DIGITIMES Semiconductors news

Feb 6

Commentary: Why TSMC is upgrading Japan's Kumamoto fab from 6nm to 3nm

TSMC has made a significant change in its process plan for the Kumamoto second fab, confirming an upgrade from the initially planned 6/7nm node to 3nm. This facility will become Japan's first 3nm wafer fab, while Japan-backed Rapidus advances toward 2nm development.

Samsung vows 130% growth in 2nm orders, eyes major customers besides Tesla

Feb 6

YMTC Phase III speeds Wuhan fab installations and domestic equipment deliveries

Feb 6

CSPs turn to custom silicon to break Nvidia dependence

Feb 6

Google doubles AI capex, turning TPU ASIC orders into high-stakes supplier race

Feb 6

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IC DESIGN, DISTRIBUTIONAMD's investment in photonics and modular architecture signals shift in AI infrastructure development

Feb 8, 07:36

AMD is positioning itself to address the future needs of artificial intelligence (AI) computing through advances in chip design and system architecture, particularly by integrating photonics technology and modular rack-scale platforms. CTO Mark Papermaster, speaking in a recent interview, highlighted how AMD's evolving engineering strategies will shape AI hardware capabilities and scalability over the next several years.

IC MANUFACTURINGRecord Japan blizzard threatens AI chip supply chains

Feb 8, 07:30

A record-breaking blizzard driven by extreme weather has battered Japan's northern Aomori Prefecture, dumping snow at more than two and a half times the historical average. The storm has claimed lives, paralyzed local commerce, and raised fresh concerns about the resilience of global technology supply chains.

IC MANUFACTURINGGlobalFoundries reinvent wafer services by integrating IP to meet evolving market demands

Feb 8, 07:30

The traditional wafer foundry model is transforming as leading foundries increasingly incorporate intellectual property (IP) into mature technology nodes to address economic pressures and shifting customer needs. Nearly four decades after TSMC founder Morris Chang separated chip design from wafer manufacturing, foundries are evolving from mere silicon suppliers into broader infrastructure providers offering extended platform support.

IC MANUFACTURINGA close reading of the book behind TSMC's Japan bet

Feb 7

TSMC's decision to bring 3nm manufacturing to Japan is often explained in terms of subsidies and diversification. A better explanation sits in a book written five years ago by Prime Minister Sanae Takaichi—one that C.C. Wei chose to endorse in public when the deal was finally unveiled. That book offers a useful guide to why TSMC's 3nm future is being built in Kumamoto.

PASSIVE, PCB, OTHER IC COMPONENTSLead frame supplier CWTC reaches 40-month revenue high in January

Feb 7

Driven by a broad demand recovery and the gradual effect of price increases, Chang Wah Technology (CWTC) reported both month-on-month and year-on-year growth in consolidated revenue in January 2026, reaching the highest monthly level in nearly 40 months and the second-highest for the same period on record.

MEMORY CHIPSSK Hynix clears power hurdle in Yongin as Samsung faces site delays

Feb 7

South Korea is moving ahead with plans to develop what it bills as the world's largest semiconductor cluster in Yongin, Gyeonggi Province, where SK Hynix and Samsung Electronics plan to build up to 10 advanced wafer fabs. Infrastructure issues that once drew intense scrutiny, particularly power supply, have eased after authorities adopted an unconventional approach that integrates power grids into road construction.

IC MANUFACTURINGRISC-V CEO highlights open architecture's edge-to-cloud potential

Feb 7

The RISC-V ecosystem is making steady progress across various application fields, from cloud high-performance computing to automotive electronics. Industry players are launching solutions targeting these areas while actively expanding into future-oriented sectors like robotics and space exploration.

IC MANUFACTURINGSouth Korean president meets conglomerate chiefs as Samsung, others pledge US$186b in regional investments

Feb 6

South Korean President Lee Jae-myung recently convened a meeting at the Blue House titled the "Corporate Roundtable on Youth Employment and Expanded Regional Investment," bringing together leaders from the country's 10 largest conglomerates, including Samsung Electronics, Hyundai Motor and LG Group, along with representatives from the financial sector. Lee urged companies to work with the government to promote youth employment, entrepreneurship and more balanced regional development.

IC DESIGN, DISTRIBUTIONAMD flags 2H26 turning point as MI450 shipments stay on track

Feb 6

AMD's next-generation MI450 AI accelerator remains on schedule for launch and volume production in the second half of 2026, with CEO Lisa Su signaling confidence that supply capacity will not constrain deliveries as the company steps up its push in high-end AI chips.

PASSIVE, PCB, OTHER IC COMPONENTSMetaOptics drives heat-resistant metalenses into CPUs

Feb 6

At the Asia Photonics Expo (APE 2026) in Singapore, DIGITIMES interviewed MetaOptics, the first planar lens company listed on the Singapore Exchange's Catalist board. Aloysius Chua, the company's deputy CEO, outlined MetaOptics' latest technological advances and global footprint, with a particular focus on its progress in co-packaged optics (CPO).

IC MANUFACTURINGIndia's 2026–27 budget signals systemic overhaul for manufacturing, semiconductors, and digital investment

Feb 6

India's Union Budget for fiscal year 2026–27, unveiled on February 1, 2026, emphasizes manufacturing, semiconductors, and AI-linked infrastructure as central pillars of economic growth. The measures aim to strengthen supply chains, reduce import dependence, and institutionalize compliance frameworks for both domestic and foreign investors.

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