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Saturday 19 September 2026
CXL adds memory capacity, but HBM retains its bandwidth edge

Growing memory requirements are increasing interest in Compute Express Link (CXL) as a way to add capacity beyond locally attached memory. But engineers from OpenAI and Intel see limits to using the interconnect as a substitute for high-bandwidth memory (HBM) where bandwidth remains critical.

Friday 18 September 2026
Solidigm weighs first US NAND fab, explores upstate New York

Solidigm, the US NAND flash subsidiary of SK Hynix, is considering building its first NAND manufacturing plant in the US, with upstate New York emerging as a leading candidate.

Friday 18 September 2026
Winbond cements server NOR lead with Infineon deal
Winbond Electronics is expanding its NOR Flash footprint and has agreed to pay US$1.12 billion in cash to acquire Infineon's NOR Flash and F-RAM businesses, a move that will lift it to the top of the automotive NOR market while strengthening its position in AI data center and server NOR supply.
Friday 18 September 2026
CXMT eyes NAND amid global shortage, taking aim at YMTC

ChangXin Memory Technologies (CXMT) is preparing to expand beyond DRAM into NAND flash, a move that would push China's leading DRAM supplier closer to the core market of domestic rival Yangtze Memory Technologies (YMTC) as enterprise storage becomes a bigger part of the memory growth story.

Friday 18 September 2026
China's memory push gains ground across LPDDR6, advanced NAND, with HBM still the test

AI is reshaping the global memory industry, tightening supply while creating an opening for China's domestic suppliers. With Samsung Electronics, SK Hynix, and Micron prioritizing high-bandwidth memory (HBM) and high-end server memory, ChangXin Memory Technologies (CXMT) and Yangtze Memory Technologies (YMTC) are gaining ground in conventional DRAM, mobile memory, and NAND Flash.

Friday 18 September 2026
Micron: AI memory crunch rewrites the market with long-term deals and custom designs
As the AI boom spreads from data centers to edge devices and robotics, Micron Technology executives are warning that memory has become a core bottleneck determining the upper limits of AI performance. With new capacity taking years to build and manufacturing processes growing increasingly complex, meaningful new memory supply may not begin arriving until 2028.
Friday 18 September 2026
Micron's Taiwan investment passes US$47 billion as it rallies fab construction suppliers

Micron held a conference for Taiwanese suppliers on September 17 under the theme of building at speed and growing at scale. The event brought together Taiwan-based supply chain partners involved in civil, structural, and architectural (CSA) works; mechanical, electrical, and plumbing (MEP) systems; fab equipment; construction materials; and tool installation.

Friday 18 September 2026
AI's next infrastructure squeeze is storage: Seagate sees demand accelerating
Seagate's 2026 Data Infrastructure Readiness Report finds that enterprise AI strategies are moving beyond early-stage adoption toward broader deployment, increasing the importance of data infrastructure for storing, accessing, managing, and using data at scale.
Friday 18 September 2026
Winbond's Infineon buyout puts GigaDevice under pressure

Winbond Electronics' US$1.12 billion acquisition of Infineon's NOR Flash and ferroelectric RAM (F-RAM) businesses has drawn close attention from China's semiconductor industry.

Thursday 17 September 2026
SK Hynix looks beyond HBM as inference workloads diversify
SK Hynix is expanding its memory strategy beyond the conventional GPU-HBM pairing as inference workloads split between latency-sensitive services and capacity-heavy, long-context applications.
Thursday 17 September 2026
Samsung bets on zHBM as 2.5D memory nears its limits
Samsung Electronics is betting on vertically stacked zHBM to move memory beyond the physical constraints of conventional 2.5D architectures, setting a system-level target of raising AI response throughput from about 100 to 1,000 tokens per second per user as workloads become more demanding.
Thursday 17 September 2026
CXMT cashes in on the DRAM shortage — and takes aim at HBM
ChangXin Memory Technologies (CXMT) is emerging from the memory shortage with sharply higher profits and greater pricing power, giving China's largest DRAM maker more resources to expand into LPDDR6 and high-bandwidth memory (HBM) while China's domestic memory supply chain moves further upstream.
Thursday 17 September 2026
Memory LTAs lock up 50-70% of capacity
The memory industry remains in short supply, and major chipmakers are raising the share of capacity committed to long-term supply agreements (LTAs) while extending their duration from three to five years, with many in the industry expecting 2027 to be the tightest year yet. Supply chain sources said Kioxia has about 50% of its LTA capacity tied up, while South Korea's two major vendors reserve about 70% of capacity for LTAs. Micron also has around 60% of its capacity locked into such agreements.
Thursday 17 September 2026
AI's memory appetite is squeezing the electronics industry from the bottom up, Intel warns

Fast-moving advances in chip production have spurred a semiconductor boom, markedly altering the manufacturing scope of the broader high-tech industry.

Thursday 17 September 2026
SK Hynix weighs US memory options as buyers lock in 2027 supply
SK Hynix is keeping its US memory options open as customers move earlier to secure 2027 supply, with tightening availability raising pressure on memory makers to consider additional capacity.
Thursday 17 September 2026
Chip equipment, materials suppliers lead India investment pledges ahead of SEMICON India 2026

Foreign commitments timed around SEMICON India are moving deeper into the supply chain. In the three days before the 2026 edition opened on September 17, Lam Research, Applied Materials, and Fujifilm announced India plans worth a combined INR144 billion (US$1.50 billion), covering silicon components, chip equipment, and process chemicals rather than chip production itself.

Thursday 17 September 2026
SK Hynix reportedly eyes Intel Ohio plant for US memory production
SK Hynix is reportedly lining up US memory chip production and is in talks with Intel over possible cooperation, including leasing part of Intel's Ohio facilities. The move would give SK Hynix its first memory chip manufacturing base in the US as Washington steps up pressure on chipmakers to expand domestic investment.
Thursday 17 September 2026
Intel CEO warns of 2027 memory crunch and tighter CPU supply
AI infrastructure expansion is turning memory supply into a major bottleneck for the semiconductor industry. Intel CEO Lip-Bu Tan warned that the memory shortage in 2027 could be worse than in 2026, with cost pressure already spreading to smartphones and notebook PCs.
Thursday 17 September 2026
Samsung looks to outside suppliers as HBM boom shifts priorities
Samsung Electronics has long benefited from a level of vertical integration few technology companies can match, spanning smartphones, memory, chip design, foundry manufacturing and packaging. However, recent sourcing moves suggest those internal links are becoming more selective as individual businesses pursue their own customers, margins and capacity priorities.
Thursday 17 September 2026
Jensen Huang's Galaxy Z Fold8 spotlights Nvidia-Samsung ties

Nvidia CEO Jensen Huang has again been photographed using Samsung Electronics' latest foldable phone, the Galaxy Z Fold8, after being seen with a Galaxy Z Fold7 earlier in 2026. The latest sighting has drawn fresh attention to the close partnership between Samsung Electronics and Nvidia.

Thursday 17 September 2026
Charts: Memory chip designers carry Taiwan's IC design rebound
Taiwan's IC design sector is growing fast, but the gains are concentrated in memory. Combined January–August 2026 revenue at the 105 listed chip designers tracked by DIGITIMES reached NT$1.15 trillion, up 29.6% from a year earlier. Five memory-related companies added two-thirds of the NT$261.8 billion increase.
Wednesday 16 September 2026
Infineon exits NOR Flash with US$1.12 billion sale to Winbond, reviving Spansion name
Winbond Electronics will buy Infineon Technologies' NOR Flash and F-RAM business for US$1.12 billion in cash and rename it Spansion, the name of the US memory pioneer whose NOR Flash line forms the core of the business.
Wednesday 16 September 2026
Samsung advances jump 70% amid shift to long-term memory deals

Samsung Electronics' total advances received rose 70.4% in the first half of 2026, while memory suppliers and their largest customers increasingly turn to multi-year agreements to secure supply and improve demand visibility.

Wednesday 16 September 2026
Soaring memory costs threaten Netronix's e-reader growth, even as new display markets stay on track
Netronix said rapidly rising memory prices are squeezing the consumer electronics supply chain, raising e-book reader costs and slowing some e-paper display projects. Even so, the company still expects growth from color readers and advertising displays in 2027, helped by resilient supply-chain execution and demand for higher-value products.
Wednesday 16 September 2026
SK Hynix union approves revised pay deal after 25-vote rejection

SK Hynix's production workers' union has approved a revised pay agreement that raises the cash share of employee profit-sharing bonuses, ending weeks of uncertainty after members rejected the previous proposal by just 25 votes.