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Tuesday 1 September 2026
Autonomous driving expands into Physical AI, creating new openings for Taiwan firms
The autonomous driving industry is gaining momentum as advances in AI, sensing and semiconductor technologies expand opportunities in vehicle computing, machine vision and Physical...
Tuesday 1 September 2026
ASE CEO describes AI resource squeeze as a short-term problem
AI's early-stage growth is creating a short-term squeeze on land, talent, capital, and power in Taiwan, but there is no such thing as a world that cannot do without Taiwan, ASE Technology...
Tuesday 1 September 2026
Marvell CTO: power and density bottlenecks are driving CPO adoption in AI data centers
Speaking at the Silicon Photonics Global Summit ahead of Semicon Taiwan 2026, Marvell Technology CTO Radha Nagarajan highlighted that the core focus for upgrading connectivity in the...
Tuesday 1 September 2026
Commentary: DeepSeek out, SMIC in? TIME100 AI maps China's widening AI battleground
TIME unveiled its 2026 TIME100 AI list on August 27 with a notable change in its China lineup. DeepSeek founder Wenfeng Liang, named among the "Leaders" in 2025, disappeared...
Tuesday 1 September 2026
Samsung Electro-Mechanics takes glass substrates to SEMICON Taiwan
As AI packages grow larger, the next substrate battleground is rapidly extending from traditional organic materials to glass. Samsung Electro-Mechanics (SEMCO) will make its first...
Tuesday 1 September 2026
BYD's overseas business overtakes China for the first time as price war erodes domestic margins
BYD sold more abroad than at home in the first half of 2026, a threshold the company crossed for the first time and the clearest signal yet that the center of gravity of its car business...
Tuesday 1 September 2026
BYD widens overseas lead over Geely, but profits still lag
BYD and Geely Auto were nearly neck and neck in vehicle sales in the first quarter of 2026, raising expectations of a close contest between China's two leading new-energy vehicle makers...
Tuesday 1 September 2026
Research insights: AI Fabric optical interconnects move into racks as 400G/lane and CPO maturity emerge as key variables
DIGITIMES observed that as AI systems continued to scale, interconnect requirements inside AI data centers had expanded from chips, packages, and boards to racks, clusters, and eventually...
Tuesday 1 September 2026
Z.ai runs GLM inference on 100,000 Chinese AI chips, eyes overseas CSPs
Chinese large-model developer Z.ai says it can now support large-scale inference using roughly 100,000 domestically produced AI chips, while its GLM models are also moving closer to...
Tuesday 1 September 2026
LG Energy Solution secures long-term US lithium supply
LG Energy Solution has signed a long-term supply agreement with Smackover Lithium for battery-grade lithium carbonate, a move that could strengthen supply chains for energy storage...
Tuesday 1 September 2026
Anthropic's rumored US$35 billion Lambda deal shows how far Nvidia will go to bankroll its own customers
Anthropic has reportedly signed a cloud-computing contract worth US$35 billion with Lambda, an Nvidia-backed cloud provider, under which Nvidia itself holds the data center lease,...
Tuesday 1 September 2026
Cisco: CPO is ready for mass deployment amid surging AI data-center demand
For global cloud operators and network vendors, Cisco said co-packaged optics (CPO) is moving from lab promise to commercial necessity as AI data centers strain power budgets and bandwidth...
Tuesday 1 September 2026
Huawei's revenue climbs 9.6%, but AI, chips and HarmonyOS exact heavier R&D toll
Huawei Technologies increased first-half revenue in 2026 while profit fell sharply, highlighting the growing cost of its effort to build a self-sufficient technology stack spanning...
Tuesday 1 September 2026
China's humanoid robot cost cuts run into three bottlenecks
Humanoid robot scaling is still constrained by price, and Chinese humanoid robots — which command the largest global market share — show a sharp gap between consumer and...
Tuesday 1 September 2026
Taiwan's G2C+ Alliance members target global markets
Artificial intelligence (AI) chips are driving a new wave of integration competition among Taiwan semiconductor equipment makers. Taiwan's G2C+ strategic alliance, comprised of C Sun,...