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Apr 20
Samsung reportedly signals exit from LPDDR4 market as memory industry shifts toward LPDDR5
Memory makers are accelerating the phase-out of older mobile DRAM generations, with policies on LPDDR4 and DDR4 increasingly converging toward end-of-life (EOL) management as the industry shifts capacity toward higher-value LPDDR5, LPDDR5X, and server-class memory products.

Qualcomm Chief Executive Cristiano Amon is expected to meet senior executives from Samsung Electronics and SK Hynix during a recent visit to South Korea, according to industry sources. The discussions are expected to focus on securing memory supplies as well as potential cooperation with Samsung in advanced semiconductor manufacturing, including its 2nm foundry process.

Taiwan's artificial intelligence (AI) servers and advanced-process chip manufacturing businesses are booming, with related manufacturing industries also benefiting. According to a survey by Taiwan's Ministry of Labor (MIL), labor turnover rates in the manufacturing industry are relatively low, while vacancy rates and recruitment periods are comparable to the overall industry average, indicating a stable workforce structure.
Samsung is accelerating its push into magnetoresistive random-access memory (MRAM), positioning the technology as a strategic pillar alongside DRAM and high-bandwidth memory (HBM) in the intensifying global AI semiconductor race.
GigaDevice is moving into DRAM through a KRW1 trillion (US$680 million) related-party deal, combining CXMT's manufacturing capacity with its own sales network in a move that could reshape the global supply landscape.
"Silicon inflation" is no longer a metaphor — it is reshaping Taiwan's capital markets. TSMC and Nvidia are at the center, pulling growth across the entire electronics supply chain. Global uncertainties remain, yet Taiwan's market is outperforming.

Google is accelerating its push into the AI chip market, positioning its custom tensor processing units (TPUs) as a viable alternative to Nvidia's dominant GPUs—particularly as the industry shifts from training large models to running them in real-world applications.

On April 20, 2026, Apple announced that Johny Srouji — the executive behind its custom silicon revolution — has been elevated to the newly created role of Chief Hardware Officer. Srouji, who previously served as Senior Vice President of Hardware Technologies, will now also oversee the Hardware Engineering division formerly led by John Ternus, who is set to succeed Tim Cook as Apple's CEO on September 1, 2026.
Given the US-China trade war, many Taiwanese businesses and Chinese manufacturers relocated production lines to Southeast Asia, boosting shipment demand from the region. Now, escalating conflict in the Middle East has driven up fuel costs, while international cargo flights are being diverted or crowded into Southeast Asian routes. This phenomenon is causing air freight rates to double.
Optical communications company APAC Opto Electronics reported that its inventory digestion phase is nearing completion, with market demand showing a clear rebound. Looking ahead to its co-packaged optics (CPO) strategy, the company noted that its external laser small form-factor pluggable (ELSFP) is becoming increasingly critical within the overall architecture. Small-volume shipments have begun in 2026, with volume ramp-up expected in 2027, positioning the product as a key future growth driver.
Amazon CEO Andy Jassy declared in his latest shareholder letter that the company's self-developed chip business is booming, surpassing US$15 billion in annualized AI revenue through AWS — a significant milestone for chip efforts that have quietly evolved over 11 years, beginning with the acquisition of Israeli startup Annapurna Labs in 2015.
In 2026, critical semiconductor materials face a perfect storm of rising prices, shortages, and geopolitical disruption. Lead times for multilayer ceramic capacitors (MLCCs) and power devices are stretching, while helium supply risks from Qatar are mounting. Topco Scientific CTO Tina Ding says companies must sharpen capabilities in long-term contract locking, flexible pricing negotiations, strategic stockpiling, and risk-based sourcing — all while tracking costs in real time and staying in close step with customers.