Powertech Technology (PTI) with its fan-out panel-level packaging (FOPLP) technology has obtained orders for high performance computing (HPC) solutions designed for AI and networking...

GaAs foundry Win Semiconductors plans to expand production capacity by around 5,000 6-inch wafers monthly in the second quarter of 2020 to meet ever-increasing compound semiconductor...

To reinforce application of AI to the fashion industry, Hong Kong Polytechnic University (PolyU) has developed the world's first FashionAI Dataset in collaboration with e-commerce...

China's Yangtze Memory Technologies (YMTC) has kicked off volume production of 64-layer 256Gb TLC 3D NAND chips, according to indsutry sources.

China's state-owned Tsinghua Unigroup has clinched a deal with the Chongqing municipal government to build its DRAM operations headquarters, R&D and manufacturing facilities in...

Upgrades in smartphone specs and features such as facial recognition, all-screen design and enhanced camera capabilities continue to drive related chip and component demand this year,...

TSMC continues to move forward with its 3D-IC integration technology development, pursuing cutting-edge performance resulting from heterogeneous components that are "seamlessly con...

Himax Technologies has announced that the company is teaming up with GTS to allow its structural light 3D sensing solution to be adopted for factory automation.

CMOS image sensor (CIS) packaging specialist Xintec has put increased focus on high-profit segments of healthcare, industrial control and automotive CIS applications, and expects...

GaAs foundry Win Semiconductors, and backend houses Xintec and ShunSin Technology have started ramping up shipments for structured light 3D sensing components in the third quarter...

Micron Technology has unveiled a new 12-inch fab at its manufacturing site for NAND flash memory in Singapore, and expects the facility to ramp up production in the second half of...

ShunSin Technology, Foxconn Technology Group's IC backend service affiliate, is expected to see revenues and profits hit the year's highs in September and October, bolstered by robust...

Epitaxial wafer supplier Visual Photonics Epitaxy Company (VPEC) has enjoyed a ramp-up in demand for vertical-cavity surface-emitting laser (VCSEL) components for use in smartphones...

SK Hynix saw its operating profits fall 89% from a year earlier to KRW638 billion (US$540.8 million) in the second quarter of 2019, when consolidated revenues slid 38% on year to...

Chipmakers are aggressively improving their new 96-layer 3D NAND process yield rates, looking to have the technology become the mainstream in 2020, according to industry sources.

Apple has reportedly asked its supply chain partner to supply VCSEL components for use in rear ToF camera lens in its mobile devices to be released in 2020, according to supply chain...

ASE Technology Holding, King Yuan Electronics (KYEC) and Lingsen Precision Industries are among the Taiwan-based backend houses looking to benefit from robust demand for MEMS sensors...

Epitaxial wafer supplier Visual Photonics Epitaxy Company (VPEC) is expected to see significant revenue increases for the third quarter of 2019 as it has started intensive shipments...

Foundries including Win Semiconductors and Advanced Wireless Semiconductor (AWSC), epitaxial wafer supplier Visual Photonics Epitaxy (VPEC), fabless chipmaker Himax Technologies,...

TSMC is widely expected to adjust downward its revenue and profit guidance for 2019 at its upcoming investor conference set for July 18 due to recent operational hiccups. But the...

Chipmakers have stepped up development of their respective 120/128-layer 3D NAND flash process technologies for cost competitiveness, and are gearing up to have the technology transitions...

NXP Semiconductor's Immersiv3D audio solution for the smart home market is expected to drive the growth in demand for home-use audio equipment thanks to its high cost-efficiency,...

Taiwan-based memory module makers have put increased focus on growing sales of their high-margin niche-market product lines to mitigate the impact of falling DRAM and NAND flash prices...

China's Yangtze Memory Technologies (YMTC) is likely to kick off volume production of 64-layer 3D NAND flash chips ahead of schedule, as it is striving to gain orders from Huawei,...

Toshiba Memory and Western Digital have finalized a formal agreement to jointly invest in the "K1" manufacturing facility that Toshiba Memory is currently constructing in Kitakami...