TSMC is accelerating advanced packaging capacity expansion as supply remains tight, with market chatter indicating its CoWoS monthly output will reach at least 200,000 wafers in 2027. Equipment makers are still waiting for TSMC to finalize order allocation, a delay that is raising fears of price-cutting competition and delivery delays, as lead times run at least seven to nine months.
Reports have emerged that Apple may have managed to avoid 100% tariffs imposed by US President Donald Trump, partly by agreeing to partner with Intel to manufacture its chips. While Apple could benefit from expanding its chip suppliers, the episode also shows the power of Intel's government backing as the US seeks to reshore its semiconductor industry.
Samsung Electronics has reportedly completed the tape-out of its version of Tesla's AI5 chip for self-driving systems, with the chip scheduled to be manufactured at Samsung's Taylor, Texas, fab using the company's 2nm process.
Intel is reportedly preparing a new technology roadmap for its next-generation 1.4nm process, 14A2, as it evaluates a hybrid architecture that can deliver power from both sides of the chip. Industry observers say Intel and Samsung Electronics are both taking on harder-to-manufacture technologies in the ultra-advanced process race as they try to catch up with TSMC.
Huawei is reportedly partnering with Chinese DRAM maker Shenzhen Shengweixu Technology (SwaySure) and the Chinese government to build a state-backed 12-inch memory fabrication plant in Shenzhen, a move aimed at easing DRAM shortages while reducing reliance on overseas suppliers amid continued US export controls.
A shortage of skilled workers could slow construction of new US semiconductor plants, raise costs, and limit chip output for global markets, according to a new report. The findings suggest the manufacturing push backed by Washington's CHIPS Act may depend on sustained funding and closer industry cooperation to avoid bottlenecks.
