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Tuesday 16 December 2025
China's BOE fast-tracks 8.6G OLED expansion, closing in on Korean rivals
China's BOE Technology is rapidly advancing its 8.6-generation IT OLED production, signaling an aggressive push to close the gap with South Korean rivals. Reports indicate the company...
Tuesday 16 December 2025
Shanghai AI conferences signal pivot from model hype to embodied intelligence reality
In 2025, Shanghai hosted two AI conferences that spotlighted its tech advantages and featured the Global Developer Pioneers Summit (GDPS) 2025 competition, which emphasized practical...
Tuesday 16 December 2025
Dolphin Semiconductor shifts toward platform-led, mixed-signal IP in HCLTech collaboration
French semiconductor IP vendor Dolphin Semiconductor said its collaboration with HCLTech reflects growing demand for pre-optimized, platform-based system-on-chip development, as energy...
Tuesday 16 December 2025
Baidu's Kunlunxin spinoff mirrors Google's TPU playbook
Baidu confirmed on December 7, 2025, that it is evaluating the spin-off and listing of its AI chip unit, Kunlunxin. This announcement came just one day before the US permitted H200...
Tuesday 16 December 2025
OLED demand surges, lifting South Korea's display makers to record outlook
The global market for OLED display panels is entering its seasonal peak in the second half of 2025, and South Korea's leading panel makers—Samsung Display and LG Display—are...
Tuesday 16 December 2025
Samsung steadies 12-Layer HBM3E, eyes larger Google TPU orders
Samsung Electronics has reportedly stabilized the performance of its 12-layer high-bandwidth memory, a development that could allow the company to expand shipments to Google's artificial...
Tuesday 16 December 2025
Commentary: Broadcom and MediaTek face profit challenges amid growing ASIC orders
Broadcom reported strong AI-related order growth but noted lower gross margins for ASIC products compared to non-AI items, causing market uncertainty about 2026 revenue. Industry...
Tuesday 16 December 2025
China's chip resilience: Naura M&A, ACM's HBM push defy US export controls
Escalating US-China tech rivalry and the politicization of the supply chain are accelerating a structural transformation in the global semiconductor equipment sector. While the US...
Tuesday 16 December 2025
Acer CEO urges firms to boost resilience amid memory price surge
Acer chairman and CEO Jason Chen has pointed out that soaring memory prices have triggered ripple effects across the market, driving up costs and retail prices, which in turn impact...
Tuesday 16 December 2025
Taiwan's AI exports surge on US demand, Europe emerges as key future market
Taiwan has experienced a substantial rise in exports of AI and high-performance computing products, driven mainly by heightened demand from the US. Between January and November 2025,...
Tuesday 16 December 2025
Apple braces for DRAM cost surge as Korean suppliers reprice contracts
Apple is facing renewed cost pressure as its long-term DRAM supply contracts with South Korean memory makers approach expiry in January 2026, heightening concerns that higher component...
Tuesday 16 December 2025
Notebook market may see second consecutive year of seasonal demand distortion in 2026
The notebook market is expected to encounter an unusual shift in seasonal demand for a second consecutive year, with 2026 poised to replicate the disruption seen in 2025. While geopolitical...
Tuesday 16 December 2025
Japan's $65 Billion Bet: Inside the Government's Semiconductor Revival Plan

In 1988, Japanese firms controlled 51% of worldwide chip sales, dominating memory production and manufacturing equipment. Fast forward to 2019, and that share had steadily...

Tuesday 16 December 2025
Dimerco leverages Asia logistics expertise to navigate complex 2026 freight market

Taipei, December 11, 2025: Dimerco Express Group ("Dimerco") has announced that it is strengthening its integrated, Asia-focused logistics solutions to help customers...

Tuesday 16 December 2025
Taiwan, South Korea strengthen startup ties at COMEUP 2025
Taiwanese startup accelerator AppWorks and South Korea's SparkLabs participated in COMEUP 2025, a prominent startup event in Seoul, underscoring growing collaboration between the...
Wednesday 23 December 2015
Samsung PRO Plus 128GB microSD cards
Samsung Electronics has unveiled its PRO Plus 128GB microSD card series, which is built with company's MLC NAND flash solution. With the introduction of its new 128GB microSD card, Samsung provides consumers with a memory card solution for capturing heavy-loaded, high-resolution video, photography and multimedia contents for use in today's mobile devices. The PRO Plus 128GB microSD is the newest addition to Samsung's PRO Plus lineup, which was first introduced in 32GB and 64GB versions in May 2015. The 128GB microSD features the highest-quality MLC NAND flash memory and UHS-I Speed Class 3 (U3) and Speed Class 10 support, offering the industry's fastest speeds of up to 95MB/s and 90MB/s for read and write respectively, Samsung said. The new PRO Plus 128GB microSD is meant for use in high-end smartphones and tablets, as well as fulfilling the security, capacity, performance and environment requirements inherent in newly emerging audio and video consumer electronics, specifically action cameras and drones. The new memory card is equipped to handle storing and transferring professional-grade photos and 4K UHD video recording and playback. It can record up to three hours and 50 minutes of 4K UHD video or 16 hours and 20 minutes of Full HD video in action cameras without the need to change or replace the memory card. In addition, the PRO Plus 128GB microSD can store a maximum of 10,940 photos or 30,670 MP3 songs based on Samsung's estimated user settings and configurations. Samsung will now offer the new PRO Plus 128GB microSD memory card in more than 50 countries including China, Europe, Korea, the US and other regions.