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Monday 24 August 2026
Analysis: SK Hynix pushes beyond HBM with HBF and CPO
SK Hynix is moving on several fronts as it pushes deeper into system-level memory competition. From high-bandwidth memory (HBM) and high-bandwidth flash (HBF) to a recently published...
Monday 24 August 2026
Rapidus 2nm ramp stays on track as Japan readies JPY150 billion investment

Rapidus' plan to begin volume production of 2nm chips in the second half of FY2027 remains on schedule, with rising demand from AI chips...

Monday 24 August 2026
Fujifilm opens new post-CMP cleaner plant at Oita to meet AI chip demand
Fujifilm has completed a new production building at its Oita Factory in Japan to make post-CMP cleaners, expanding capacity for materials used in advanced semiconductors amid rising...
Monday 24 August 2026
SEMI launches alliance to ride semiconductor materials boom
SEMI launched a semiconductor materials alliance on August 21, bringing together more than 400 companies to build a more resilient and competitive supply chain as Taiwan extends its...
Monday 24 August 2026
Taiwan speeds chip materials push with consumables, ITRI says

Taiwan is accelerating its drive for semiconductor materials self-reliance by starting with consumables and building toward higher-value...

Monday 24 August 2026
ASE's Huang urges AI profits to fund R&D for CPO, PLP

As chip processes move to 2nm and advanced packaging accelerates heterogeneous integration, semiconductor materials are shifting from...

Monday 24 August 2026
Taiwan semiconductor materials team up to build local supply chain

Taiwan's semiconductor materials industry is entering a new window of opportunity as advanced semiconductor process and packaging technologies...

Monday 24 August 2026
Podcast highlights: TSMC Arizona's profit turnaround, US manufacturing viability pressures South Korean memory makers
DIGITIMES analyst Luke Lin noted on a recent podcast that when reviewing TSMC's semiannual and first-quarter 2026 financial reports, the operational health and profitability of its...
Monday 24 August 2026
USITC opens cylindrical battery probe as China-Korea competition intensifies

The US International Trade Commission (USITC) has opened a trade investigation into certain cylindrical batteries and related products...

Monday 24 August 2026
Half of GenAI projects stall at PoC as data gaps widen
As generative AI spreads rapidly across enterprise operations, gaps in data foundations and governance are emerging as a key dividing line in how quickly AI projects move forward....
Monday 24 August 2026
AI packaging demand exposes supply-chain gaps for Taiwan materials makers
AI demand is pushing semiconductor manufacturing deeper into advanced packaging, and ASE vice president Hiro Huang said suppliers are meeting less than half of overall demand. He warned...
Monday 24 August 2026
iCometrue to Showcase Glass-Based AI Multichip Packaging Solutions at SEMICON Taiwan 2026

Interested in solving microcrack issues in through-glass via (TGV) fabrication? Want to learn how to supply 1,000 Watts, 1 Volt and 1,000 Amperes electricity to semiconductor...

Monday 24 August 2026
Taiwan's 'invisible champions' in chip materials are about to become visible, says GlobalWafers' Doris Hsu

Advanced process technology and new device architectures are reshaping the semiconductor supply chain — and the pressure is shifting...

Monday 24 August 2026
AMRA expands robot testing standard to cover legged systems
The Autonomous Mobile Robot Alliance (AMRA), formed by Taiwan's Industrial Technology Research Institute and industry, academia, and research partners, has released a new standard...
Monday 24 August 2026
AI chip boom lifts South Korean semiconductor materials makers' profits in 2Q26
The AI semiconductor investment boom is increasingly spilling over into the materials supply chain. South Korea's major semiconductor materials suppliers broadly improved profitability...