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Monday 15 September 2025
XMC steps into key stage of China's silicon-on-insulator foundry drive, ahead of SMIC and Hua Hong
Since its IPO application was accepted by Shanghai's STAR Market in September 2024, Wuhan Xinxin Semiconductor Manufacturing Co. (XMC) has updated its prospectus to highlight its...
Friday 12 September 2025
SEMICON Taiwan 2025: AMD pushes panel-level, 3D, and optical packaging as AI demands soar
At SEMICON Taiwan 2025, AMD Fellow Daniel Ng, who heads the company's OSAT technology development, laid out a stark assessment of the semiconductor industry's next bottleneck: the...
Wednesday 10 September 2025
SEMICON Taiwan 2025: Memory giants compete in customized HBM race amid AI surge
The rising wave of artificial intelligence (AI) is driving the growing importance of high-bandwidth memory (HBM), which has become a core component of AI system architectures. The...
Tuesday 9 September 2025
China's ACM ships first KrF coater-developer to logic fab as local supply chain advances
As the global semiconductor industry undergoes rapid restructuring, Chinese equipment makers are racing to achieve breakthroughs and scale. ACM Research (Shanghai), Inc. has introduced...
Thursday 4 September 2025
Commentary: YMTC's 3D DRAM push challenges CXMT and global memory leaders
China's push to localize its memory supply chain is gathering momentum. YMTC has begun trial production at its first fully localized NAND flash fab, while market chatter indicates...
Thursday 21 August 2025
SJ Semiconductor advances 3D packaging as key Huawei partner, climbs global OSAT rankings
China's semiconductor packaging and testing firm SJ Semiconductor (SJ Semi) has made significant headway with the completion of its third production facility, J2C, in Jiangyin's high-tech...
Sunday 17 August 2025
TSMC’s top wafer testing partner posts 78% surge as new facility ramps
Xintec Inc., TSMC's backend packaging and testing unit, posted a strong second-quarter 2025 rebound in wafer probe revenue, driven by increased outsourcing from TSMC and the accelerated...
Thursday 14 August 2025
TSMC integrates CoWoS packaging with Coupe photonics for AI performance boost
Dr. Shang Y. Hou, Director of TSMC's High Performance Packaging Integration Division, delivered a keynote at the OCP APAC Summit 2025. He showcased how the chipmaker is combining...
Friday 8 August 2025
Samsung revives Z-NAND after 7 years to supercharge AI with 15x speed gains

Samsung Electronics is reviving its Z-NAND memory technology after a seven-year hiatus, positioning it as a high-performance solution...

Friday 1 August 2025
Macronix hit by forex losses in 2Q but stays on course for 2025 profitability
Macronix International reported a wider second-quarter 2025 loss, citing seasonal weakness and significant forex losses from the sharp appreciation of the New Taiwan dollar. President...
Monday 21 July 2025
Is computing the wrong focus? Lightmatter's 3D photonics tackles AI's data bottleneck
As AI workloads hit data movement bottlenecks, MIT spinoff Lightmatter is betting that photonics, not more transistors, holds the key to next-generation infrastructure. After years...
Monday 21 July 2025
Exclusive: YMTC to pilot fully China-made NAND line in 2025, eyes 15% global share by 2026
Yangtze Memory Technologies Co. (YMTC), China's top NAND flash maker, is advancing its push for equipment self-sufficiency. Supply chain sources say the company's first NAND production...
Friday 18 July 2025
InPsytech finalizes UCIe 2.0 compliant SoIC design for 3D heterogeneous integration
InPsytech, a leading company under the Egis Technology Group specializing in high-speed semiconductor IP solutions, has completed its advanced design for TSMC's Face-to-Face (F2F)...
Monday 14 July 2025
Taiwan chip firm Macronix seeks tech edge as US-China rivalry intensifies
Memory chipmaker Macronix is betting on advanced technologies to escape a bruising price war as US-China tensions reshape the global semiconductor landscape.
Thursday 10 July 2025
Semes' semiconductor cleaning process designated as South Korea's National Core Technology
Semes, the semiconductor equipment subsidiary of Samsung Electronics, has had its semiconductor cleaning process technology recognized by the South Korean government as a National...