
SK Hynix reported record second-quarter revenue, underscoring the firm's strong demand for AI-related memory despite supply constraints and shifting customer buying patterns. The South Korean chipmaker said it is expanding long-term agreements with major customers to lock in demand and support investment planning. The company also expects HBM and DRAM to remain key growth drivers into the second half of 2026.
Japan and South Korea's MLCC suppliers are again raising prices, signaling tighter supply conditions that could affect electronics makers worldwide. The moves, led by major passive component manufacturers, suggest AI-related demand is reshaping a market previously softened by weaker consumer and automotive orders.
Taiwan's semiconductor sector is set to become an even larger driver of electricity demand as AI-related expansion lifts output in wafer fabrication, memory, and advanced packaging. Taipower projected that the industry's power use would reach 52 billion kWh in 2026, underscoring how the island's chip ambitions are reshaping its energy system.
TSMC on Wednesday issued its third statement since a magnitude 7 earthquake struck Kumamoto, Japan on July 28, saying that utility systems at its JASM wafer fab are operating normally, equipment inspection and calibration are in progress, and construction at the site of its second Kumamoto fab has resumed.
Nvidia CEO Jensen Huang once again voiced his support for open-weight and open-source AI, a form of model that has caught official attention in Washington after the release of the powerful Kimi K3 model from Chinese startup Moonshot AI. His comments added another voice to the ongoing debate over closed-source versus open-source approaches as the US considers restrictions on Chinese AI.
Intel Foundry has completed a US defense-backed semiconductor prototype program that could have implications for supply chain resilience, national security, and global access to advanced chips. The work, tied to Intel 18A technology, aims to expand trusted domestic manufacturing and could shape how allied governments approach secure chip production.


