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Sep 7
Exclusive: Infineon COO says chip shortage recovery will take longer
Infineon COO Alexander Gorski told DIGITIMES in an exclusive interview at Semicon Taiwan 2026 that the current global chip shortage is unlike the one during Covid-19 and will take longer to resolve. He also discussed progress on Infineon's new Dresden plant, in-house manufacturing, outsourcing, and the company's global footprint.
Memory manufacturers Macronix International, Etron Technology, and Winbond Electronics all reported surging revenue for the first eight months of 2026. As the memory upcycle continues, all three companies posted strong August revenue growth, with executives noting that demand remains tight.
Major Taiwanese memory module manufacturers saw revenue remain at high levels in August 2026, as memory prices continued to rise. Adata Technology and Team Group both posted record-high single-month revenue in August. Industry players believe demand will continue to be strong in the artificial intelligence (AI) market, with prices expected to continue rising in the third quarter. As supply is anticipated to tighten further in 2027, inventory management and market positioning will become critical to operating performance.
TSMC Executive Vice President and Co-Chief Operating Officer Y.P. Chin was named an Industrial Technology Research Institute (ITRI) Laureate on September 7, marking another milestone in a semiconductor career spanning nearly four decades.
Infineon COO Alexander Gorski said the company is balancing in-house production, outsourcing, and global expansion as supply-chain resilience becomes a key customer requirement. In an exclusive interview with DIGITIMES at SEMICON Taiwan 2026, he also discussed chip shortages and progress at Infineon's new Dresden fab.
SK Hynix is considering accelerating investment in South Korea's planned Gwangju semiconductor cluster so that development proceeds alongside its ongoing Yongin buildout, rather than waiting for Yongin to advance further, according to Dealsite, citing industry sources. The potential overlap is raising a key question for semiconductor equipment suppliers: whether Gwangju will generate additional orders or absorb some spending previously expected for later stages of Yongin.
TSMC's investment in a fab in Germany's Free State of Saxony has drawn close attention from across Europe. Eva Ins Obergfell, Rector of Leipzig University, one of Germany's leading universities, recently visited Taiwan and toured National Taiwan University and National Tsing Hua University, among others, to explore ideas for research cooperation. Experts said Taiwan and Germany had opportunities to build long-term partnerships in quantum sensing technology, semiconductor materials processes and cross-border biomedical research.
Indian chip design company IndieSemiC is targeting shipments of 3 to 5 million locally made Wi-Fi modules in FY27-28, betting that security requirements for CCTV equipment will encourage camera makers to replace imported connectivity modules with products sourced in India.
This year's SEMICON Taiwan saw companies worldwide flock to Taipei to learn new industry developments and score potential business opportunities. Many came from elsewhere in Asia, but some came from as far as California, where business leaders highlighted the complementary relationship between the state's research and start-up ecosystem and Taiwan's manufacturing capabilities.
Aspeed chairman Chris Lin said the company's order visibility has now extended into 2027, with 2027 backlog already exceeding expected full-year 2026 revenue for the first time. He added that easing supply-chain bottlenecks should support sequential growth in the second half of 2026 and stronger pricing from the fourth quarter onward.
As the global race for artificial intelligence (AI) consumes vast oceans of electricity and pushes modern utility grids to the brink, a team of California researchers is looking to biological neuroscience to build an entirely new class of energy-efficient microelectronics. Their objective is straightforward but radical: reverse-engineer the human brain to solve the semiconductor industry's looming power and thermal bottlenecks.
The largest engineering school on the US West Coast by enrollment is training engineers for Taiwan Semiconductor Manufacturing Co. (TSMC) and pioneering advanced 3D packaging design.