Toshiba reduced its holding in Kioxia Holdings to 15.1% as of July 15, according to filings reported by Nikkei and Reuters. The change report, submitted to Japan's Kanto Local Finance Bureau on July 23, showed the Japanese conglomerate's stake had fallen from 16.1% in the previous filing on May 11.
WIN Semiconductors, a gallium arsenide (GaAs) foundry, reported consolidated revenue of NT$5.26 billion (US$178 million) for the second quarter of 2026, up 14.5% sequentially and 39% year over year, driven by improved product mix, higher shipment volumes and the ramp-up of new products.
TSMC supplier LCY Group President Bowei Lee said private equity firm KKR & Co. plans to gradually divest its holdings in businesses affiliated with the Taiwanese chemical group, a move he believes will give the company greater flexibility to accelerate its expansion in semiconductor materials.
Pantheon Electric said it has completed the acquisition of four manufacturers and built an integrated power infrastructure platform across 21 factories in North America and Europe. The company said the expansion came as AI data centers, grid upgrades, and US manufacturing drove stronger demand for copper-based infrastructure.
This excerpt of DIGITIMES analyst Luke Lin's podcast looks at two major themes: SK Hynix's openness to building in the US and the logic behind TSMC's extra US$100 billion investment pledge.
SK Group and Nvidia have announced a comprehensive partnership valued at more than $500 billion, spanning AI factory construction and next-generation memory supply, with letters of intent signed at an AI summit on Thursday.
South Korean President Lee Jae-myung and a delegation of the country's most powerful business leaders convened with NVIDIA founder and CEO Jensen Huang in Silicon Valley this week, in a series of meetings and public appearances that cast Korea as a cornerstone of the global AI infrastructure push.
AI infrastructure investment is reaching unprecedented levels, with estimates showing it will lift global semiconductor output past US$1 trillion in 2026, four years earlier than previously expected, and expand the market to US$1.5 trillion by 2030. SEMI Global Chief Marketing Officer Terry Tsao said nearly 89 fabs are in the planning or construction pipeline for 2026-2030 to meet surging AI chip demand, with another 50 fabs expected to be planned for 2030-2035.
Rapidus is treating advanced packaging as a central part of its 2nm foundry strategy, not a downstream assembly service. The Japanese chipmaker aims to connect design enablement, front-end wafer processing, chiplet integration, packaging, testing and manufacturing data through its Innovative Integration for Manufacturing (IIM-1) model.
Taiwan's semiconductor industry is expanding overseas while deepening cooperation with the US, Europe, and Asia across advanced packaging, AI infrastructure, research, talent, cybersecurity, and international standards.
Huaqin Technology, the world's largest consumer-electronics original design manufacturer, has again increased its stake in Chinese foundry Nexchip Semiconductor, underscoring how contract manufacturers increasingly view direct ownership of chip capacity as central to supply-chain security rather than a purely financial bet.
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