Elephantech Inc., a Tokyo-based printed electronics manufacturer, has announced a breakthrough in developing general-purpose multilayer printed circuit boards (PCBs). The company's press release claims its proprietary SustainaCircuits™ technology is poised to revolutionize the industry by significantly reducing copper usage and production costs.
The company's technology was previously limited to single-sided flexible PCBs—a niche segment representing just 2% of the global PCB market. However, Elephantech's latest innovation now allows for the creation of rigid multilayer PCBs, which constitute 78% of the market. This breakthrough comes three years ahead of schedule, driven by advances in substrate compatibility and multilayer capability.
"This milestone enables us to replace a substantial portion of PCBs worldwide, offering both environmental and economic benefits," said Shinya Shimizu, CEO of Elephantech.
Technology breakthrough
The newly developed PCBs leverage a primer and copper nanoparticle ink designed for strong adhesion to FR-4, a widely used rigid substrate. The technology achieves heat resistance levels compliant with industry standards, maintaining adhesion strength even after prolonged high-temperature exposure.
Elephantech has also developed methods to form multilayer wiring, achieving 4-layer and 8-layer PCBs. Precision printing advancements have enabled wiring at 50/50 μm line and space (L/S), marking a significant improvement over the previous 100/100 μm standard.
Additionally, a combination of printing and electroplating processes allows for copper film thicknesses exceeding 100 μm. This capability addresses a critical limitation in printable electronics, enabling higher current flow essential for power applications.
Sustainable impact
SustainaCircuits™ technology reduces copper usage by approximately 70%, offering potential cost savings of over US$6.7 billion annually. This significant reduction is achieved by applying copper only where necessary, unlike traditional methods that rely on extensive copper foil usage.
The manufacturing process also streamlines production, cutting down manufacturing steps for multilayer PCBs. This efficiency further enhances its appeal to manufacturers looking to reduce environmental impact and operational costs.
Market expansion
With its ability to address nearly 78% of the global PCB market, Elephantech's innovation positions the company to significantly expand its reach. Most electronic devices, from consumer gadgets to industrial equipment, rely on rigid boards with six or fewer layers—a market segment now accessible through the company's new technology.
Future plans
Prototypes of the multilayer PCBs are expected to be available in the first half of 2025. Elephantech plans to integrate its printing equipment into conventional PCB manufacturing plants, enabling mass production with minimal additional investment. Additionally, the company is actively exploring partnerships for material and equipment distribution.
