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Thursday 6 August 2026
Sandisk leans on multi-year supply deals as it bets on AI-driven NAND supercycle
Sandisk closed its fiscal 2026 with record revenue, gross margin, and earnings per share. Still, the bigger story for investors is how much of the company's future business is now locked into long-term contracts, according to the company's fourth-quarter earnings call on August 5, 2026.
Thursday 6 August 2026
WD points to HAMR ramp and long-term contracts as pricing power builds
At its fiscal fourth-quarter 2026 earnings call on August 5, Western Digital (WD) laid out a near-term growth strategy centered on higher-capacity hard disk drives and multiyear customer contracts, even as executives acknowledged a quarter-on-quarter slowdown in exabyte shipment growth.
Thursday 6 August 2026
Sandisk's data center pivot drives record quarter as AI-fueled NAND shortage reshapes storage market
Sandisk reported fiscal fourth-quarter and full-year 2026 results on August 5 that underscore how thoroughly artificial intelligence (AI) demand has reshaped the NAND flash memory business, with the company's data center segment emerging as its primary growth engine and management locking in tens of billions of dollars in multi-year customer commitments to protect against the industry's traditionally volatile pricing cycles.
Thursday 6 August 2026
WD posts record fiscal fourth quarter as AI-driven demand for high-capacity drives accelerates
On August 5, Western Digital (WD) closed its fiscal 2026 with a fourth quarter that underscored how thoroughly artificial intelligence buildouts have reshaped the hard-disk-drive (HDD) market.
Thursday 6 August 2026
DRAM price surge lifts Samsung and Micron as SK Hynix loses share
Samsung Electronics and Micron Technology are benefiting more strongly from rising conventional DRAM and NAND prices than SK Hynix, whose focus on high-bandwidth memory (HBM) has slowed the expansion of its traditional DRAM business despite its leadership in HBM.
Wednesday 5 August 2026
SK Hynix to hold late-August groundbreaking for US$3.9 billion Indiana chip packaging plant
SK Hynix plans to hold a formal groundbreaking ceremony in late August for its US$3.9 billion advanced chip packaging facility in West Lafayette, Indiana, as the memory maker expands its ability to serve US customers.
Wednesday 5 August 2026
Kioxia and Sandisk unveil faster, denser QLC flash memory for AI infrastructure
Kioxia and Sandisk have introduced a next-generation QLC 3D flash memory technology that boosts storage density, bandwidth, and power efficiency, a development that could help global data centers, cloud providers, and AI developers manage surging data demand while easing energy and cooling pressures across infrastructure markets.
Wednesday 5 August 2026
Memory crunch deepens PC slump as Apple, Nvidia emerge as rare bright spots
After a brief recovery in 2025, the PC supply chain had hoped the market would return to sustained growth. Instead, AI server demand has squeezed memory production capacity, driving sharp increases in DRAM and NAND prices while also tightening CPU supply, causing overall PC demand to weaken once again.
Wednesday 5 August 2026
CXMT-SK Hynix LPDDR6 race shifts to yields, customers and capacity

China's CXMT is preparing limited production of LPDDR6 smartphone memory around the end of 2026, narrowing a technology gap with Samsung Electronics, SK Hynix and Micron that once spanned years.

Wednesday 5 August 2026
Nanya Technology July revenue hits record as DDR4 contract prices surge

Nanya Technology Corporation reported July 2026 revenue of NT$43.868 billion(US$1.353 billion), up 49.27% from June and marking a new monthly record, as stronger DDR4 contract prices lifted memory sales in the third quarter. The Taiwan memory chip maker also said revenue for the first seven months of 2026 reached NT$175.504 billion, up 660.87% from a year earlier.

Wednesday 5 August 2026
FMS 2026 opens with major memory makers present, but CXMT missing from exhibitor list
FMS 2026 opened in Santa Clara with Samsung, SK Hynix, and Micron highlighting AI memory plans, while China's CXMT was absent from the official roster. The omission is drawing attention because the event helps shape global memory trends, supply chains, and equipment demand for readers across technology markets.
Wednesday 5 August 2026
Research Insight: Samsung indicates diversification in AI memory demand, LTA reshapes supply
Samsung Electronics' memory business was the clear focus of its second quarter 2026 earnings call, accounting for about one-third of the Q&A session. DIGITIMES Intelligence said its review of the call points to three takeaways: AI is broadening high-end memory demand into a wider product mix, supply tightness will last through 2028, and long-term agreements (LTAs) are reshaping supply and operations.
Tuesday 4 August 2026
SK Hynix, Sandisk release first HBF specs with up to 512GB and 3TB/s bandwidth
SK Hynix and Sandisk released the first standard specifications for High Bandwidth Flash (HBF) on August 4, defining a NAND-based memory technology with a capacity of up to 512GB and bandwidth of up to 3TB/s.
Tuesday 4 August 2026
PSMC sees stronger 2H, says strategy unchanged after chair's death

Powerchip Semiconductor Manufacturing Corp. (PSMC) will maintain its existing strategy following the sudden death of Chairman Frank Huang and expects business to improve quarter by quarter in the second half of 2026, Acting Chairman Brian Shieh said on August 4th.

Tuesday 4 August 2026
Samsung Foundry nears full utilization, but 2nm yields remain a hurdle
Samsung Electronics' contract chipmaking business could approach full utilization in the second half of 2026, marking a potential turning point after prolonged underuse weighed on earnings.
Tuesday 4 August 2026
China's chip output jumps nearly 350% in a decade as semiconductor supply chain expands
China's industrial enterprises above the designated size produced 484.28 billion integrated circuits in 2025, up nearly 350% from 108.72 billion in 2015, as the country expanded manufacturing capacity across mature-node chips, memory, packaging, and semiconductor production equipment.
Tuesday 4 August 2026
HP, Asus and Acer reportedly turn to CXMT for laptop memory

HP, Asus and Acer have begun using limited quantities of DRAM from China's ChangXin Memory Technologies (CXMT) in selected budget notebooks sold outside the US, Nikkei Asia reported, as a global memory shortage pushes PC makers to widen their supplier base.

Tuesday 4 August 2026
CXMT reportedly weighs second Beijing DRAM fab as Chinese cities compete for memory chip investment

China's leading DRAM maker ChangXin Memory Technologies (CXMT) is considering building a second 12-inch memory chip fabrication plant in Beijing's Yizhuang district while holding early-stage financing talks with entities backed by the Beijing municipal government, according to a Reuters report. The proposed project would further expand the company's manufacturing footprint as AI-driven demand continues to tighten global memory supply.

Tuesday 4 August 2026
Team Group 2Q26 profit surges more than 200-fold, expects DRAM shortage to persist through 2027

Memory module maker Team Group posted record profit in the first half of 2026, as surging demand and a persistent DRAM supply-demand gap lifted earnings to all-time highs.

Tuesday 4 August 2026
2027 memory capacity reportedly sold out as buyers quietly lock in supply

Tight memory supply is expected to persist into 2027, with industry sources saying manufacturers have already completed much of their capacity-allocation negotiations for next year.

Tuesday 4 August 2026
Sandisk and SK Hynix release HBF spec to advance AI memory standard
Sandisk and SK Hynix have published a technical specification for high-bandwidth flash through the Open Compute Project, a move that could shape future AI infrastructure worldwide. The standard is meant to help developers build faster, more efficient inference systems as demand rises for memory that sits closer to compute and handles larger workloads.
Tuesday 4 August 2026
YMTC rejects patent-loss claims in global 3D NAND clash with Micron
Yangtze Memory Technologies Corp. (YMTC) has rejected claims that the US Patent and Trademark Office (USPTO) invalidated all 19 claims of a core 3D NAND patent, calling the reports "seriously misleading" while its patent battle with Micron Technology expands across the US, China, and Europe.
Monday 3 August 2026
Memory makers lift capex as Kioxia holds spending to defend NAND lead
Major memory suppliers are increasing capital spending as AI-related demand from U.S. technology companies accelerates, but Kioxia is keeping investment comparatively tight. According to Nikkei Asia, the Japanese NAND maker is prioritizing technology leadership over a rapid expansion of equipment spending, reflecting caution shaped by earlier downturns in the memory market.
Monday 3 August 2026
CXMT closes in on LPDDR6 mass production, challenging Samsung, SK Hynix
CXMT is nearing the end of research and development validation for LPDDR6, bringing it closer to mass production of next-generation mobile DRAM and intensifying competition with Samsung Electronics, SK Hynix and Micron.
Monday 3 August 2026
India expands chip talent pipeline amid surging global chip demand
India has stepped up efforts to build a larger semiconductor workforce through training, curriculum reform, and industry partnerships. The plan matters beyond India because chip supply chains are global, and shortages in skilled engineers, fab workers, and packaging specialists can slow production, innovation, and investment worldwide.