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Tuesday 25 August 2026
Nvidia and SK Hynix CPO strategies diverge as 3D optics look toward a post-2030 horizon
On August 20, SK Hynix's global research team published a paper in Nature Electronics detailing its co-packaged optics (CPO) development for high-performance computing (HPC) and AI. Highlighting key technical hurdles and outlining the trajectory for next-generation optical interconnect technology, the paper marks SK Hynix's first systematic presentation of its CPO roadmap.
Tuesday 25 August 2026
US voices first complaint over South Korea's KRW800 trillion chip cluster as investment pressure mounts
The US has informally expressed dissatisfaction with the South Korean government's KRW800 trillion (US$578.5 billion) plan to build a semiconductor cluster in the country's southwest. The complaint comes as Washington escalates its demands for South Korean investment on American soil, and reflects frustration that Seoul is throwing its weight behind domestic chip projects while moving slowly on commitments in the US.
Tuesday 25 August 2026
China-based Guangyu Xinchen says 3D-stacked edge AI chip has entered mass-production deployment
According to 36Kr, Shanghai Guangyu Xinchen Technology says its TC1000 series of 3D-stacked near-memory-computing AI processors has moved from silicon validation to mass-production deployment, marking a claimed acceleration in the commercialization of memory-centric computing for edge AI.
Tuesday 25 August 2026
Commentary: Nvidia's 15% hike piles pressure on the AI supply chain, lifts ASIC prospects
Nvidia has reportedly notified major customers that server systems using its AI chips will rise by more than 15%, with the new pricing set to apply to models shipping from early 2027, including Grace Blackwell and the next-generation Vera Rubin platform. The move is expected to ripple through the chip and system supply chain, while industry figures say it could also lift the appeal of inference ASICs.
Tuesday 25 August 2026
Samsung, SK Hynix step up China NAND upgrades as US tool risks grow

Samsung Electronics and SK Hynix are stepping up equipment spending at their NAND flash plants in China through 2027, upgrading existing production lines even as future access to Western chipmaking tools becomes less predictable.

Tuesday 25 August 2026
AI infrastructure boom drives Taiwan export orders, exposing power bottleneck, net-zero tech needs

Global artificial intelligence infrastructure buildouts and rising capex by cloud service providers pushed Taiwan's July export orders for information and communications technology (ICT) products, led by AI servers, up nearly 90% year-over-year, while export orders for foundry and memory also rose by more than 70%. However, companies in advanced economies are encountering power shortages as they invest in AI infrastructure, exposing a bottleneck that highlights the need to develop AI computing and net-zero technologies in tandem.

Tuesday 25 August 2026
SK Hynix and Alibaba tackle the next AI bottleneck: getting more value per chip
The AI infrastructure race has been marked by a near-fixated drive to expand AI-powered buildouts, as demand for increasingly complex chip configurations pushes against the physical and economic limits of scalability.
Tuesday 25 August 2026
Samsung pushes HBM toward logic, SK Hynix targets packaging at Hot Chips 2026
Samsung Electronics and SK Hynix outlined different areas of emphasis for overcoming the next high-bandwidth memory (HBM) bottleneck at Hot Chips 2026, with Samsung pushing more logic and customer-specific functions into the HBM base die while SK Hynix focuses on packaging, heat and the challenges of taller memory stacks.
Tuesday 25 August 2026
Nvidia memory demand widens the gap between SK Hynix and Samsung

Nvidia's AI memory orders helped drive a sharp split between SK Hynix and Samsung Electronics in the first half of 2026. According to Chosun Biz, Nvidia became SK Hynix's biggest customer in the first half of 2026, while it did not rank among Samsung's top five revenue sources.

Monday 24 August 2026
Etron chair sees memory boom extending to 2028-2030
The memory industry is undergoing a structural shift as AI demand surges, and Etron Technology chairman Nicky Lu said the sector's boom will stretch beyond 2027, with shortages likely lasting through 2028 and possibly into 2030. He said supply is tightening further as AI and edge computing create rigid demand, pushing the supply chain to focus on higher-value applications.
Monday 24 August 2026
Samsung's DRAM capacity lead shrinks as SK Hynix expands faster

Samsung Electronics' DRAM wafer capacity will grow only marginally through 2027, with investment directed at node migration and line conversions rather than aggressive wafer-capacity expansion, according to Omdia data obtained by Chosun Biz.

Monday 24 August 2026
SK Hynix charts advanced HBM packaging path: hybrid bonding, Intel EMIB and 3D integration
Competition in high bandwidth memory (HBM) is shifting from raw memory performance to advanced packaging. As bandwidth, capacity and stack heights keep climbing, thermal management, power consumption and packaging have emerged as the new bottlenecks. At Hot Chips 2026, SK Hynix laid out its advanced packaging roadmap in detail, moving from hybrid bonding to Intel's EMIB and ultimately toward 3D integration.
Monday 24 August 2026
Analysis: SK Hynix pushes beyond HBM with HBF and CPO
SK Hynix is moving on several fronts as it pushes deeper into system-level memory competition. From high-bandwidth memory (HBM) and high-bandwidth flash (HBF) to a recently published roadmap proposing to extend co-packaged optics (CPO) to the memory interface, the company increasingly appears to be competing not just over the next generation of HBM, but over how future artificial intelligence (AI) systems organize and access memory.
Monday 24 August 2026
Nvidia server prices to rise up to 17% as memory costs climb
Prices for some Nvidia-based server systems due for delivery in 2027 are set to rise by more than 15%, with certain flagship configurations increasing about 17%, as higher memory and other component costs feed through to next-generation data center infrastructure.
Monday 24 August 2026
Shanghai accepts YMTC's STAR Market listing application
China's largest NAND flash maker is moving toward a major Shanghai listing, but global investors will be watching more than the size of the deal. YMTC's IPO comes as chip demand rises, US export controls bite, and memory markets remain highly cyclical, raising questions about whether its rapid profit surge can last.
Monday 24 August 2026
Podcast highlights: TSMC Arizona's profit turnaround, US manufacturing viability pressures South Korean memory makers
DIGITIMES analyst Luke Lin noted on a recent podcast that when reviewing TSMC's semiannual and first-quarter 2026 financial reports, the operational health and profitability of its overseas fabs, particularly the Arizona plant, warrant the closest attention. Because TSMC's quarterly and semiannual filings do not explicitly separate individual subsidiary revenue, Lin uses the parent company's procurement volume from these overseas entities as a proxy for equivalent revenue.
Monday 24 August 2026
India roundup: India's chip push moves beyond fabs as yield, supply chains and new technology become the next test
India's semiconductor strategy is entering a more demanding phase, shifting from attracting fabs and assembly plants toward building the capabilities needed to sustain them. From wafer yields and labor rules to materials, equipment, rare earth magnets and emerging technologies, the country is expanding its ambitions as it seeks a deeper role in the global chip supply chain.
Monday 24 August 2026
Research Insight: ASIC shipments projected to overtake GPU by 2027 as AI reshapes memory
ASIC and GPU shipments will reach a "golden cross" in 2027, with ASIC shipments expected to surpass GPU shipments for the first time at 15.3 million units, DIGITIMES Intelligence analyst Stella Weng said. She also said AI is driving a "qualitative change" in memory architecture inside AI servers.
Saturday 22 August 2026
AI memory windfall: Samsung to hand back up to US$79 billion in 2026
Samsung Electronics' board has approved a 2026 shareholder return plan estimated at KRW90 trillion to KRW110 trillion (approx. US$64-79 billion), which the company says is the largest ever by a Korean firm.
Friday 21 August 2026
Lee Jae-myung meets SK chief Chey Tae-won with US chip investment pressure in focus
South Korean President Lee Jae-myung has begun a fresh round of talks with the country's leading business figures, starting with a private dinner with SK Group chairman Chey Tae-won, at a time when semiconductor investment, artificial intelligence and US demands for more local manufacturing are becoming increasingly intertwined.
Friday 21 August 2026
Research Insight: Upstream memory giants eye threefold 2026 revenue as 2027 capacity eases price surge
The global memory market is entering a sharp upcycle as cloud providers boost capital spending and demand for AI infrastructure lifts DRAM, NAND, and HBM prices. According to DIGITIMES, the three largest upstream memory chip makers are headed for a more than threefold jump in combined DRAM and NAND revenue in 2026, with supply constraints likely to keep pricing firm until new capacity arrives in 2027.
Friday 21 August 2026
SK Hynix weighs Japan memory fab in Miyagi, but says no investment is final
SK hynix is considering a large-scale memory semiconductor investment in Japan, with Miyagi Prefecture emerging as a potential site, although the company has stressed that no decision has been finalized.
Friday 21 August 2026
Explainer: Why South Korea's semiconductor concentration may fare better than Taiwan's
As South Korea's semiconductor exports continue to power its economic expansion, market concerns are growing regarding the risks of excessive concentration in the tech sector. Recent financial analysis, however, suggests that South Korea may face fewer side effects from single-industry reliance than Taiwan.
Friday 21 August 2026
Research Insight: CPO gains momentum as AI interconnect demands outpace chip gains
The AI industry is watching the rise of co-packaged optics (CPO) as faster AI systems now depend on more efficient links between chips and data centers. At DIGITIMES Tech Forum 2026 in Taipei, analyst Jerry Zheng said the technology is moving toward mainstream adoption as bandwidth demand outpaces computing gains.
Friday 21 August 2026
SK hynix outlines CPO roadmap as AI computing shifts from chips to systems
SK hynix has published a technical roadmap for co-packaged optics (CPO) in the journal Nature Electronics, positioning the world's largest supplier of high-bandwidth memory (HBM) to compete not just on individual chip performance but on how memory, processors, and networking are designed together as AI computing systems scale.