Kioxia, which recently listed on the Tokyo Stock Exchange (TSE), has announced plans to double its market share in AI-focused NAND products. President Nobuo Hayasaka highlighted the surging demand for AI-driven applications as a primary growth driver. He also called on major shareholders Bain Capital and Toshiba to reduce their stakes within three years to bolster Kioxia's operational independence.

The world's third-largest NAND flash manufacturer, Kioxia, has officially gone public in Japan, securing funding for investments in artificial intelligence (AI) semiconductor technologies. This move has drawn close attention from major South Korean companies Samsung Electronics (Samsung) and SK Hynix.

The US Department of Commerce has awarded SK Hynix a grant of up to US$458 million under the CHIPS and Science Act (CHIPS Act), supporting the company's efforts to strengthen the AI supply chain in the US. The funding will support the establishment of a research center in Indiana focused on next-generation high bandwidth memory (HBM) and advanced packaging R&D.

Micron Technology reported record fiscal first-quarter revenue driven by data center SSD sales, which now represent over half of total revenue. While HBM shipments doubled quarter over quarter, the company's fiscal second-quarter guidance fell below expectations due to weakening demand in non-AI segments. However, AI-driven growth prospects remain strong for fiscal 2025.

After revealing the latest financial results, Micron held an earnings call, discussing the recovery paces across markets. The company is optimistic about the demand for HBM as it continues to secure customers and develop HBM4.

Japanese NAND flash manufacturer Kioxia has announced plans to produce three additional types of memory, targeting next-generation products driven by artificial intelligence (AI) demand. The announcement comes as the company approaches its IPO and seeks to communicate its value to the market.

The US Department of Commerce's Bureau of Industry and Security (BIS) has expanded semiconductor export controls to include high bandwidth memory (HBM), a crucial component for artificial intelligence and high-performance computing. This strategic move raises concerns over the impact on Samsung Electronics, which sells specific HBM products to mainland China.

Memory-chip maker Kioxia rose in its debut on the Tokyo Stock Exchange on Wednesday, underscoring decent investor demand for new shares in Japan. After initially dropping, the company traded at JPY1,493, compared with its initial public offering price of JPY1,455. That valued the firm at JPY807.5 billion (approx. US$5.3 billion), a fraction of the US$18 billion that a Bain Capital-led consortium forked over in 2018.

The surging AI market has driven unprecedented demand for high-bandwidth memory (HBM), placing significant strain on supply chains. In early August, reports surfaced that the Biden administration was planning stricter semiconductor export controls, targeting China's access to HBM—a key component for AI chips—and the equipment needed for its manufacturing.

According to ET News, SK Hynix is setting its sights on the semiconductor packaging market by offering packaging foundry services, a move that analysts say capitalizes on its expertise in high bandwidth memory (HBM).

Samsung Electronics plans to introduce samples of its next-generation LPDDR6 memory by late 2025, addressing the growing demand for on-device AI solutions. The initiative aims to enhance Samsung's technological edge and shift toward high-value-added memory products, countering declining general-purpose DRAM prices.

The Biden Administration is expected to unveil new regulations by the end of the year, targeting China's acquisition of advanced AI chips through third-party nations. These measures aim to close loopholes and strengthen US control over sensitive technology exports.

Two pivotal areas in the semiconductor industry- standard DRAM and mature logic processes—are undergoing significant shifts. Despite their independence, both segments share common drivers of transformation.

Samsung Electronics has reportedly initiated a large-scale personnel reshuffle, reallocating engineers to its next-generation semiconductor hub in Pyeongtaek. However, the company denied these claims, stating they are unfounded.

The CHIPS and Science Act, signed into law by President Joe Biden in August 2022, has been in place for over two years. While companies like Intel and Microchip have progressed with incentive agreements and investment plans, their experiences underscore the Act's challenging and complex implementation process.

Micron Technology is set to secure up to US$6.2 billion in US subsidies this week, marking the final major agreement under the Biden administration's semiconductor initiative, while Asian tech giants Samsung Electronics and SK Hynix remain waiting.

The US Department of Commerce has awarded Micron Technology US$6.165 billion to expand memory chip production in New York and Idaho, creating 20,000 jobs. The chipmaker also secured US$275 million to modernize its Virginia facility, strengthening domestic supply chain resilience.

Despite the low profitability of SK Hynix's CMOS image sensor (CIS) business, the company has decided to retain this segment and reorganize its CIS development team under the Future Technology Research Institute, possibly hoping to replicate the successful narrative seen in high bandwidth memory (HBM).

Samsung Electronics is exploring the development of discrete package low-power DRAM (LPDDR) for Apple's iPhones to meet the tech giant's evolving requirements, though Samsung has not confirmed these reports.

Japan reportedly played a crucial role in keeping Chinese memory maker ChangXin Memory Technologies (CXMT) off the recently updated US Entity List, according to sources from China's supply chain.

SK Hynix has announced a major organizational restructuring and executive appointments, highlighted by the creation of a new chief development officer (CDO) position to oversee DRAM and NAND Flash memory product development. The company has promoted Hyun Ahn, former head of the NAND solutions committee (N-S committee), to president and appointed him as the inaugural CDO.

The US court has ruled that Samsung Electronics (Samsung) must pay US$118 million to American semiconductor company Netlist in a patent infringement lawsuit. This ruling has not only drawn attention to Netlist but also signals a potential trend towards stronger patent protections in the US, posing risks for South Korean companies like Samsung.

Japanese semiconductor distributors are strengthening their foothold in China through strategic partnerships and acquisitions to navigate the complexities of US-China trade tensions, particularly in meeting the growing demand for mature process chips in the automotive sector.

With the US implementing new semiconductor export controls, Samsung Electronics (Samsung) and SK Hynix have gained temporary relief as they advance their process upgrades at factories in Xi'an and Wuxi. However, the exclusion of CXMT from the Entity List has sparked concerns in the South Korean industry.

The South Korean government has assured that the Biden administration's latest semiconductor control measures against China, including restrictions on high bandwidth memory (HBM) exports, will have minimal impact on Samsung Electronics (Samsung) and SK Hynix. The measures are aimed at limiting the development of China's artificial intelligence (AI) industry.