DIGITIMES Semiconductors news

Apr 24

Intel flags price increases and supply shortages as CPU demand strengthens

Intel signaled that industry-wide supply shortages and selective price increases are helping offset weaker PC demand, even as the company works to expand supply capacity across its product lines. Management said constrained output continues to limit revenue upside in parts of the business, while rising prices and improving server CPU demand are supporting overall resilience. The company also pointed to ongoing efforts to increase supply availability, though demand in several segments continues to outpace output.

Google splits AI chips into training and inference TPUs, signaling shift toward workload-specialized AI infrastructure

Apr 24

Strait of Hormuz disruption puts semiconductor supply chains at risk as photoresist shortages grow

Apr 24

TSMC CoPoS equipment orders face reshuffle with legal turmoil at Taiwanese equipment maker

Apr 24

Exclusive: Google ramps new TPU servers, Taiwan suppliers gain share

Apr 24

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IC MANUFACTURINGLandMark Optoelectronics ramps up semiconductor-grade equipment for 6-inch SiPh amid surging demand

Apr 25, 14:00

Silicon photonics (SiPh) products continue to see strong demand, with optical communication epitaxy manufacturer LandMark Optoelectronics reporting output still far below customer needs. The company plans to increase capital expenditure (capex) to NT$1.315 billion (US$41.7 million) in 2026 to prepare early for second-half 2027 demand, and aims to introduce semiconductor-grade equipment for processes involving substrates larger than 6 inches, targeting a new expansion phase starting in 2028.

IC MANUFACTURINGChina's Horizon Robotics aims at Tesla with new self-driving platform

Apr 25, 09:57

As competition in intelligent electric vehicles shifts from incremental feature upgrades to full system-level redesign, China's Horizon Robotics is mounting an ambitious strategic push — one that places it in more direct competition with Tesla.

IC DESIGN, DISTRIBUTIONChipmakers face higher cost pressure as packaging outpaces foundry price hikes

Apr 24

In recent weeks, chip companies ranging from major players to small and medium-sized firms have issued price increase notices or begun renegotiating product prices with select customers. These moves aim to pass on steadily rising manufacturing costs across the supply chain as outsourced semiconductor assembly and test (OSAT) costs surge faster than even foundry price increases.

IC MANUFACTURINGM31 and TSMC complete eUSB2V2 tapeout on N2P process

Apr 24

IP provider M31 has announced that its eUSB2V2 interface IP has completed tapeout on TSMC's N2P 2nm process. M31 CEO Scott Chang emphasized that 2nm interface IP must align closely with the manufacturing platform to boost design efficiency and accelerate time-to-market.

MEMORY CHIPSMemory price surge reshapes global notebook competition in 2026

Apr 24

The global notebook market is undergoing a structural shift in competitive dynamics in 2026, moving from product specifications and pricing battles to group-level integrated capabilities as the core of competition. Memory supply chain control has emerged as a key indicator of brand competitiveness, directly impacting shipment volumes and operational performance.

IC DESIGN, DISTRIBUTIONSTMicroelectronics tops 1Q26 guidance, sees data center revenue surpass US$1 billion by 2027

Apr 24

STMicroelectronics reported first-quarter 2026 revenue of US$3.10 billion, up 23% year over year, with results coming in above the midpoint of its guidance as growth in personal electronics and computing helped offset continued softness in automotive and industrial markets.

MEMORY CHIPSSK Hynix deepens TSMC ties with HBM4, advances memory-logic integration

Apr 24

SK Hynix showcased its latest high-bandwidth memory (HBM) technologies at TSMC's North America Technology Symposium 2026, highlighting closer collaboration with the foundry and outlining a strategy focused on integrating memory and logic.

IC MANUFACTURINGTexas Instruments eyes further price hikes amid strong data center, industrial chip demand

Apr 24

Texas Instruments (TI) reported robust results for the first quarter of 2026 on April 23, driven by surging AI data center demand and a notable rebound in industrial control applications. TI stressed that while industrial demand has yet to reach its previous peak, the current recovery trend is positive, signaling continued growth prospects ahead.

PASSIVE, PCB, OTHER IC COMPONENTSAI PCB supply crunch squeezes margins on rising materials and energy costs

Apr 24

A tightening supply of high-end materials is emerging as a key constraint just as PCB specifications and manufacturing processes move into a new upgrade cycle. Shortages span from T-glass fiberglass cloth for IC substrates to longer lead times for copper-clad laminates (CCL), with prices for multiple upstream inputs rising in tandem.

PASSIVE, PCB, OTHER IC COMPONENTSZhen Ding to invest CNY40 billion in Huai'an to expand high-end PCB capacity

Apr 24

Zhen Ding Technology has broken ground on its HD campus at the Huai'an Technology City in China, as it accelerates investment to expand high-end printed circuit board (PCB) capacity targeting artificial intelligence (AI) applications.

PASSIVE, PCB, OTHER IC COMPONENTSMCU supplier Artery weighs price hikes on AI capacity squeeze, new applications drive growth

Apr 24

Microcontroller supplier Artery Technology (Arterytek or Arterychip) delivered a strong start to 2026, posting first-quarter consolidated revenue of NT$653 million (approx. US$20.1 million), a record high for a single quarter. Full-year revenue is projected to grow by up to 60%, driven by a combination of new product launches and expanded demand from existing customers.

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