FIC Group opened its PRO3C (Malaysia) Sdn. Bhd. manufacturing facility in Johor, Malaysia, on October 15, expanding its optical communications production footprint in Southeast Asia...

SK Hynix is seeking US approval to ship additional American chipmaking equipment to its NAND flash facility in Dalian, China, linking the request to a potential investment in a new...

Chinese semiconductor equipment maker AMEC plans to develop 102 new equipment models over the next three to five years, backed by nearly CNY13 billion (≈ US$1.94 billion) in...

Samsung Electronics has reportedly completed development of next-generation 4F² DRAM technology and is aligning commercialization with customer requirements, even as China's ChangXin...

On October 15, 2026, TSMC reported its sixth consecutive quarter of record net profit, with third-quarter earnings rising 68.7% year-over-year to NT$763.06 billion (approx. US$23.6...

On October 13, Huawei unveiled the detailed architecture of its Kirin 9050 Pro chip for the first time at its Lianqiu Lake research center in Shanghai, outlining advances in LogicFolding...

In October 2022, the US Bureau of Industry and Security (BIS) imposed a package of export restrictions on China, including controls on equipment and components for manufacturing 3D...

Apple launched the HomeView smart display at its "Welcome Home" event on October 13, priced at US$299. It's scheduled to debut in eight countries: the US, the UK, Canada, Australia,...

GlobalFoundries (GF) has reached a multiyear manufacturing agreement with TSMC to expand silicon interposer capacity at its Malta fab in New York, supplying TSMC's Chip-on-Wafer-on-Substrate...

Taiwan Perovskite Solar Corp. (TPSC) showcased its theme, "PEROVSKITE AI," at Energy Taiwan 2026, highlighting a two-way synergy between artificial intelligence and perovskite technology...

South Korea's LX Semicon is seeking buyers for more than 60 silicon carbide (SiC) power semiconductor patents, winding down a business it entered five years ago to reduce its reliance...

Competition in the global PC market is shifting from a focus on shipment volumes of low-cost models towards premium, high-performance devices, intensifying the race in OLED display...

Apple reached a historic financial milestone by closing above a US$5 trillion market capitalization for the first time, ending the trading session at US$5.005 trillion (US$342.96 per...

AI chips are becoming harder to build, but that complexity is also creating new opportunities for semiconductor equipment suppliers. Applied Materials says rising transistor counts,...

Applied Materials sees advanced packaging as a key growth lever as AI chips move to multi-die designs, with the company projecting more than US$5 billion in related revenue in the...