Members in the TSMC Grand Alliance have been fully assured that their revenue and profit growth momentum will not slow down in the months ahead, bolstered by the foundry's better-than-expected...
Taiwan-based IC design houses remain optimistic about demand for server peripheral chips, which will be further strengthened in the second half of 2020, according to industry sourc...
ASE Technology has entered the supply chain of ZTE, providing advanced backend technology to volume process 5G base station chips developed in house by the Chinese vendor, according...
China-based cloud service providers and server vendors are keenly developing ASIC chips solutions on their own, particularly those for 5G base stations and servers, providing new...
Taiwan-based chipmakers are gearing up to fulfill robust orders for ASIC services from clients in China and even from the world's first-tier brand vendors that are seeking to enhance...
TSMC announced on March 3 the foundry has collaborated with Broadcom on enhancing the chip-on-wafer-on-substrate (CoWoS) platform to support the industry's first and largest 2X reticle...
Faraday Technology, a fabless ASIC service and silicon IP provider, expects to post an around 10% sequential decrease in first-quarter revenue. But revenue for the entire year is...
MediaTek has adjusted downward its 2020 projection for the world's 5G handset shipments to 170-200 million units from over 200 million due to the coronavirus outbreak, with the Chinese...
Taiwan-based ASIC solution suppliers have to delay postpone shipments to Chinese clients in the meantime amid the coronavirus outbreak, but their longer-term orders from China will...
The global market for memory and processing semiconductors used in artificial intelligence (AI) applications will soar to US$128.9 billion in 2025, three times the US$42.8 billion...
Taiwan-based IC backend houses plan to implement their capacity expansion projects in 2020 to satisfy growing demand for more complex chip designs and high-end testing, according...
Nepcon Japan 2020 running January 15-17 in Tokyo saw its first-day semiconductor forum steal the show with heavyweight firms TSMC and Micron shedding light on latest packaging technologies...
Chinese chipmakers are revving up development of HPC (high performance computing) chips for AI and deep learning applications, which are expected to become available for volume production...
