) is actively pursuing a bid to acquire ProMOS...
ProMOS Technologies has announced plans to sell its 12-inch wafer plant and related facilities through open bidding by the end of 2012, in a move to become a fabless memory-IC comp...
LCD driver IC packaging and testing firm Chipbond Technology will see its 12-inch gold bumping lines operate at full capacity in September thanks to orders from Renesas Electronics,...
Consolidated revenues at Chipbond Technology are set to increase 5-10% sequentially in the third quarter of 2012, driven by strong demand for its 12-inch bumping services used for...
Samsung Electronics and Toshiba reportedly are mulling plans to decelerate capacity expansion at their 12-inch fabs in order to stop NAND chip prices from falling further, according...
Taiwan Semiconductor Manufacturing Company (TSMC) has no plans to take up Renesas Electronics' 12-inch fab in Tsuruoka, Yamagata prefecture, but will continue to maintain a close...
As Microsoft is aggressively preparing its Windows 8 and Windows RT for launch in October to compete against Apple, sources from notebook players pointed out that Microsoft and Intel...
United Microelectronics (UMC) on May 24 held a groundbreaking ceremony for the fifth and sixth phase (P5 and P6) construction of its 12-inch plant located in southern Taiwan. Equipment...
United Microelectronics (UMC) will soon break ground for the fifth and sixth phase construction of its 12-inch fab located at the Southern Taiwan Science Park (STSP), according to...
United Microelectronics (UMC) is scheduled to hold a groundbreaking ceremony for new factory buildings (Phase 5 and 6) at its 12-inch Fab 12A located at the Southern Taiwan Science...
Aptos Technology, which specializes in backend services for the production of NAND flash chips and devices such as microSD cards, announced March 13 that two of its subsidiaries will...
