Moore's Law will continue to be embraced as sort of a faith when it becomes inapplicable, but chiplets will have a chance to become the mainstream in future IC design, according to...

Taiwan's top test interface specialist Chunghwa Precision Test Tech (CHPT) and TSMC's re-invested backend house Xintec are both optimistic about their revenue prospects for fourth-quarter...

To expand presence in the automotive memory market, Macronix International has disclosed plans to enter volume production of 96-layer 3D NAND memory for automotive applications in...

Micron Technology has begun volume shipments of what the company claims is the world's first 176-layer 3D NAND flash memory.

Leading foundry houses are mostly partners rather than competitors for OSAT firms despite their aggressive deployment in advanced 3D IC packaging solutions, according to Amkor Technology...

IC testing solution provider Chunghwa Precision Test Tech (CHPT) and 3D sensor components packager Xintec have posted impressive revenue gains for the first three quarters of 2020...

Digital camera ODM and imaging solution provider Altek has developed 3D depth-sensing modules based on stereopsis technology and expects adoption for such modules to begin to increase...

GaAs foundry Win Semiconductors expects to post a revenue increase of 1-3% sequentially in the fourth quarter of 2020, with gross margin ranging from 37% to 39%.

Kioxia has announced it will begin to construct a fabrication facility, dubbed Fab 7, at its factory site in Yokkaichi, Japan to expand production of its proprietary 3D flash memory...

Macronix International, a supplier of mask ROM and flash memory, expects its in-house developed 48-layer 3D NAND products to start generating revenue in 2021.

Intel and SK Hynix have signed an agreement under which the latter would acquire the former's NAND memory and storage business for US$9 billion, according to the companies.

GaAs foundry Win Semiconductor and its backend partners including Elite Advanced Laser (eLaser) are engaged in production of VCSEL chips for ToF-based LiDAR scanner for the iPhone...

SSD developer Innodisk has rolled out its new 96-layer 3D TLC device lineup for enterprise and industrial applications, and is gearing up for end-market demand recovery next year.

GaAs foundry Win Semiconductors continues to enjoy a strong influx of orders for 5G PA and VCSEL components with clear order visibility through the fourth quarter, despite no orders...

Taiwan's optical filter specialist Kingray Photoelectric Technology is set to expand monthly production capacity for narrow band pass filter (NBPF) for 3D ToF (time of flight) modules...

ASE Technology has already seen its chip-first FOCoS (fan-out chip-on-substrate) production yield reach 95-96%, and plans to introduce its chip-last FOCoS packaging technology with...

TSMC has been stepping up the development of its advanced packaging business, with plans to open in 2021-2022 two new fabs dedicated to advanced packaging incorporating its newly...

CIS and 3D sensor packaging specialist Xintec saw its revenues for August 2020 climb 21.2% sequentially and 23.44% annually to a record high of NT$740 million with revenues for the...

TSMC and Samsung Electronics have seen their competition significantly heat up in advanced packaging technologies beyond foundry processes, which could eventually dent business opportunities...

Leading OSAT providers, such as ASE Technology, are expected to see revenues generated from their SiP businesses climb about 30% in 2020, driven by demand for 5G, AI and HPC device...

TSMC, ASE Technology, IC substrate makers including Unimicron Technology as well as international materials and equipment suppliers are all gearing up for the SiP (system-in-package)...

Materials analysis (MA), reliability analysis (RA) and failure analysis (FA) are increasingly needed by IC designers, wafer foundries and backend houses to support R&D projects...

GaAs foundry Win Semiconductors has reiterated its third-quarter 2020 revenues will post a sequential growth of 4-6% with gross margin staying at over 40%, despite uncertainty in...

TSMC is expected to continue its advanced packaging development focus on 3D SoIC (system on integrated chips) technology and organic interposer in 2021, although it has fabricated...

Samsung is stepping up its deployments in the 3D IC packaging field, looking to compete against TSMC starting 2022 for advanced chip packaging in-house, according to industry obser...