DIGITIMES Semiconductors news

May 21

TSMC's COUPE push puts Samsung's silicon photonics ambitions under pressure

Samsung Electronics has launched silicon photonics foundry services and entered pilot production, signaling during its latest earnings call that optical communication modules will soon move to mass production — backed by aggressive investment. Yet compared with TSMC, which has already achieved breakthroughs in co-packaged optics (CPO) through Taiwan's well-established supply chain ecosystem, Samsung still has a long way to go.

Commentary: Trump's Taiwan chip claim tests TSMC's silence

May 21

SMIC, Hua Hong form materials supply platform to cut China chip chain reliance on US

May 21

Nvidia revenue surges 85% as data center sales jump 92%

May 21

Samsung averts strike with last-minute labor deal, but deeper divisions remain

May 21

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MEMORY CHIPSAMD's Lisa Su says memory is becoming another pressure point for AI chips

May 22, 15:56

AMD CEO Lisa Su said the company is satisfied with its current CoWoS supply from TSMC, while noting that memory has become another pressure point in the AI chip supply chain.

IC DESIGN, DISTRIBUTIONAMD's Lisa Su says AI demand is 'absolutely real' as CPUs return to focus

May 22, 15:05

AMD CEO Lisa Su pushed back against concerns of an AI bubble on May 22, saying demand is "absolutely real" and that the industry remains in an early phase of growth.

IC DESIGN, DISTRIBUTIONAnthropic reportedly eyes Microsoft Maia chips to cut Nvidia reliance

May 22, 14:17

Microsoft is in early discussions to provide AI servers powered by its in-house Maia chips to Anthropic, deepening ties between the two companies as cloud providers race to reduce dependence on Nvidia hardware and secure a stronger position in the AI infrastructure market.

IC MANUFACTURINGEverDisplay appoints former Hua Hong executive as chairman in board overhaul

May 22, 13:28

China AMOLED panel maker EverDisplay Optronics completed a board reshuffle and senior management overhaul after a board meeting on May 20, appointing a former Hua Hong Semiconductor executive as chairman and naming a new general manager as it builds a new leadership team. The changes included a slate of shareholder-representative directors and retained an existing director, the firm announced.

IC MANUFACTURINGAmkor expands Arizona semiconductor packaging campus with additional 67 acres

May 22, 13:24

Amkor Technology today reaffirmed its commitment to strengthening advanced semiconductor packaging and test capabilities in the US through continued investment in its Arizona manufacturing operations.

IC MANUFACTURINGAMD deepens China packaging alliance with TF-AMD expansion in Suzhou

May 22, 12:47

AMD CEO Lisa Su appeared in Suzhou on May 20 to attend the launch ceremony for the second-phase expansion of Suzhou TF-AMD Semiconductor Co. (also known as Suzhou Tongfu Advanced Microelectronics), underscoring AMD's growing focus on advanced packaging capacity as AI and high-performance computing demand accelerate globally.

IC DESIGN, DISTRIBUTIONAIC expands analog ICs into fiber optics; orders reach 1Q27

May 22, 12:42

AIC's expansion from analog ICs into fiber-optic components and other products, and its inclusion in a major US cloud service provider's supply chain, extend order visibility to the first quarter of 2027, signaling global demand pressures and supply-chain implications for cloud infrastructure suppliers and telecom equipment markets worldwide.

IC DESIGN, DISTRIBUTIONBroadcom, Applied Materials, GlobalFoundries, Meta, and Synopsys back US$125M UCLA Semiconductor Hub

May 22, 12:41

Broadcom, Applied Materials, GlobalFoundries, Meta, and Synopsys are partnering with UCLA Samueli to create a US$125 million Semiconductor Hub to accelerate research and workforce development in AI-driven chip technologies, promising global impacts on computing speed, energy efficiency, and applications from healthcare to transportation while strengthening US competitiveness and innovation globally.

PASSIVE, PCB, OTHER IC COMPONENTSWPG Holdings flags server supply gaps amid memory price hikes, 800V shift

May 22, 12:23

Amid the continued crowding-out effect of artificial intelligence (AI) demand, IC distributor WPG Holdings said memory shortages and rising prices are weakening end-product sales momentum, and forecast that smartphone and PC production will shift from flat growth to a decline in 2026.

IC MANUFACTURINGTaiwan rides chip-led export boom to bankroll industrial overhaul

May 22, 12:06

AI-driven demand and other emerging technologies kept Taiwan's export momentum strong in the first quarter of 2026, with exports reaching US$195.74 billion, rising 51% year on year. Economic growth hit 13.69%, the highest quarterly growth in 39 years. Taiwan's GDP is forecast to reach NT$32 trillion (US$1.02 trillion) in 2026.

IC DESIGN, DISTRIBUTIONForcelead Technology bets on stable 2026 as it expands into TDDI and new automotive displays

May 22, 11:53

Forcelead Technology said it expects stable operations through 2026 as it rolls out a touch-TDDI product and pursues new automotive display opportunities, a development with implications for global suppliers and aftermarket channels as automakers adopt more advanced cockpit features. The company aims to protect margins while expanding beyond its core display business.

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