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Wednesday 11 March 2026

Nvidia audits Samsung HBM4 packaging for Rubin GPUs, report says

Nvidia has reportedly conducted a series of closely spaced visits to Samsung Electronics' semiconductor packaging campus in Cheonan, South Korea, signaling that verification of the next-generation high-bandwidth memory (HBM) supply chain is entering a final stage.

Wednesday 11 March 2026

Sercomm expects memory shortages and price hikes to last until end of 2026

Sercomm chairman James Wang predicted that memory shortages and price increases will persist through the end of 2026, influenced by Middle East conflicts affecting AI data center investments and consumer reactions to smartphone price hikes.

Wednesday 11 March 2026

Applied Materials partners with Micron, SK Hynix on US$5B AI memory R&D hub

Applied Materials has partnered with memory chipmakers Micron Technology and SK Hynix to develop next-generation memory technologies for AI and high-performance computing.

Wednesday 11 March 2026

Vivo targets 20% growth for Taiwan phone sales in 2026 despite component price hikes

Vivo unveiled its V70 series in Taiwan on the March 10, aiming to drive continued growth in its 2026 local operations by bringing flagship features to a broader audience. Although Taiwan's smartphone market is expected to slow in 2025 due to high penetration rates and the price of components continues to rise, Vivo Taiwan President Yi-ting Chen said the company plans to boost revenue by 30% and increase shipment volume by 20% through targeted product segmentation and innovative marketing strategies.

Wednesday 11 March 2026

NB ODMs see no clear early pull-in, 1Q26 shipments to decline double digits

Memory shortages and price increases continue to escalate. To avoid even higher prices, vendors are shipping products sooner rather than later. However, two major notebook ODMs, Quanta and Compal, have both reported that they have not seen any early pull-in effects. Both companies stated that first quarter 2026 NB shipments will still decline double digits quarter-on-quarter, with the seasonal slow period still evident.

Wednesday 11 March 2026

Inmax advances into memory supply chain with DDR wafer-level test system

Inmax recently announced that its self-developed DDR wafer-level test system has been adopted by a major DDR memory manufacturer and has successfully been validated for mass production. The delivery of this equipment has been partially completed, marking the official start of commercialization for Inmax's business.

Tuesday 10 March 2026

SK Hynix develops 1c LPDDR6 DRAM for AI devices

SK Hynix on March 10 announced it has developed a 16Gb LPDDR6 DRAM using its sixth-generation 10nm-class (1c) process technology, marking what the company described as the world's first validation of an LPDDR6 product based on the 1c node.

Tuesday 10 March 2026

Samsung union plans 18-day strike, adding risk to HBM supply chain

Samsung Electronics' labor union recently announced that employees who do not participate in a planned 18-day general strike from May 21 to June 7, 2026, will face penalties, sparking widespread concern and controversy across South Korea. The vote on whether to proceed with the strike began March 9 and runs through March 18.

Tuesday 10 March 2026

TSMC's Arizona fab turns profitable, validating US chipmaking push

TSMC's Arizona facility posted strong profitability in the fourth quarter of 2025, underscoring the commercial viability of advanced chip manufacturing in the US, according to DIGITIMES Research senior analyst Luke Lin.

Tuesday 10 March 2026

Phison says NAND prices jumped 50% overnight as supply crunch continues

NAND flash prices have surged amid tightening supply, with some manufacturers raising quotations by as much as 50% overnight, according to Phison Electronics CEO Khein-seng Pua.

Monday 9 March 2026

Industry mulls thicker HBM standards for 20-layer stacks

Global semiconductor companies are discussing relaxing thickness standards for next-generation high-bandwidth memory (HBM) as the industry moves toward higher stack counts in future designs, according to ZDNet Korea.

Monday 9 March 2026

Micron: LPDRAM server demand to outpace market; Taiwan key production base

The rapid expansion of generative artificial intelligence (AI) and large language models (LLMs) is driving a new phase of transformation in data center memory architecture, according to Micron Technology.

Monday 9 March 2026

Nvidia halts China-bound H200 production, shifts TSMC capacity to Vera Rubin

Nvidia has halted production of artificial intelligence (AI) chips intended for the Chinese market and redirected manufacturing capacity at TSMC to its next-generation Vera Rubin platform, as regulatory barriers in both the US and China continue to cloud prospects for sales to Chinese customers, the Financial Times reported.

Monday 9 March 2026

Weekly news roundup: TSMC probe, AI boom, and memory price surge

Below are the most-read DIGITIMES Asia stories from the week of March 2 - March 8, 2026.

Monday 9 March 2026

India roundup: Japan, South Korea deepen push as semiconductor and tech investments expand

Japanese and South Korean firms are expanding their presence in India as the country strengthens its semiconductor and technology ecosystem. Rohm has partnered with Suchi Semicon for back-end manufacturing, while Hanmi Semiconductor and OLED materials firm Lordin are advancing India plans alongside Micron's new facility.

Monday 9 March 2026

LCD TV panel prices rise in 1Q26 as demand stays strong

After the Lunar New Year, LCD TV panel prices have continued to climb, driven by inventory buildup for sports events and rising costs. This momentum pushed February's LCD TV panel prices up by about US$1-2 per unit. Entering March, industry insiders expect sustained strong demand for LCD TV panels, with prices forecast to increase another US$1-3.

Monday 9 March 2026

Component price surge hits business PC market harder than consumer segment

Rising costs for memory, passive components, and battery modules are intensifying pressure on PC makers, while DynaPack and Acer Taiwan report shortages that are constraining supply and driving prices higher.

Sunday 8 March 2026

Adata chairman expects NAND price surge in 2H26

Memory module giant Adata reported record-high operations in 2025, with chairman Simon Chen forecasting a strong memory market throughout 2026. He highlighted that upstream manufacturers' inventory levels have dropped to critically low points, supporting their confidence for aggressive price hikes.

Sunday 8 March 2026

Phison rides AI wave to record profits; foresees explosive growth through 2026

Phison Electronics Corp. (TPEX: 8299), a global leader in NAND flash controllers and storage solutions, has reported a blockbuster fourth quarter for 2025, driven by an insatiable global appetite for AI-ready storage. The company posted record-breaking revenue of $719 million (NT$22.8 billion), with EPS hitting an all-time high of NT$21.74.

Friday 6 March 2026

AP Memory expands S-SiCap capacity as chipmakers shift toward custom memory

AP Memory expects growth momentum to extend into 2026, with revenue visibility already exceeding the typical six-month outlook seen in previous years. Tight supply in the global memory market has prompted customers to secure supply earlier than usual. Although rising memory wafer costs may pressure margins, the company expects gross margin to remain around 45%.

Friday 6 March 2026

Samsung reports faster-than-expected 2nm yield gains, aims to triple HBM revenue

Samsung Electronics announced that its 2nm process yield is improving faster than expected, signaling strong progress in semiconductor manufacturing. The company also revealed plans for wafer production at its Texas Taylor foundry and reaffirmed confidence in high-bandwidth memory (HBM) business.

Friday 6 March 2026

MacBook Neo lowers Apple’s entry barrier, challenging budget laptops

Apple this week unveiled a series of new products, including the latest MacBook Pro and MacBook Air models, but the launch drawing the most attention has been the new entry-level MacBook Neo lineup. Unlike other MacBook models powered by Apple's M-series Apple Silicon processors, the new product line uses A-series chips typically designed for mobile devices, with pricing set at around NT$20,000 (approx. US$631).

Friday 6 March 2026

South Korean Academia: NAND scaling nears ceiling; China seen closing gap

The rapid expansion of artificial intelligence is driving strong growth in the memory market. Compared with DRAM, which still has room for structural innovation, NAND flash has largely relied on vertical stacking for years and is now approaching the limits of its current architecture, according to South Korean academics. As a result, the segment faces increasing risk of being caught up by Chinese manufacturers.

Friday 6 March 2026

SK Group chairman reportedly to meet Nvidia CEO at GTC

SK Group chairman Chey Tae-Won is expected to attend Nvidia GTC 2026 in San Jose, California, on March 16, 2026, where he will likely hold high-level talks with Nvidia CEO Jensen Huang. The discussions are expected to center on the upcoming AI accelerator "Vera Rubin," launching in the second half of 2026, which uses sixth-generation high-bandwidth memory (HBM4). This cooperation highlights deepening ties in next-gen AI semiconductor development.

Friday 6 March 2026

Commentary: Memory price surge and the Middle East conflict bring severe challenges to Transsion

Rising geopolitical risks in the Middle East threaten to directly impact Chinese smartphone brands deeply rooted in emerging markets. For Transsion, known as the "king of low-end phones" in Africa, the Middle East and Africa (MEA) region is not only a major sales hub but also a critical market segment.

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