China's AI chip race is pushing the semiconductor bottleneck into advanced packaging and testing, where HPC, HBM, Chiplets and domestic substitution are driving a new capacity cycle.
Hanmi Semiconductor has launched FC Bonder 3.5, a new flip-chip bonding tool for AI system semiconductor packaging, as the South Korean equipment maker looks to broaden its advanced packaging business beyond TC bonders for high-bandwidth memory and supply global foundry and OSAT customers, ETNews and Yonhap reported.
South Korea's plan to push semiconductor investment beyond the greater Seoul area is taking clearer shape, with Samsung Electronics reportedly moving closer to a new chip hub in Gwangju while SK Hynix continues to weigh a site in South Jeolla Province against overseas investment options.
Corning is studying South Korea as a possible manufacturing base for semiconductor glass substrates, a sign that the US specialty glass and optical materials maker is looking to extend its AI exposure beyond data-center connectivity into advanced chip packaging.
Founded in 2014, Oppstar is one of the few Malaysian companies operating at the front end of the semiconductor value chain as an IC design house. The company was established by three founders with extensive experience in the IC design industry: Meng Thai Ng, Hun Wah Cheah, and Chun Chiat Tan. Headquartered in Bayan Lepas, Penang, Oppstar opened an office in Kuala Lumpur, Malaysia, in 2022. From its inception, the company positioned itself as a one-stop IC design service provider, initially focusing on 16nm design nodes.
