Changcun Capital, the investment arm backed by Yangtze Memory Technologies Co., has completed a strategic investment in RuiLiPingxin...

AI computing demand is rapidly driving up chip integration complexity, pushing advanced packaging competition beyond single-device...

ViTrox, which aims to be the World's Most Trusted Technology Company, is excited to announce its participation in SEMICON Taiwan 2026, one of the world's leading semiconductor...

Samsung Electronics is betting on new 3D memory architectures and tighter processor-memory integration as AI workloads put growing pressure...

SK Hynix is facing an expanding US patent dispute with MonolithIC 3D. A second US International Trade Commission (USITC) investigation...

AI memory startup NEO Semiconductor has unveiled X-SRAM, a new architecture designed to address the difficulty of scaling conventional...

SK Hynix is recruiting engineers in San Jose to co-design 3D stacked DRAM-on-logic with US customers, extending its custom memory strategy...