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Friday 24 April 2026
Samsung labor unions rally 40,000 workers, prepares for 18-day strike in May
Three major labor unions at Samsung Electronics held a large-scale protest on the afternoon of April 23 in front of the Pyeongtaek semiconductor campus in South Korea. An estimated 40,000 people participated, accounting for roughly one-third of the company's workforce, marking the largest collective action in Samsung's history.
Friday 24 April 2026
DIGITIMES Insight: SK Hynix's US HBM push sets up a showdown with Micron
SK Hynix Inc. has moved to deepen its presence in the US by building an HBM packaging and testing plant and planning a US stock exchange listing to raise capital — steps that could bolster local high-bandwidth memory supply and reshape competition with Micron Technology Inc.
Friday 24 April 2026
PC chipmakers warn CPU shortages cloud 2026 shipment outlook
CPU shortages in the PC sector have emerged as a new concern for shipments this year, in addition to ongoing memory supply issues. Industry players supplying PC peripheral chips observe that while current CPU shortages from x86 vendors like Intel and Advanced Micro Devices (AMD) have not yet severely impacted PC shipment forecasts, future trends remain uncertain.
Friday 24 April 2026
Interview: Taiwan-Korea cooperation not limited to memory giants; Hwaseong City aims to expand alliances
When it comes to Taiwan-Korea semiconductor cooperation, the outside world often focuses on orders and R&D between memory giants such as Samsung Electronics, SK Hynix, and TSMC. However, centered on Hwaseong City in Gyeonggi Province, South Korea, emphasizes that the potential of Taiwan-Korea cooperation goes far beyond this; both sides should establish more direct supply chain alliances at the SME level in equipment and components.
Thursday 23 April 2026
SaiMemory wins NEDO backing for next-generation ZAM memory, partners with Intel

SaiMemory, a next-generation memory developer established by SoftBank, said on April 22 that its development project has been selected for subsidies by Japan's New Energy and Industrial Technology Development Organization (NEDO), with the government expected to cover roughly half of the initial development costs.

Thursday 23 April 2026
Former Samsung Electronics researcher sentenced to 7-year prison term for leaking DRAM trade secrets
A former researcher at Samsung Electronics was sentenced to seven years in prison on April 22 by a South Korean court for leaking core semiconductor trade secrets to a Chinese competitor. The case highlights how chip-making technology is increasingly regarded by governments as a national security asset under strict protection.
Thursday 23 April 2026
SK Hynix to shift over half of NAND output to 321-layer chips
SK Hynix said it plans to expand production of its latest 321-layer NAND chips, as demand for AI applications leads to increased adoption of high-capacity enterprise storage.
Thursday 23 April 2026
SK Hynix dismisses peak fears, points to structural memory upcycle

SK Hynix said the current strength in memory pricing reflects structural changes in demand, pushing back against concerns that recent spot price weakness signals a market peak.

Thursday 23 April 2026
SK Hynix flags persistent HBM shortage as demand outpaces supply
SK Hynix said demand for high-bandwidth memory is expected to outpace supply for several years, underscoring persistent constraints in the AI memory market even as the company ramps up investment.
Thursday 23 April 2026
Samsung and SK Hynix race to upgrade China chip plants as NAND demand surges
As the artificial intelligence boom reshapes global computing demand, the memory chip industry is entering a new phase of strain and restructuring — one in which both DRAM and NAND flash are seeing rapidly tightening supply.
Thursday 23 April 2026
SK Hynix builds HBM packaging hub in Cheongju to expand AI memory capacity
SK Hynix has broken ground on a large-scale advanced packaging facility in Cheongju Technopolis, underscoring how the battleground for AI semiconductors is shifting beyond wafer fabrication to the back-end processes that increasingly define performance.
Thursday 23 April 2026
SK Hynix hits 72% operating margin in Q1, doubling profit quarter-on-quarter
SK Hynix reported its strongest quarterly results on record in the first quarter of 2026, with revenue of 52.58 trillion won (approximately US$37.9 billion), operating profit of 37.61 trillion won (approximately US$27.1 billion), and net profit of 40.35 trillion won (approximately US$29.1 billion).
Wednesday 22 April 2026
Focus: South Korea builds a semiconductor talent pipeline

South Korea's long-running experiment with job-guaranteed semiconductor education is entering a more consequential phase, with the first large wave of students from expanded industry-linked programmes set to enter the workforce from 2027. The shift is drawing fresh scrutiny over whether a model built around direct hiring pipelines, practical training, and university-industry coordination can do more than produce graduates at scale and whether it can ease the country's persistent shortage of semiconductor design talent.

Wednesday 22 April 2026
Powerchip DRAM foundry price hike to boost June revenue; IPD to drive Intel demand in 2H27
Powerchip Semiconductor Manufacturing (PSMC) held an earnings call on April 21 to address developments in memory and logic foundry services, as well as its future business outlook. PSMC president Martin Chu stated that DRAM foundry prices had significantly increased in March. However, due to the impact of the tape-out cycle on pricing, the price hike is expected to contribute to revenue starting in June.
Wednesday 22 April 2026
Samsung reportedly ramps up GDDR6 supply for Tesla but halts 1d DRAM mass production plan
Samsung Electronics is reportedly increasing production of GDDR6 specifically for Tesla starting in April 2026, even as it simultaneously scales back parts of its broader memory product line and halts plans for mass production of its next-generation 1d DRAM due to insufficient yields.
Wednesday 22 April 2026
ASM International reports 16% growth in 1Q26 revenue driven by booming AI market
ASM International reported a high revenue in the first quarter of 2026, driven by surging AI demand and its need for advanced chips. The Dutch maker of deposition equipment in the chip-making process said that this, in turn, has led semiconductor manufacturers to continue investing in equipment amid a period of tight chip-making capacity.
Wednesday 22 April 2026
Japan earthquake intensifies Kioxia supply concerns as SanDisk, Phison halt NAND pricing
A strong earthquake struck Japan's Tohoku region on the evening of April 20, 2026, near a critical semiconductor hub, raising global memory supply chain alarms. The quake's epicenter was close to Kioxia's NAND flash factories in Kitakami, Iwate Prefecture, prompting major NAND suppliers SanDisk and Phison to suspend market pricing amid fears of tightening NAND flash supply.
Wednesday 22 April 2026
Powerchip returns to profitability in 1Q26 following fab sale to Micron
Powerchip Semiconductor Manufacturing (PSMC) reported revenue of NT$13.57 billion (approx. US$432 million) in the first quarter of 2026, up 6% from the previous quarter and 22% year over year, benefiting from the disposal gains related to the sale of its Tongluo fab in Taiwan to Micron Technology. Net profit after tax reached NT$14.23 billion, with earnings per share (EPS) of NT$3.36, ending 10 consecutive quarters of losses.
Wednesday 22 April 2026
CXMT fills LPDDR4X gap as non-China CSPs seek capacity
Memory giant ChangXin Memory Technologies (CXMT) is stepping in to fill the consumer market shortfall left by Samsung Electronics' planned phase-out of LPDDR4X production. With memory costs soaring and supply tightening, roughly 40% of CXMT's capacity will reportedly be reserved for LPDDR4X, while the remaining 60% is dedicated to advanced DDR5 and LPDDR5 products.
Wednesday 22 April 2026
CXMT HBM3 timeline slips, mass production unlikely in 2026
China's leading memory chipmaker ChangXin Memory Technologies (CXMT) is facing fresh uncertainty over the commercialization timeline of its fourth-generation high bandwidth memory (HBM3), according to Korean media reports.
Tuesday 21 April 2026
AP Memory posts 112% profit surge in March, expects stronger growth momentum in 2026
Niche memory design firm AP Memory announced a 112% year-over-year increase in its self-reported March 2026 revenue to NT$814 million (approx. US$25.9 million). Pre-tax net income rose 53% to NT$457 million, while net profit attributable to the parent company grew 62% to NT$372 million. Earnings per share (EPS) reached NT$2.29. The company is optimistic about sustained growth momentum throughout 2026, with overall operational visibility better than in previous years.
Tuesday 21 April 2026
Samsung plans NAND expansion at P5 on AI-driven price gains
Surging demand for NAND flash, fuelled by artificial intelligence workloads and data centre expansion, is pushing memory makers into a new investment cycle, with Samsung Electronics and SK Hynix accelerating capacity plans after years of restraint.
Tuesday 21 April 2026
ASML's memory revenue tops logic in 1Q26, AI-fueled HBM demand surges
ASML revealed during its first quarter 2026 earnings call that revenue from memory systems has, for the first time, exceeded that of logic chips. Against a backdrop of sustained AI infrastructure investment, DRAM manufacturers are aggressively competing for extreme ultraviolet (EUV) equipment capacity, signaling a shift in global semiconductor demand patterns.
Tuesday 21 April 2026
Beijing acts on memory price surge, AI demand reshapes device costs

China's Ministry of Industry and Information Technology (MIIT) is stepping in to steady the memory supply chain after a sharp rise in DRAM and mobile memory prices began feeding into smartphones and other consumer electronics.

Tuesday 21 April 2026
Qualcomm Chief reportedly seeks memory and manufacturing deals in South Korea

Qualcomm Chief Executive Cristiano Amon is expected to meet senior executives from Samsung Electronics and SK Hynix during a recent visit to South Korea, according to industry sources. The discussions are expected to focus on securing memory supplies as well as potential cooperation with Samsung in advanced semiconductor manufacturing, including its 2nm foundry process.