DIGITIMES Semiconductors news

Jul 31

Unimicron says Intel's EMIB-T will not reach mass production until 2027, sharpening advanced packaging rivalry

TSMC's CoWoS capacity remains tight, and demand for a second supply route is strengthening, according to Unimicron, which said Intel's EMIB-T advanced packaging platform will not reach true mass production until 2027. The substrate maker said the new platform is already drawing three suppliers, all targeting an initial 50% yield.

Analysis: The AI buildout stopped being a demand story

Jul 31

Research Insight: CXMT reaches 7.67% DRAM share with US$4.4B IPO, 2028 tech roadmap

Jul 31

Samsung chip engineers eye SK hynix as AI-driven bonus gap fuels talent war

Jul 31

TSMC reportedly develops EMIB-like packaging to counter Intel

Jul 31

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IC DESIGN, DISTRIBUTIONMediaTek eyes high-single-digit revenue growth, 20% ASIC share by 2027

Aug 1, 09:45

MediaTek held an investor conference on July 31, 2026, with CEO Rick Tsai reiterating that ASIC revenue will reach US$2 billion in 2026. He also said the total addressable market for cloud ASICs will reach US$80 billion in 2027, while lifting the company's target market share to 15-20%.

IC MANUFACTURINGAUO commits US$721M to TGV, glass core and CPO expansion

Aug 1, 09:44

AUO sold three factories within two days, with disposal gains expected to reach NT$17.7 billion (approx. US$548 million). Chairman Paul Peng said the proceeds would be reinvested in high-value products, new technologies and AI-related initiatives.

IC MANUFACTURINGObituary: Powerchip chairman Frank Huang dies after reshaping Taiwan's DRAM and foundry industry

Aug 1, 09:44

Powerchip Semiconductor Manufacturing Corp. (PSMC) chairman Frank Huang died on July 31, 2026, at age 76, closing a career that spanned medicine, electronics, DRAM and foundry manufacturing. His life traced nearly 30 years of booms and busts in Taiwan's memory and semiconductor industries.

IC MANUFACTURINGPosiflex revenue rises 46% in the second quarter on Europe and Asia demand

Aug 1, 08:41

Posiflex Technology reported a sharp sequential rebound in the second quarter of 2026, with consolidated revenue climbing 46% to NT$5.183 billion (US$160.3 million). The industrial PC maker said net profit after tax increased 58% from the prior quarter to NT$467 million, or NT$4.34 per share, even as higher memory and CPU costs weighed on margins.

PASSIVE, PCB, OTHER IC COMPONENTSElite Material posts record 2Q result on strong AI-related demand

Aug 1, 08:41

Elite Material Co. said booming demand for advanced materials used in AI hardware kept its factories fully loaded in the second quarter of 2026, lifting revenue and profit to record levels. The Taiwan-based copper-clad laminate (CCL) maker expects tight production, broad customer demand, and expanding capacity to support growth across global markets over the coming year.

IC DESIGN, DISTRIBUTIONRealtek, Elan, and Parade set the tone for PC chip demand

Aug 1, 08:41

As the second half of the year begins, major Taiwanese IC design firms including Realtek Semiconductor, Elan Microelectronics, and Parade Technologies are holding earnings briefings this week to outline market conditions for the traditional peak season. Because the three companies hold key positions in the PC chip market, their comments are being watched as a barometer for PC chip demand in the second half of the year.

MEMORY CHIPSSilicon Motion posts record Q2 revenue and 2026 sales growth over 100%

Aug 1, 08:41

NAND controller maker Silicon Motion Technology reported record second-quarter 2026 revenue of US$451 million, up 32% quarter-on-quarter and 127% from a year earlier, as profit and margins also hit new highs. The company said third-quarter revenue will rise another 15% to 20% sequentially, and full-year 2026 revenue is set to reach a new record, with growth of more than 100% year-on-year.

PASSIVE, PCB, OTHER IC COMPONENTSThintronics wins proposed US CHIPS incentives for advanced substrate technology

Aug 1, 08:40

Thintronics, a semiconductor interconnect company, said in a press release on July 29 that it had signed a letter of intent with the US Department of Commerce and the CHIPS Research and Development Office for up to US$50 million in incentives under the CHIPS and Science Act.

IC MANUFACTURINGAt OCP's Taiwan summit, servers take a back seat to optics and advanced packaging

Aug 1, 01:57

When the agenda for this year's OCP APAC Summit landed, seasoned observers noticed something unusual. TSMC, Applied Materials, Advantest, and ASE are sharing the stage with Microsoft, Nvidia, and Google.

MEMORY CHIPSPowerchip founder Frank Huang dies at 76; vice chair steps in as acting chief

Jul 31

Powerchip Semiconductor Manufacturing Corp. (PSMC, TWSE: 6770) said in a material-information filing on July 31 that its chairman, Frank Huang, died peacefully in his sleep at his home around midday that day of cardiopulmonary failure. He was 76.

IC MANUFACTURINGExclusive: Asian chipmakers' shift to US helium raises concentration risk

Jul 31

Chipmakers in Taiwan, South Korea, and Japan have avoided broad helium-related production disruptions so far, but their rapid shift toward US supply is creating a new concentration risk.

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