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Thursday 4 June 2026
800VDC could reshape data center power markets as regulation and supply chains lag
Data center power systems are nearing a major transition as GPU rack densities rise toward the 600 kW range. A new report from SemiAnalysis said 800VDC direct-current distribution...
Thursday 4 June 2026
BOE races Samsung for Gen 8.6 OLED title despite low yield

BOE is preparing to hold a mass-production shipment ceremony for its Gen 8.6 IT OLED line in mid-June, positioning the Chinese display...

Thursday 4 June 2026
RISC-V will be 'default ISA of choice' for all new chip designs, architecture's CEO predicts
Andrea Gallo, CEO of RISC-V International, used his appearance at the MIPS Forum during Computex 2026 to declare that RISC-V has completed its transition from academic project to industrial...
Thursday 4 June 2026
Kioxia weighs new NAND fab as AI demand drives long-term expansion plans
Kioxia is evaluating the construction of a new NAND flash manufacturing facility at its Kitakami site in Iwate Prefecture, aiming for production to begin after 2029-2030 as the company...
Thursday 4 June 2026
As satellite networks expand, telecom operators gain influence
The race to build space-based internet networks is accelerating. But as thousands of low-Earth orbit satellites enter orbit, a more fundamental question is taking shape: who will control...
Thursday 4 June 2026
Huawei's Tau Law exposes China's EDA gap; Empyrean advances memory chip design tools
Huawei's recently proposed Tau Law has drawn attention across the semiconductor industry, with the company arguing that chip performance can be improved by reducing the internal signal...
Thursday 4 June 2026
E Ink and BMW advance automotive color-changing tech toward market readiness
Taiwan-based electronic paper leader E Ink Holdings is preparing to bring its color-changing vehicle technology to market after overcoming key regulatory and technical hurdles with...
Wednesday 3 June 2026
Notebook shipment update, April 2026
Affected by weakened channel stocking momentum and a high base period, shipments of the top five notebook brands fell 33% sequentially in April 2026.
Wednesday 3 June 2026
Micron's HBM4 push signals bigger Nvidia supply role
Micron Technology may supply more HBM4 memory for Nvidia's next-generation Vera Rubin platform than the market currently expects, as the US memory maker ramps up equipment investment...
Wednesday 3 June 2026
Liteon: RTX Spark could turn AI PCs into personal assistants
Liteon Technology showcased AI power management and liquid cooling solutions at COMPUTEX 2026, highlighting technologies aimed at supporting both AI PCs and next-generation AI data...
Wednesday 3 June 2026
The robotics future will arrive in stages, Qualcomm exec predicts
Qualcomm's view of the robotics industry points to a market that is rapidly taking shape, but along sharply diverging paths of complexity and time horizon.
Wednesday 3 June 2026
NAND market hits record as YMTC closes in on global rivals
The global NAND flash memory market reached a record US$46 billion in revenue in the first quarter of 2026, driven by AI infrastructure demand, higher enterprise SSD shipments, and...
Wednesday 3 June 2026
Naura pushes into AI chip packaging with first 600mm PLP descum tool
Naura Technology Group has shipped its first 600mm × 600mm panel-level packaging descum tool, marking a key step in the Chinese semiconductor equipment maker's move from wafer-level...
Wednesday 3 June 2026
Google's AI glasses to boost wearable shipments to 17.5 million in 2026
Google moved into the AI glasses market with new Android XR smart glasses co-developed with Samsung Electronics and partnerships with eyewear brands, and the entry is expected to lift...
Wednesday 3 June 2026
Middle East war drives LME aluminum to 4-year high, squeezing chip equipment margins
Rising global geopolitical risk and tightening supply in some markets have pushed London Metal Exchange (LME) aluminum prices higher in volatile trading, adding cost pressures to industries...