Chinese DRAM maker ChangXin Memory Technologies (CXMT) listed on the STAR Market of the Shanghai Stock Exchange on July 27, with its market capitalization briefly topping CNY3.6 trillion (approx. US$533.1 billion) on the first day of trading, surpassing Industrial and Commercial Bank of China and becoming the largest listed company in the A-share market.
South Korean AI chip designer Rebellions plans to begin shipping its next-generation Rebel100 accelerator in the second half of 2026, betting that wider use of AI agents and commercial AI services will shift more infrastructure spending from model training toward inference.
Gallium arsenide (GaAs) foundry WIN Semiconductors (WIN) expects infrastructure revenue to continue growing in the third quarter of 2026, driven by demand from low Earth orbit (LEO) satellites and other aerospace applications, while shipments of smartphone power amplifiers (PAs) and Wi-Fi products are expected to remain broadly flat or post modest growth.
Indian defense engineering company Paras Defense and Space Technologies said its semiconductor subsidiary, Paras Semiconductors, will invest INR62 billion (approx. US$643.79 million) to establish a semiconductor packaging and testing facility in Madhya Pradesh, as the country expands efforts to build a domestic chip manufacturing ecosystem, according to Reuters, The Economic Times, and Data Quest.
India's National Institute of Electronics and Information Technology (NIELIT) and the Semiconductor Laboratory (SCL) have collaborated to make SCL's indigenous 1.2-micrometer Process Design Kit (PDK) available through the eChipHub platform, supporting semiconductor design education and research as part of the country's India Semiconductor Mission.
Qualcomm plans to raise chip prices by a double-digit percentage from September 1, passing higher supplier costs into a smartphone market already strained by memory shortages and AI-related competition for semiconductor capacity.
Gujarat-based fabless semiconductor startup IndieSemiC has partnered with US-based semiconductor supplier Semtech Corporation to develop a new RISC-V-based system-in-package (SiP) platform that combines general-purpose computing with long-range wireless connectivity for Internet of Things (IoT) applications, according to announcements by DeshGujarat and The Economic Times.
Samsung Electronics and Hyundai Motor Group used the San Francisco AI Summit to outline separate artificial intelligence (AI) expansion plans spanning semiconductors, autonomous driving and robotics.
AI infrastructure, memory and advanced chipmaking led this week's tech agenda, with Intel, Samsung, SK Hynix, CXMT, Alibaba and Foxconn reshaping capacity and supply chains. Below are the most-read DIGITIMES stories from the week of July 20-26, 2026.
China's leading DRAM producer CXMT listed on Shanghai's STAR Market on July 27 after raising about CNY57.9 billion (approx. US$8.6 billion), the board's largest initial public offering to date. The deal gives the memory chipmaker fresh capital to expand capacity, develop advanced processes and accelerate new products, while creating a substantial demand pipeline for China's semiconductor equipment, materials, packaging and memory-module suppliers.
International IDMs such as Texas Instruments (TI) and STMicroelectronics are leaning into AI data-center demand, while the market's shift toward 400V and 800V power architectures is creating a longer runway for power semiconductors. Industry sources said the move could benefit Taiwanese suppliers in midrange products, with pricing gains extending into the second half of 2025 and, in some cases, 2027.
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