Japanese auto parts supplier Denso said on April 27 that it is considering all options, including withdrawing its acquisition proposal for chipmaker Rohm, after failing to secure the company's support.
Global outsourced semiconductor assembly and test (OSAT) leader ASE Technology Holding (ASEH) held its 2025 ASE Supplier Award ceremony, inviting more than 100 suppliers of packaging and testing equipment, raw materials, components, and processing, along with its subsidiaries Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL), and Universal Scientific Industrial (USI).
ASML has launched its 0.55 High Numerical Aperture Extreme Ultraviolet (High-NA EUV) in an effort to extend Moore's Law. The market had originally expected TSMC to adopt it first, but the company has held back. TSMC Senior Vice President of Global Business Kevin Zhang stated at the North America Technology Symposium that there are currently no plans to introduce High-NA EUV before 2029, mainly because "it's too expensive!" This decision also reflects how TSMC is shifting competition focus from equipment to process integration and cost efficiency.
Below are the most-read DIGITIMES Asia stories from the week of April 20-27, 2026:
As the AI buildout accelerates and chipmakers race to secure advanced process capacity, TSMC finds itself in an increasingly commanding position.
MediaTek's application-specific integrated circuit (ASIC) business is drawing market attention as volume production of Google's tensor processing units (TPUs) is expected to ramp from the second half of 2026. Views differ on how fast the segment will grow, though some estimates suggest ASIC revenue could overtake smartphone chips by 2027 to become the company's largest revenue source.
South Korea and Vietnam have expanded cooperation across technology, energy, and infrastructure, signing dozens of agreements during Korean President Lee Jae-Myung's visit to Hanoi, as both countries seek to reinforce supply chain resilience amid global volatility.
India is accelerating its semiconductor ambitions, from Micron Technology's Sanand ramp to new fabrication and advanced packaging projects, while expanding design partnerships. At the same time, regulatory pressure on Apple, weakening smartphone demand, and solar policy tensions highlight challenges alongside growing global supply-chain integration.
Driven by AI, demand for high-bandwidth memory (HBM) is surging, causing a supply shortage in DRAM and prompting cloud service providers to pre-book capacity for the next two years. The rising need for larger HBM capacities is expected to grow exponentially, while 3D DRAM technology emerges as a solution to overcome current process scaling limits.
Cerebras Systems filed for an initial public offering (IPO) on April 17, 2026, aiming to list on the Nasdaq. The company reversed its fortunes with US$510 million in revenue and a net profit of US$87.9 million in 2025, compared to US$290 million revenue and a net loss of US$484.8 million in 2024.
Tata Electronics' flagship semiconductor fabrication project in Dholera, Gujarat—long viewed as India's most ambitious attempt to build a domestic chip manufacturing ecosystem—continues to move forward but remains marked by repeated setbacks alongside visible progress. While construction activity and regulatory milestones indicate momentum, leadership exits and complex site conditions underline the challenges of executing a greenfield fab at global scale.
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