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Dec 18
China's EUV prototype forces a rethink of the AI chip order
China has quietly crossed a psychological and potentially strategic threshold in the global semiconductor race. In a tightly controlled laboratory in Shenzhen, Chinese scientists have built a working prototype of an extreme ultraviolet (EUV) lithography machine, the most complex and geopolitically sensitive tool in modern chipmaking, according to Reuters.

Record-high precious metal prices upstream are tightening cost pressure across the passive components industry, but the impact on protection components has so far been contained. Thinking Electronic Industrial said silver prices have surged since 2025, yet supply-demand dynamics have limited immediate price pass-through, allowing product prices to stabilize after a prolonged period of decline.

India is bolstering its semiconductor ecosystem through strategic overseas acquisitions, potential integration into Apple's supply chain, and specialized domestic manufacturing, while navigating delays in major facility ramp-ups.
As the global memory industry enters a supercycle driven by structural supply shortages, BT substrates for memory chips are also tightening. Taiwan-based IC substrate makers Kinsus and Nanya PCB have secured rush orders, with customers willing to sign long-term supply agreements amid material constraints. This has sharply improved order visibility from the second half of 2025 and emerged as a key driver of Taiwanese PCB output growth in the third quarter.

AP Memory is expanding into AI servers and high-performance computing, with its S-SiCap roadmap delivering concrete progress. Fourth-generation discrete silicon capacitors are set to adopt embedded substrate packaging first, having already entered sample-based process validation, with phased mass production starting from 2026.

AMEC, China's leading semiconductor equipment vendor, has sent its clearest signal yet that it no longer intends to remain a single-discipline specialist. Its planned acquisition of a controlling stake in Hangzhou Sizone Electronic Technology marks a strategic shift toward becoming a platform-scale equipment group, rather than a company defined by individual tools.

Apaq Technology reported a sharp rise in demand for solid capacitors, fueled primarily by AI servers and AI PCs, during an investor briefing on December 17. General Manager ST Lin stated that existing production lines for V-Chip, CAP, and Hybrid capacitors are now operating at full capacity, contributing to record revenue and profitability in the third quarter of 2025.
The National Academy of Engineering of Korea (NAEK) recently convened a seminar, gathering industry and academic experts to assess South Korea's position in the AI semiconductor sector. The discussion underscored concerns about the country's heavy focus on memory chips and drew attention to Taiwan's comprehensive semiconductor ecosystem as a model.
The isolation of graphene in 2004 sparked widespread expectations that two-dimensional (2D) materials could fundamentally reshape electronic devices. Graphene and transition metal dichalcogenides (TMDs) have since enabled progress in niche applications and research prototypes. Yet their impact on mainstream logic devices remains limited. The long-anticipated use of 2D materials to sustain Moore's Law through transistor channel integration has yet to materialize at scale.

Rafael Microelectronics is positioning optical communications and custom ASIC services as the twin pillars of its growth strategy heading into 2026, as the company accelerates its transition from a niche receiver-chip supplier into a broader high-speed signal transmission solutions provider.

As AI workloads reshape data center design, performance is no longer defined solely by computing power. Thermal management has emerged as an equally decisive battleground. Unlike traditional CPU-centric systems, modern AI servers rely heavily on GPUs and specialized accelerators, each drawing hundreds of watts per chip. The resulting thermal density far exceeds the limits of conventional air-cooling, turning heat dissipation into a core infrastructure challenge rather than a peripheral engineering concern.

Rising memory prices are prompting end customers to procure notebooks early, a shift that is expected to keep shipments steadier than usual during the traditionally weak first half of 2026, even as brands are set to raise their end notebook prices to reflect the increasing costs, according to sources from the notebook supply chain.