Huawei and Qualcomm announced on Oct. 5 that they had signed a multi-year patent licensing agreement covering technologies including 5G, computing, AI and networking.

The boundary for adopting external capacity is changing, as workloads that previously needed memory offload because of insufficient high-bandwidth memory (HBM) can now run directly...

Towa plans to build a new factory in Kyoto Prefecture to produce assembly and packaging equipment for advanced semiconductors used in artificial intelligence applications.

Once the global leader in robot vacuums, iRobot is trying to regain ground after bankruptcy restructuring and its takeover by contract manufacturer Shenzhen Picea Robotics. The global...

The global artificial intelligence landscape is witnessing an accelerating divide. While Silicon Valley grapples with escalating safety debates and regulatory friction, Chinese tech...

Chinese AI company Z.ai is expanding its overseas commercialisation through Amazon Bedrock, with AWS adding GLM-5.3 on October 6 and sharing revenue with Z.ai based on model usage.

SpaceX's Starship reached Earth orbit for the first time on its 14th test flight and deployed 26 next-generation Starlink V3 satellites. Whereas the previous 13 flights primarily focused...

Formosa Automobile, a member of Taiwan's Formosa Plastics Group, unveiled the new-generation DAF XF long-haul tractor on October 6, introducing 35-ton and 43-ton models for heavy-haul...

Chinese AI startup DeepSeek is poised to raise more than CNY80 billion (approx. US$11.9 billion) in its latest funding round, as it builds capital ahead of a potential domestic initial...

TSMC will hold its third-quarter earnings call on October 15 this year.

Huawei is backing near-packaged optics (NPO) rather than co-packaged optics (CPO) for its next-generation AI infrastructure, arguing that NPO offers a better balance of cost, manufacturability,...

The global household cleaning robot market grew by double digits in 2025, making it a key area for smart home development and intense competition in smart home devices. After filing...

Dassault Systèmes is pitching its virtual twin software as the link between India's chip design base and the factories and packaging plants now being built under the country's...

The traditional market divide between the third-generation semiconductors gallium nitride (GaN) and silicon carbide (SiC) is seeing greater overlap in 2026, with SiC increasingly encroaching...

India's young chip industry is becoming a contest among the world's largest semiconductor equipment makers, with Canon the latest to declare its interest. The race remains at an early,...