DIGITIMES Semiconductors news

Apr 27

TSMC's refusal of ASML's expensive High-NA EUV equipment, explained

ASML has launched its 0.55 High Numerical Aperture Extreme Ultraviolet (High-NA EUV) in an effort to extend Moore's Law. The market had originally expected TSMC to adopt it first, but the company has held back. TSMC Senior Vice President of Global Business Kevin Zhang stated at the North America Technology Symposium that there are currently no plans to introduce High-NA EUV before 2029, mainly because "it's too expensive!" This decision also reflects how TSMC is shifting competition focus from equipment to process integration and cost efficiency.

TSMC trade secret theft ends in 10-year sentence, $4.6M fine against Tokyo Electron

Apr 27

HCL-Foxconn JV taps Taiwan's CTCI to build India OSAT facility

Apr 27

DIGITIMES Insight: Will TSMC's 3nm expansion put Samsung's 2nm bid on the back foot?

Apr 27

Tata's India chip fab faces leadership churn and engineering hurdles amid uneven but continuing progress

Apr 27

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MEMORY CHIPSWuhan unveils US$38 billion plan; YMTC and XMC lead memory expansion

Apr 28, 10:51

China's central tech hub Wuhan has unveiled its 2026 major project plan, targeting 355 city-level projects with total investment exceeding CNY260 billion (approx. US$38.1 billion).

IC DESIGN, DISTRIBUTIONCadence signals strong start to 2026 as AI drives growth across EDA and IP

Apr 28, 10:20

Cadence Design Systems reported a robust first quarter for 2026, underscoring how accelerating demand for AI is reshaping semiconductor design and expanding the role of electronic design automation (EDA) tools.

IC MANUFACTURINGStrong demand and advanced packaging execution drive Amkor's upbeat quarter

Apr 28, 09:40

Amkor Technology reported a strong start to 2026, with management attributing the performance to robust demand across multiple end markets and continued execution in advanced packaging.

IC DESIGN, DISTRIBUTIONAI-driven demand and record backlog fuel Cadence's strong start to 2026

Apr 28, 09:32

Cadence Design Systems reported a solid first quarter for 2026, with growth driven by accelerating AI demand and sustained customer investment in chip and system design tools.

IC MANUFACTURINGTSMC 2nm leak case results in NT$150M fine for TEL; company says no confidential data was leaked and discussions are underway

Apr 28, 07:33

In the trade secret leak case involving TSMC's 2nm process, the Intellectual Property and Commercial Court ruled on April 27, 2026, that Tokyo Electron (TEL), the equipment supplier involved, must pay a fine of NT$150 million (US$4.8 million), marking the first penalty imposed on a legal entity under the National Security Act.

IC MANUFACTURINGWhy the AI boom still runs through Taiwan — and why that won't change

Apr 28, 07:30

As trade tensions simmer and geopolitical flashpoints multiply, Taiwan's technology sector is holding firm. Anchored by surging AI infrastructure demand and a pivotal shift in how its chips reach the world, the island's economy is on track for its strongest growth in years — and industry experts say the fundamentals have rarely looked more solid.

PASSIVE, PCB, OTHER IC COMPONENTSAI chip testing complexity lifts probe card and upstream supply chain demand

Apr 28, 07:29

As AI chips move to advanced process nodes and packaging technologies, semiconductor testing requirements are becoming significantly more complex.

MEMORY CHIPSAI lifts memory: SK Hynix hits 72% margin as Samsung nears 70%

Apr 28, 07:25

SK Hynix reported record results for the first quarter of 2026, with operating margin reaching about 72% — among the highest globally — as artificial intelligence (AI)-driven demand lifted memory pricing, according to company disclosures and Korean media reports.

IC DESIGN, DISTRIBUTIONMoore Threads hits first profit, AI compute orders drive growth

Apr 28, 07:24

China's domestic GPU developer Moore Threads is shifting from heavy R&D spending to early monetisation, delivering triple-digit revenue growth in 2025 and its first quarterly profit in early 2026, driven by rising AI compute demand.

IC MANUFACTURINGCommentary: Tim Cook's sole omission during 15-year tenor

Apr 28, 07:23

On December 6, 2022, Tim Cook stood on a construction site in Phoenix, Arizona, alongside President Biden, TSMC founder Morris Chang, and Nvidia CEO Jensen Huang. It was the tool-in ceremony for TSMC's first Arizona fab, a moment that crystallized how central Taiwan's semiconductor industry had become to American technology ambitions. For Cook, it was also the closest he ever got to TSMC's leadership in 15 years as Apple's CEO.

IC MANUFACTURINGDIGITIMES: Enterprise AI shifts toward inference as computing architectures undergo structural realignment

Apr 27

As enterprise adoption of generative AI accelerates, a new phase of infrastructure demand is beginning to take shape. According to DIGITIMES' special report, Accelerating enterprise AI: Hardware advancements and compute architecture transformation, the industry is moving beyond the initial buildout of training capacity and into a stage defined by large-scale deployment—where inference workloads are emerging as the primary driver of compute growth.

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