CONNECT WITH US
Friday 30 October 2026
Micron says 700-plus Taiwan fab workers earned five years' salary in a single year
Micron Technology paid its fiscal 2026 bonuses to Taiwan employees on October 30. The company said more than 700 production-line workers earned at least five years' worth of monthly salary in total pay for the year. The payout comes while the union at its Taoyuan fab is still rejecting the company's pay offer.
Friday 30 October 2026
SK Hynix taps HBM veteran to lead new American unit
SK Hynix has appointed its AI memory development chief to lead a newly established Americas unit based in the US, putting a technology veteran closer to major US customers as the industry shifts toward customized high-bandwidth memory (HBM) and deeper collaboration with chip developers.
Friday 30 October 2026
China's memory module bellwethers post record profits as 3Q26 momentum fades
China's listed memory module makers, whose results offer an early read on how the global memory upcycle is reaching the country's storage supply chain, reported net profit gains of more than 300-fold at the top end for the first nine months of 2026. Yet several of the largest players also posted sharp sequential profit declines in the third quarter, suggesting the windfall from low-cost inventory meeting surging contract prices is narrowing.
Friday 30 October 2026
Sandisk sees 60–90GB of NAND per CPU in AI agent workloads
Sandisk sees demand for roughly 60 to 90 gigabytes of NAND flash per CPU in certain AI inference and agent-orchestration applications, as customers rethink how they use different memory and storage technologies across their AI systems.
Friday 30 October 2026
Sandisk says customers are coming back for more NAND
Sandisk says AI infrastructure customers are returning to secure more NAND flash after underestimating their storage requirements, even as its pipeline of prospective long-term supply agreements exceeds planned output through the end of the decade.
Friday 30 October 2026
HBM4 cycle faces squeeze as capacity, specs become critical
AI chipmakers' rising memory performance requirements are accelerating the shift from sixth-generation high-bandwidth memory (HBM4) to HBM4E, according to analysis of the South Korean supply chain. Major AI semiconductor customers are already pushing HBM4E development, potentially shortening HBM4's mass-production cycle, while suppliers' development and manufacturing capabilities, thermal management, and customer validation remain decisive.
Friday 30 October 2026
Beyond nanometers: AI forces Taiwan's semiconductor ecosystem to compete at system level
Taiwan's semiconductor rise was built on a powerful division of labor: world-class IC design feeding increasingly advanced foundries, supported by packaging, testing, and an unusually dense electronics manufacturing base.
Friday 30 October 2026
Sandisk's data center expansion widens the gap with consumer storage
Sandisk's latest quarter showed enterprise storage as a stronger growth engine while its consumer business contracted. This divergence is central to interpreting the company's expansion: data center demand is supporting a much larger, more profitable business, but the performance should not be read as a uniform recovery across flash storage markets.
Friday 30 October 2026
Alibaba, Tencent, ByteDance reportedly seek 10-year DRAM deals
Alibaba, Tencent, and ByteDance are reportedly seeking long-term server DRAM supply agreements with Samsung Electronics and SK Hynix, with some requests extending through 2035, as Chinese cloud service providers (CSPs) join US technology giants in competing for future memory capacity.
Friday 30 October 2026
Samsung, SK Hynix say memory crunch could drag on for years despite spending surge
Samsung Electronics and SK Hynix expect memory shortages to persist for years despite rising investment in chip factories, as surging AI demand and increasingly complex manufacturing processes limit how quickly new capacity can come online.
Friday 30 October 2026
Memory price surge clouds peak season; Chinese brands' 4Q26 smartphone shipments to drop over 35%
Despite new smartphone launches from Apple, Huawei, Oppo, Vivo, and Xiaomi, rising memory prices are weakening sales momentum and prompting Chinese smartphone brands to adjust their product mix. DIGITIMES Intelligence senior analyst Luke Lin expects smartphone shipments in China to fall more than 13.5% year-over-year in the fourth quarter of 2026, and total shipments by Chinese brands to decline more than 35% year-over-year.
Friday 30 October 2026
Silicon Motion posts fourth straight revenue record, eyes 100% 2026 growth
Silicon Motion Technology reported third-quarter 2026 revenue of about US$560 million, marking a record high for the fourth consecutive quarter. Revenue rose 24% quarter-over-quarter and surged 131% year-over-year, putting the company on track to achieve record full-year revenue in 2026, up more than 100% from 2025.
Thursday 29 October 2026
Analysis: Samsung's record quarter came from higher prices, not more chips; expects buyers to get no relief before 2028
Samsung Electronics' third-quarter profit came almost entirely from charging more for memory chips, not from selling more of them. On its earnings call, the company also told investors the shortage behind those prices will last into 2028, even as chipmakers raise spending.
Thursday 29 October 2026
CXMT to start HBM3E production despite low yields amid tight domestic market
ChangXin Memory Technologies (CXMT), China's leading producer of DRAM memory, is reportedly planning to begin production of HBM3E, despite yields so far only reaching 20% to 30%. This reflects the memory shortage faced by China's market as it seeks to expand its domestic capacity while facing restrictions on critical equipment imports.
Thursday 29 October 2026
Samsung, SK Hynix invest KRW110 trillion as memory supply boost slips to 2028
Samsung Electronics and SK Hynix are undertaking their largest-ever equipment investments in 2026, but the memory supply increase is not expected to materialize until 2028. By then, however, new South Korean plants and expanded capacity at China's ChangXin Memory Technologies (CXMT) are expected to come online simultaneously, potentially triggering price competition in commodity DRAM.
Thursday 29 October 2026
Nvidia trims HBM4 bandwidth for Rubin platform, sources say
Nvidia is reportedly adjusting the fourth-generation high-bandwidth memory (HBM4) specification for its Vera Rubin NVL72 platform, cutting bandwidth per GPU from the previously announced 22TB/s to 19.2TB/s, a reduction of about 13%. South Korean industry observers said the move could increase supply flexibility and help balance performance with mass-production delivery, although the reason for the change and its actual impact on supplier orders remain unconfirmed.
Thursday 29 October 2026
Memory surge leaves CPI stable, hits consumer electronics hardest
Soaring memory prices have pushed some IC design firms to develop and manufacture their own SRAM as a substitute for DRAM, while electronics assemblers and brand manufacturers that still need DRAM face challenges in passing on higher costs and securing supply through long-term contracts.
Thursday 29 October 2026
Samsung EUV data leak case: researcher in university partnership indicted
Samsung Electronics' next-generation semiconductor process data was allegedly removed without authorization by a university-industry research partner in South Korea, raising concerns over security vulnerabilities in industry-academia collaborations. The researcher, who reportedly retained Samsung employee access while working on the project, was indicted after allegedly transferring extreme ultraviolet (EUV) lithography information to a personal cloud account for use in the collaboration.
Thursday 29 October 2026
Team Group earnings per share surges 1,483% in 3Q26 as new plant targets 50% capacity boost
Memory module maker Team Group reported record third-quarter results for 2026, with earnings per share soaring 1,482.55% year-over-year, while its board approved plans for a new plant in New Taipei City that is scheduled to begin production in the second quarter of 2027 and increase total capacity by about 50%.
Thursday 29 October 2026
Macronix halts NOR expansion, phases out ROM, bets NT$30B expansion on eMMC NAND
Macronix International posted record profits in the third quarter of 2026, surpassing $10 billion for the first time in company history. Chairman Miin-Chyou Wu announced that the company will phase out its traditional game console-related read-only memory (ROM) business and freeze NOR Flash capacity expansion. Instead, Macronix will allocate more than NT$30 billion (US$925 million) in capital expenditure toward embedded MultiMediaCard (eMMC) and NAND Flash. The initial phase of new capacity is expected to ramp up gradually from the second half of 2027 through year-end. "As long as we target the right customers, contract price hikes are inevitable," Wu said.
Thursday 29 October 2026
Phison wins Micron supplier awards for third straight year
Taiwan-based Phison Electronics received two awards at Micron Supplier Day 2026, marking the third consecutive year the company has earned recognition from the US memory chipmaker.
Thursday 29 October 2026
Niche memory price rally lifts Ingenic's third-quarter profit 2,595%
The global memory shortage is no longer lifting only the commodity DRAM giants. Ingenic Semiconductor, a Beijing-based fabless chip designer whose memory chips go mainly into cars, factory equipment, medical devices, and networking gear rather than smartphones and PCs, reported third-quarter net profit attributable to shareholders of CNY1.419 billion (US$212.39 million), up 2,595.49% from a year earlier, as tight supply pushed up prices for the specialty DRAM, static random-access memory (SRAM), and flash products that now make up most of its sales.
Thursday 29 October 2026
Samsung's AI memory boom drives record profit as device division stays in loss
Samsung Electronics' latest results show AI infrastructure demand increasingly determining the group's earnings, with soaring semiconductor profit offsetting continued losses in its consumer-device division. The company said a sharp expansion in high-bandwidth memory (HBM) sales and rising memory prices drove another record quarter, while its outlook pointed to supply pressure further as customers expand AI investment.
Thursday 29 October 2026
Anthropic's IPO filing highlights China AI rivalry as model distillation, chip export controls emerge as key risks
US AI startup Anthropic has formally filed for an initial public offering (IPO) with the US Securities and Exchange Commission (SEC), identifying competitive pressure from Chinese AI companies, model distillation, and cross-border technology restrictions among its operational risks.
Wednesday 28 October 2026
SK Hynix says customers want more than twice the HBM it can supply
SK Hynix said customers are seeking more than twice the high-bandwidth memory (HBM) volume it can currently supply, as moves toward shorter memory stacks reflect supply shortages rather than weakening demand.