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Wednesday 30 September 2026
Netlist challenges Micron, Nvidia, Broadcom, Google over alleged HBM patent use
Netlist has begun legal proceedings against Micron and downstream customers Nvidia, Broadcom, and Google to stop them from allegedly using the company's patented high-bandwidth memory (HBM) technology without authorization. The case arrives as AI applications are driving soaring demand for next-generation memory chips, and it is brought forward by a company with a track record of winning patent verdicts against memory makers.
Wednesday 30 September 2026
SK Hynix resumes DDR4, DDR5 packaging orders with Winpac
SK Hynix has resumed outsourcing DRAM packaging to South Korean outsourced semiconductor assembly and test (OSAT) provider Winpac, reviving a supplier relationship that ended in 2023 as the memory maker increases the volume of flip-chip packaging handled by external partners.
Wednesday 30 September 2026
Column: Memory and logic collide as AI shifts the balance
As HBM approaches half the cost of a GPU-HBM CoWoS package, can memory still be viewed as merely a passive component of AI computing? The answer goes back to the "memory wall," a challenge that has shaped nearly half a century of semiconductor development.
Wednesday 30 September 2026
Commentary: What risks does China's DRAM capacity face amid tightening market?
China's continued expansion of DRAM capacity has raised a key question for the global memory market: will supply and demand flip?
Wednesday 30 September 2026
CXMT's US$5.2 billion buildout deepens China's push for domestic DRAM equipment
China's largest dynamic random-access memory (DRAM) maker ChangXin Memory Technologies (CXMT) is accelerating a CNY34.9 billion (US$5.2 billion) expansion aimed at chipmaking equipment, in-house testing and tighter control of its memory supply chain.
Wednesday 30 September 2026
CXMT expansion meets surging GigaDevice DRAM demand, sharpening China's memory supply-chain buildout
CXMT's continued DRAM capacity expansion is coinciding with stronger demand from China's domestic memory sector.
Wednesday 30 September 2026
AMD's Lisa Su reportedly revisiting South Korea in October to deepen HBM4, NPU ties
Advanced Micro Devices (AMD) CEO Lisa Su is reportedly set to visit South Korea again in October 2026, after her March 2026 trip, which formally launched next-generation AI memory cooperation with Samsung Electronics. The planned visit is expected to broaden that push, with meetings lined up with South Korean AI chip companies and government officials as AMD deepens its AI semiconductor alliance in the country.
Wednesday 30 September 2026
Memory shortage pushes TV semiconductors above panel costs

A global memory shortage linked to rising AI infrastructure spending has upended TV manufacturing economics, with semiconductor costs now overtaking display panels in some models. The shift, reported by ET News, could squeeze profitability at major TV makers including Samsung Electronics and LG Electronics.

Wednesday 30 September 2026
Inside China's 3D DRAM push: from lab to fab, and the road ahead
China's push into 3D DRAM is moving from early-stage research into wafer processes and equipment, with efforts spanning the Institute of Microelectronics of the Chinese Academy of Sciences (IMECAS), the Beijing Superstring Memory Research Institute (SAMT), CXMT, and equipment maker NAURA Technology Group. The coordinated advance highlights both the momentum behind 3D DRAM and the technical hurdles still blocking mass production.
Tuesday 29 September 2026
CXMT to spend US$5.2 billion on R&D and testing as DRAM supply stays tight
China's ChangXin Memory Technologies (CXMT) plans to invest CNY34.9 billion (approx. US$5.2 billion) in technology R&D and additional back-end DRAM testing capacity, stepping up investment as tight memory supply and stronger pricing give the company more room to expand.
Tuesday 29 September 2026
SoftBank subsidiary Saimemory taps Shinko to bring ZAM closer to commercialization
Saimemory, a SoftBank subsidiary, has brought Shinko Electric Industries into its effort to commercialize Z-Angle Memory (ZAM), adding packaging-substrate, high-density integration and manufacturing expertise to a next-generation memory project that already includes Intel and Japan's RIKEN.
Tuesday 29 September 2026
Samsung reshuffles DRAM roadmap, prioritizing B1b hybrid bonding for D0a, HBM5
Samsung Electronics is reshaping its next-generation dynamic random-access memory (DRAM) roadmap, elevating its B1b wafer-to-wafer (W2W) hybrid bonding technology from a project-specific development to the core technology behind D0a, its first sub-10nm DRAM generation. Industry observers believe Samsung's push to commercialize B1b DRAM earlier could also benefit its next-generation high-bandwidth memory (HBM) products, including HBM5.
Tuesday 29 September 2026
Column: Why Micron's US$250M venture fund is about more than HBM margins—Taiwan has a stake in it
Micron unveiled the Micron Ventures Paradigm Fund, a US$250 million venture vehicle, in mid-August 2026, as the memory maker pairs more than US$25 billion in fiscal 2026 capex with a pledge to invest more than US$250 billion in the US by 2035. The fund is designed to give Micron an early look at technology shifts, position it for next-generation AI architectures, and strengthen its strategy to reduce memory-cycle volatility.
Tuesday 29 September 2026
Solidigm weighs US IPO as AI storage demand lifts valuation
SK Hynix's US-based NAND flash and solid-state drive (SSD) subsidiary, Solidigm, is considering a US initial public offering as early as 2027, with reports indicating a potential valuation of up to US$150 billion and a fundraising target of about US$15 billion. The move comes as AI data centers drive stronger demand for high-capacity enterprise SSDs, putting AI storage businesses in focus for capital markets.
Tuesday 29 September 2026
Samsung bonus plan to lift South Korea talent race

Samsung Electronics' Device Solutions division is set to announce the calculation and payout rules for its special management performance bonus in late September, after a holiday break. The move comes as SK Hynix continues recruiting experienced talent, underscoring how pay systems and workplace conditions have become key to attracting and retaining workers at South Korea's semiconductor giants.

Tuesday 29 September 2026
SK Hynix tests HBM5 with TSMC as HBM4 enters Nvidia's next platform

SK Hynix has validated its HBM5 memory with TSMC's CoWoS packaging, the company said in a September 28 post on its corporate newsroom. That means work on the generation after next is already underway with the foundry, while its HBM4 is only now being built into Nvidia's Vera Rubin superchip.

Tuesday 29 September 2026
HBM to take nearly 30% of DRAM capacity as Samsung speeds up P5
High-bandwidth memory (HBM) is expected to account for nearly 30% of DRAM makers' total wafer capacity in 2027, up from about 20% currently, as Samsung Electronics moves to accelerate the rollout of new memory capacity amid tightening supplies of both HBM and conventional DRAM.
Tuesday 29 September 2026
Chips make up nearly half of South Korea's September exports; China, Hong Kong account for 52% of them
Semiconductors made up nearly half of South Korea's exports in the first 20 days of September, while China and Hong Kong combined accounted for more than half of the country's chip shipments in August, underscoring the growing concentration of the latest export surge by both product and destination.
Tuesday 29 September 2026
South Korean component makers face price cuts as memory costs climb

South Korean electronics component suppliers are under growing pressure as rising memory prices drive chip inflation deeper into the supply chain. Finished-goods makers are asking for price cuts of 10% to 20% starting in the third quarter of 2026, while Chinese rivals have been offering bids that are 20% to 30% lower, according to Chosun Biz.

Tuesday 29 September 2026
IDC says AI agent growth will widen global compute shortage by 2027

AI agents are moving into enterprise workflows and driving a sharp rise in demand for AI infrastructure, with a new report from IDC and IEIT Systems warning that the global compute supply-demand gap will continue widening through 2030. The report, released at the AICC2026 Artificial Intelligence Computing Conference, said high-bandwidth memory (HBM) was the biggest bottleneck.

Tuesday 29 September 2026
Samsung invests US$1 billion in ex-AWS chief's AI data center venture, joining Nvidia as a founding investor
Six Samsung companies will invest a combined US$1 billion in Helix Digital Infrastructure, a company set up by investment firm KKR to build data centers and the power supply they need for AI. The investment gives the Korean group a stake in a builder that could become a buyer of its chips, cooling equipment, batteries and construction services.
Monday 28 September 2026
South Korea's HBM-linked exports surge as Taiwan, Malaysia emerge as high-value destinations

South Korea's exports of the customs category that carries high-bandwidth memory (HBM) are no longer a two-destination story. Unit-value data show that the chips going to Taiwan and Malaysia are worth several times more per kilogram than those shipped to Hong Kong, China, or Vietnam. That points to a two-tier trade, with premium stacked memory heading to advanced packaging lines and cheaper multichip parts going to transit hubs and lower-unit-value destinations.

Monday 28 September 2026
Weekly news roundup: China gains ground in memory and AI hardware as supply stays tight
China's AI sector is shifting from catch-up to commercialization, with value concentrating in hardware bottlenecks and large platforms rather than independent model labs. Across memory, DRAM and NAND shortages, HBM reallocation and rising Chinese capacity are reshaping pricing and share gains for CXMT and YMTC. Taiwan and Singapore are extending into glass packaging, photonics and advanced packaging, while Chinese auto ambitions are stirring US backlash ahead of Xi's visit.
Saturday 26 September 2026
DIGITIMES Insight: China's memory makers seek scale, funding to close the gap with global leaders

China's two leading memory suppliers are moving to raise capital and expand output as demand for chips grows, a shift that could reshape the country's domestic supply chain. Their efforts reflect a new stage for the sector, but the long-term test will be whether fresh funding can translate into stronger technology, higher yields, and wider customer adoption.

Saturday 26 September 2026
Samsung foundry recovery gains pace, but 2nm, Taylor fab remain hurdles

Samsung Electronics' foundry recovery is gaining pace as higher utilization, firmer pricing, and stronger advanced-node demand improve earnings, but a sustained return to profit will depend on 2nm yields and how quickly its Taylor fab in Texas ramps production.