Global supply chain: China market

China market news coverage

IN THE NEWS

Thursday 19 March 2026

China curbs, Middle East tensions drive surge in chip material risks from gallium to helium

Global semiconductor supply chains are facing rising pressure as Middle East geopolitical tensions and China's tightening export controls...

Thursday 19 March 2026

SK Hynix posts record pay, R&D, and capex in 2025

Driven by the AI dividend and a robust semiconductor market, SK Hynix's average employee annual salary reached KRW185 million (approx. US$124,494) in 2025, up 58.1% year-over-year...

Thursday 19 March 2026

Micron ramps spending as cleanroom constraints cap memory supply

Micron Technology's aggressive increase in capital spending signals that the memory industry is approaching structural limits to supply expansion, as artificial intelligence (AI) demand...

Thursday 19 March 2026

China's photoresist push moves from lab wins to mass supply

China's semiconductor materials localisation is shifting into commercial scale, with domestic photoresist suppliers moving from pilot validation to mass supply, marking a turning point...

Thursday 19 March 2026

Nexperia's China split sends orders to Taiwan

Nexperia's China unit has begun producing power semiconductors on 12-inch wafers. The move marks a decisive break from its Dutch headquarters and is sending ripple effects across global...

Thursday 19 March 2026

Amazon's Trainium 3 rumors clash with supplier optimism

Rumors circulating in the semiconductor market suggest that Amazon may scale back shipments of its upcoming Trainium 3 artificial-intelligence chip after internal tests reportedly...

Thursday 19 March 2026

Foldable phone shipments may near 30 million in 2026 as Apple enters market

Apple's entry into the foldable phone market, alongside established players Samsung, Oppo, and Huawei, is set to expand consumer choice and accelerate global market growth. The shift...

Thursday 19 March 2026

Tencent to double AI spending on 13% revenue growth as chip curbs reshape capex

Tencent is preparing a sharp escalation in artificial intelligence investment, with plans to more than double spending to over CNY36 billion (US$5.2 billion) in 2026, even as chip...

Thursday 19 March 2026

Column: OpenClaw pulls AI from cloud to the edge

OpenClaw's rapid rise has pushed "lobster-raising" from a niche developer trend into a cross-industry race spanning chips, hardware, and end devices.

Thursday 19 March 2026

As Chinese automakers push overseas, Western suppliers reclaim upper hand

Buffeted by a slower-than-expected shift toward vehicle electrification and electronic architectures—along with the crosscurrents...

Thursday 19 March 2026

Samsung maps out semiconductor strategy with multi-year contracts, Tesla chip on track for 2H27

At its recent annual shareholders meeting, Samsung Electronics addressed questions about the current memory market supercycle and shared insights into its semiconductor strategy amid...

Thursday 19 March 2026

Column: OpenClaw ignites China's AI agent land grab

OpenClaw's "lobster-raising" wave is moving from developers into China's internet and software sectors at speed in early 2026. Unlike earlier large-model races centred on parameters...

Thursday 19 March 2026

Analysis on Micron's strategic pivot: de-commoditizing the memory industry

The most significant revelation from CEO Sanjay Mehrotra during Micron's earnings call was the structural shift in how the company engages with...

Thursday 19 March 2026

Analysis: China's on-device AI chipmakers rush to supply OpenClaw, race for edge AI silicon leadership

OpenClaw is forcing a rethink of the AI hardware stack, shifting the locus of deployment from cloud-based interaction to autonomous, always-on agents running locally on devices.

Thursday 19 March 2026

China's mature-node push gathers pace: Nexchip, Silan, Hua Hong step up capacity and integration

China's semiconductor strategy is shifting from leading-edge competition to strengthening mature and specialty nodes. Facing geopolitical...

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