With analog sales of US$10.9 billion and 19% marketshare, Texas Instruments (TI) maintained its firm grip as the leading supplier of analog devices in 2020, according to IC Insights...

TSMC will be stepping up its advanced process capacity expansion through 2023, according to company CEO CC Wei.

US-based server maker Supermicro expects to complete constructing a new plant at its manufacturing site in Taoyuan, northern Taiwan, in July 2021. Once the facility comes online,...

Taiwan-based ACX, specializing in LTCC (low temperature co-fired ceramic) components for RF front-end modules, is set to complete a 40% capacity expansion in the third quarter, adding...

Taiwan-based Wendell Industrial, a supplier of EMC (electromagnetic compatibility) and other circuit protection components, is upbeat about its operations in the third quarter of...

The amounts of capex set by Korea's top-three telecom operators, SK Telecom (SKT), Korea Telecom (KT) and LG U+, in 2021 and 2022, respectively, will be higher than those seen in...

With more mmWave-capable and HPC chip designs being developed, AiP, 3D stacking and other advanced packaging technologies will be increasingly needed for commercial applications,...

More than 50% of Apple's next-generation iPhone devices slated for launch in the latter half of 2021 reportedly will support 5G mmWave technology, according to industry sources.

Intel has announced two new additions to the lineup of 11th Gen Intel Core processors and introduced its first 5G product for the next generation of PC experiences, Intel 5G Solution...

Acer has introduced a new lineup of Chromebooks, gaming and ultra-thin notebooks targeted at users working and learning from home.

Taiwan ABF substrate makers have been running their production lines at full capacity, with new orders unlikely to be fulfilled until 2023, according to industry sources.

Chinese vendors have yet to release mmWave 5G models and corresponding infrastructure construction in China remains slow, according to industry sources.

Semiconductor manufacturers worldwide are on track to boost 200mm fab capacity by 950,000 wafers, or 17%, from 2020 through 2024 to reach a record high of 6.6 million wafers per month,...

Backend house ASE Technology will have its in-house developed embedded die technology, dubbed "Advanced Embedded Active System Integration (aEASI)," mainly applied to processing automotive...

Taiwan-based IC testing houses including King Yuan Electronics (KYEC), Sigurd Microelectronics and Ardentec have all kicked off R&D for more advanced 3nm-made chips, while also...