US-headquartered companies held 52% of the total worldwide IC market in 2018, followed by their fellow South Korea-based companies with a 27% share, according to IC Insights.

Macronix International has seen ROM orders placed by Nintendo pick up and rise at a faster-than-expected pace, according to industry sources.

Moving out of China seems to be an irreversible trend for many IT products manufacturers at the moment. But where are they relocating? For Wistron, India is a key destination; for HHD vendors, their contract manufacturers are converging...

The development of China's homegrown DRAM industry is on track despite the escalating US-China trade war resulting in a slowdown in demand for end-market applications including handsets, PCs, servers and consumer electronics. Unfavorable global trade conditions and other macro factors will not stop...

The Trump administration's move to bar Huawei from sourcing American technology has obvious ramifications for the Chinese technology giant, cutting it off from key suppliers and forcing it to seek sometimes scarce alternatives. However, the ban also carries severe ramifications for US-based firms Micron...

Winbond Electronics expects to start operating a new 12-inch wafer plant in Kaohsiung, southern Taiwan by 2021, when the DRAM and flash memory chipmaker has its in-house developed 20nm process technology ready for commercial production.

Global fab equipment spending will rebound in 2020, growing 20% to US$58.4 billion after dropping 19% to US$48.4 billion in 2019, according to SEMI.

The global penetration rate of SSDs is expected to reach over 60% in 2019 as prices of NAND flash-based memory devices, particularly high-capacity models, have reached their sweet spots which will help drive up demand, according to industry sources.

China-based DRAM maker ChangXin Memory Technologies (CXMT) is stepping up DRAM production deployments as it will kick off commercial runs of its production lines by the end of 2019 while also marching toward volume production of 17nm process now under in-house development, according to industry sour...

A new supply chain for China IT firms may gradually take shape in Asia in the future as they are seeking to wean themselves off US suppliers of crucial components and facilitate their 5G deployments amid US trade sanctions against Huawei and other Chinese tech players, according to industry sources.

Micron Technology has introduced its new UFS 2.1 managed NAND products for automotive applications. The new Micron UFS 2.1 compliant managed NAND storage solutions deliver ultrafast boot and automotive-grade reliability using cost-effective 64-layer 3D TLC NAND architecture.

China's Shennan Circuit has managed to generate profits from its IC substrate business, and has expanded its IC substrate offerings to include those for handset-use application processors and memory modules, according to industry sources.

Winbond Electronics and Macronix International have reported sequential increases in May consolidated revenues of 2.8% and 30.6%, respectively.

DRAMeXchange expects larger-than-expected falls in DRAM ASPs in the third and fourth quarters of 2019, citing the impact of trade disputes between the US and China.

Infineon's planned US$10 billion acquisition of Cypress Semiconductor will produce the world's largest automotive chip supplier, surpassing current market leader NXP and giving the German firm a stronger position in the critical markets for infotainment and advanced driver assist systems (ADAS), according...

DRAM spot market prices continue their downward trend in June, with prices for 8Gb chips falling below US$3, according to industry sources.

The worldwide semiconductor market is forecast to drop 12.1% to US$412.1 billion in 2019, after climbing to a record high of US$468.8 billion in 2018, according to the World Semiconductor Trade Statistics (WSTS).

Chipmakers have stepped up development of their respective 120/128-layer 3D NAND flash process technologies for cost competitiveness, and are gearing up to have the technology transitions kick off in 2020, according to industry sources.

Taiwan-based Innodisk believes that AIoT will bring many new business opportunities that the company is exploring. The provider of industrial embedded flash and DRAM solutions is looking to expand its client base in this field to 300 companies by the end of 2019, according to company chairman Randy...

Taiwan-based memory module makers have put increased focus on growing sales of their high-margin niche-market product lines to mitigate the impact of falling DRAM and NAND flash prices since 2019, according to industry sources.

Revenues of the global NAND flash industry declined 23.8% sequentially to US$10.79 billion in the first quarter of 2019, according to DRAMeXchange. End-market demand has started picking up in the second quarter, but the pick-up in demand will still fail to stop the chip prices from falling further.

China's Yangtze Memory Technologies (YMTC) is likely to kick off volume production of 64-layer 3D NAND flash chips ahead of schedule, as it is striving to gain orders from Huawei, according to industry sources.

Toshiba Memory America, the US-based subsidiary of Toshiba Memory, has announced the XG6-P solid state drive (SSD) series that offers up to 2,048GB of capacity.

Nanya Technology expects to see its server DRAM shipments start ramping up substantially in the fourth quarter of 2019. The product segment will account for about 10% of the company's total shipments next year, up from the current 1-3%, according to the Taiwan-based chipmaker.

Micron Technology is striving to mitigate the impact of the US trade ban on Huawei, according to the US memory chip vendor.