DIGITIMES Semiconductors news

Jan 2

US approval of TSMC equipment exports to China reflects strategy shift

Following reports that the US government had granted annual export licenses to South Korea's Samsung Electronics and SK Hynix, the US Department of Commerce (DOC) has also approved TSMC to export chip manufacturing equipment containing US technology to its wafer fabs in Nanjing and other locations in China over the next year. The approval ensures existing production lines can continue operating normally and meet product delivery schedules.

Baidu's AI chip unit Kunlunxin confidentially files for Hong Kong IPO

Jan 2

Samsung reportedly seals land deal, paving way for Yongin semiconductor complex

Jan 2

SanDisk, Micron vie for PSMC's Tongluo fab capacity

Jan 2

Intel and Samsung advance 2nm GAA, but yield gaps leave TSMC as the sole external supplier

Jan 2

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IC MANUFACTURINGIndia roundup: OSAT players claim legacy packaging price parity

Jan 5, 07:05

Indian OSAT players aim for price competitiveness on par with Malaysian rivals, as L&T Semiconductor is scheduled to announce products at CES.

IC MANUFACTURINGTaiwan power chipmakers bank on AI data centers and auto orders for 2026 growth

Jan 5, 07:04

Taiwan's power semiconductor suppliers are positioning for steady growth through 2026. The momentum comes from two fronts: artificial intelligence data centers adopting new power architectures and automotive customers adjusting sourcing after supply disruptions linked to Nexperia.

IC DESIGN, DISTRIBUTIONTaiwan IC design industry faces intensifying G2 pressures in 2026

Jan 5, 07:04

Taiwan's integrated circuit (IC) design sector faces intensified challenges as 2026 begins that may push its global revenue ranking to third place, largely due to competitive pressures from the US and China. The dominant reliance on consumer electronics revenue offers limited growth prospects, as AI-driven expansion primarily benefits cloud computing sectors.

MEMORY CHIPSMicron and GlobalFoundries strengthen Singapore's position in advanced AI chip manufacturing

Jan 3

Singapore is drawing a new wave of semiconductor investment as global chipmakers expand advanced manufacturing tied to artificial intelligence infrastructure, reinforcing the city-state's strategy of attracting investments to enable next-generation technologies and position Singapore higher up the semiconductor value chain.

IC MANUFACTURINGAnalysis: Japan targets advanced packaging to crack TSMC's manufacturing edge

Jan 3

Japanese semiconductor firms are pivoting toward advanced packaging and alternative lithography as TSMC extends its scale advantage in artificial intelligence chips. TSMC's 3nm and 2nm capacity is largely locked in. Advanced packaging now contributes a growing share of sales. The company is on track to see annual revenue exceed US$250 billion around 2029 or 2030. That widening gap has pushed Japanese companies to focus on panel-level packaging and nanoimprint technologies. Both emerged at SEMICON Japan 2025 as key levers to bypass manufacturing bottlenecks and secure a foothold in the fast-expanding AI accelerator supply chain.

IC MANUFACTURINGChang Wah accelerates Asia expansion as chip packaging booms

Jan 3

Chang Wah Electromaterials and its affiliate Chang Wah Technology are expanding operations across Taiwan, China, and Malaysia as global chipmakers and packaging houses ramp up capacity in Asia, positioning the group's combined distribution and manufacturing model to strengthen its role in the semiconductor back-end supply chain.

IC MANUFACTURINGAnalysis: Chip boom squeezes device makers as surging component costs threaten margins

Jan 3

The global semiconductor market is projected to reach US$1 trillion as early as 2026, significantly ahead of previous industry forecasts targeting 2030. The World Semiconductor Trade Statistics (WSTS) forecast, released in December 2024, expects growth to be driven predominantly by logic chips, including GPUs and AI accelerators. Memory markets are poised for the steepest increase.

MEMORY CHIPSMemory shortages to persist through 2026 as AI server demand surges

Jan 2

Global memory markets are expected to remain tight through 2026 as aggressive spending by cloud service providers (CSPs) on AI infrastructure continues to outstrip supply growth for both DRAM and NAND flash, pushing prices higher, according to industry estimates.

IC MANUFACTURINGAsus to pause new smartphone launches in 2026, maintain mobile operations

Jan 2

Smartphone distributors in Taiwan have recently said they are no longer able to obtain Asus handsets through local agents and claimed they had received information indicating that Asus's smartphone unit would operate only through December 31, 2025, after which the company would stop launching new smartphone products.

PASSIVE, PCB, OTHER IC COMPONENTSIC substrates and networking PCBs grow; materials and equipment face shortages

Jan 2

The PCB industry is making large upgrades. The largest beneficiaries of the AI boom are IC substrate makers that are part of the advanced chip packaging supply chain, such as Unimicron and Kinsus, which have gradually emerged from the oversupply bottleneck caused by large-scale post-pandemic capacity expansion. The surge in orders has spread to multiple networking and server PCB manufacturers, including Gold Circuit Electronics (CGE), Allied Circuit Co. (ACCL), and First Hi-tec, driving double-digit year-over-year growth in Taiwan's PCB manufacturing output value in 2025.

MEMORY CHIPSCXMT logs first annual profit on DRAM price rebound

Jan 2

ChangXin Memory Technologies (CXMT) returned to profitability in 2025, recording its first full year of net income after a rebound in global DRAM prices and a sharp increase in the value of its chip inventory reversed years of losses. The turnaround followed an extended period of heavy capital spending and came as accelerating demand for artificial intelligence infrastructure tightened global memory supply.

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