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Thursday 8 January 2026
Anthropic champions efficiency over scale in AI infrastructure race
AI startup Anthropic is taking a different approach to the AI infrastructure competition by prioritizing algorithmic efficiency and high-quality data rather than expanding compute...
Wednesday 7 January 2026
CES 2026: AMD's Lisa Su predicts YottaScale compute to be turning point
AMD CEO Lisa Su stated at CES 2026 that the industry has officially entered the "YottaScale" era, marking a shift toward new performance benchmarks. In an interview with CNBC,...
Wednesday 7 January 2026
CES 2026: Plaud launches NotePin S wearable recorder and desktop app
US AI device startup Plaud unveiled its latest wearable recorder, the NotePin S, alongside a new desktop application at CES 2026. The products aim to enhance real-time recording,...
Wednesday 7 January 2026
Naver doubles Google's search market share in South Korea in 2025
South Korea's leading internet company, Naver, secured a dominant position in the search engine market in 2025, capturing 62.86% of the South Korean market share, more than twice...
Wednesday 7 January 2026
CES 2026: Nvidia CEO spotlights humanoid robots, supply chain cites training gaps

Nvidia CEO Jensen Huang used his CES 2026 keynote to focus on agentic AI and Physical AI, outlining how the company is extending AI...

Wednesday 7 January 2026
CES 2026: Musk dismisses Nvidia's autonomous driving 'ChatGPT moment'
CES 2026 has become a muscle-flexing arena for advanced autonomous driving. Nvidia's CEO, Jensen Huang, used the stage to unveil a new "Vision-Language-Action" (VLA) model, Alpamayo...
Wednesday 7 January 2026
US stealth drone RQ-170 spotted after reported Venezuela operation

At least one of the US Air Force's most secretive drones, the RQ-170 Sentinel, may have supported the US operation on January 3 that saw...

Tuesday 6 January 2026
CES 2026: SK Hynix showcases next-gen AI memory solutions
SK Hynix Inc. said it will showcase its next-generation AI memory solutions at CES 2026, where it plans to operate a customer exhibition booth at the Venetian Expo in Las Vegas from...
Tuesday 6 January 2026
Supermicro expands manufacturing, liquid-cooling capacity for Nvidia Vera Rubin AI platforms
Supermicro announced expansions in manufacturing and liquid-cooling capabilities to support the deployment of data center-scale systems optimized for the Nvidia Vera Rubin and Rubin...
Tuesday 6 January 2026
Why China smartphone brands are turning to ByteDance's Doubao to break Apple-Huawei's hold on premium phones
Several Chinese smartphone brands are moving closer to Doubao, ByteDance's LLM platform, accelerating partnerships tied to AI smartphones. The shift reflects mounting pressure from...
Tuesday 6 January 2026
DEEPX Unveils Vision as a Physical AI Infrastructure Company at CES 2026

At CES 2026, DEEPX will present a new paradigm for AI infrastructure - one designed for the physical world. As AI expands beyond data centers into robots, mobility,...

Tuesday 6 January 2026
World's First Non-Invasive AI-Driven Blood Glucose Monitoring Technology Debuts

Actxa, a Singapore-based preventive health technology company, recently announced significant enhancements to its proprietary BGEM technology, the world's first clinically...

Monday 5 January 2026
TSMC 2nm leak probe leads to additional indictments for three people and Tokyo Electron

Taiwan's High Prosecutors' Office has filed a supplementary indictment against three additional suspects and the Japanese chip equipment maker...

Monday 5 January 2026
Taiwanese network equipment suppliers ramp up investments as shift to 800G and 1.6T standards proceeds
Driven by surging demand for AI and cloud data centers, the network equipment industry is rapidly advancing from 400G to 800G and beyond to 1.6T specifications. This technological...
Monday 5 January 2026
AI data centers pivot to HVDC as power management rivals memory in infrastructure priority

Nvidia's push for an HVDC 800V power design has opened a new growth window for the power management supply chain heading into 2026. IC...