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Thursday 30 July 2026
Samsung signs five-year memory deals as chip shortage stretches to 2028
Samsung Electronics has signed five-year memory supply agreements with five leading global data center customers and is in the final stages of talks with five more, tying a growing share of its DRAM and NAND output to commitments that run years into the future.
Thursday 30 July 2026
South Korean chip exports increasingly flow to Taiwan for TSMC packaging amid rising AI demand

Growing demand for AI chips is sending a larger share of South Korea's semiconductor exports to Taiwan, where Korean-made high-bandwidth memory (HBM) moves into advanced packaging processes led by TSMC.

Thursday 30 July 2026
South Korean suppliers win HBM4 tester orders from SK Hynix
South Korean test-equipment suppliers Digital Frontier and UniTest have secured four orders for HBM4 wafer testers from SK Hynix worth a combined KRW247.84 billion (approx. US$172 million) in 2026, expanding domestic vendors' role in a memory-testing segment where Japan's Advantest has long been an established supplier.
Thursday 30 July 2026
High memory prices could slow China's AI push, analyst says

Memory prices are expected to remain elevated through 2026 as AI and data-center demand strains supply, with meaningful supply relief unlikely until well into 2027. A South Korean securities analyst argues that the squeeze could also make it harder for China to expand AI use, although Washington has not identified high memory prices as a policy tool.

Thursday 30 July 2026
Lam Research raises WFE outlook as AI drives NAND, DRAM, advanced packaging demand
Lam Research delivered record quarterly results and raised its outlook for global wafer fab equipment (WFE) spending, citing accelerating AI-driven demand across memory, advanced logic and packaging.
Thursday 30 July 2026
Samsung sees tripled HBM4 sales in 3Q26; HBM share to reach parity with DRAM position

Samsung Electronics expects HBM4 sales to increase more than threefold sequentially in the third quarter of 2026, the company said on its earnings call. It projected that HBM4 will account for well over 60% of its total HBM revenue in the second half — a ramp that would lift its HBM market share broadly in line with its overall DRAM share and close the gap that has defined the HBM race since the AI boom began.

Thursday 30 July 2026
Samsung: memory shortage to worsen in 2027, persist through 2028; locks top customers into multi-year deals

Samsung Electronics expects the global memory shortage to become more severe in 2027 than in 2026 and to persist through 2028, memory business EVP Jaejune Kim said on the company's second quarter of 2026 earnings call — and the company is using the crunch to fundamentally restructure how it sells memory, shifting 60-70% of its capacity into binding multi-year supply agreements.

Thursday 30 July 2026
Intel's reported DDR4 CPU revival expected to boost PC demand in second half
With AI server demand continuing to absorb DRAM production capacity, DDR5 memory prices remain elevated and are expected to rise further.
Thursday 30 July 2026
Samsung says rising memory costs will lift Taiwan smartphone market value more than 8% in 2026
Rising prices for memory and other key components are weighing on smartphone demand in Taiwan, but the overall market value is still expected to grow in 2026, according to Samsung Electronics Taiwan.
Wednesday 29 July 2026
Analysis: What Seagate's blowout quarter signals about the next two years of AI infrastructure demand

Seagate's fiscal fourth quarter was by almost every measure its strongest in over a decade — US$3.6 billion in revenue, US$1.1 billion in free cash flow, and gross margins pushing toward 53%. But for supply chain watchers, the more important story is what the results reveal about where demand is heading, who is driving it, and how the hardware ecosystem needs to prepare.

Wednesday 29 July 2026
SK Hynix keeps US and Japan expansion options open despite KRW40T capex plan
SK Hynix is advancing a high-KRW40s trillion capital expenditure plan for 2026 to expand AI memory capacity, but has stopped short of committing to new production investments in the US or Japan. The company said future overseas expansion decisions will depend on business feasibility, infrastructure availability, semiconductor ecosystems, and customer needs as it builds a flexible global manufacturing footprint.
Wednesday 29 July 2026
Samsung reportedly weighs Chinese DRAM for budget smartphones as memory inflation squeezes mobile market
Samsung Electronics is considering using low-cost Chinese mobile DRAM in smartphones sold in China as it looks to cut manufacturing costs and expand its presence in the country's budget handset market, according to Asia Time.
Wednesday 29 July 2026
Macronix sees 80% gross margin within reach but warns LTAs could deepen memory downturn
Macronix International posted a sharp earnings increase in the second quarter of 2026, with gross margin reaching a record 64.4%. Its board also approved an additional NT$15.8 billion (approx. US$490 million) in capex to expand 12-inch wafer capacity.
Wednesday 29 July 2026
SK Hynix prepares for prolonged memory tightness as AI infrastructure expands

SK Hynix reported record second-quarter revenue, underscoring the firm's strong demand for AI-related memory despite supply constraints and shifting customer buying patterns. The South Korean chipmaker said it is expanding long-term agreements with major customers to lock in demand and support investment planning. The company also expects HBM and DRAM to remain key growth drivers into the second half of 2026.

Wednesday 29 July 2026
Seagate forecasts strong 1Q growth on sustained AI-driven cloud demand

On July 28, Seagate Technology reported sharply higher revenue and profit for its fiscal fourth quarter, driven by continued demand from cloud data center customers and higher-capacity storage products tied to artificial intelligence infrastructure. The company also issued first-quarter fiscal 2027 guidance above its prior quarter's revenue level, reflecting expectations that demand momentum will continue.

Wednesday 29 July 2026
SK Hynix sees record-breaking 2Q on surging AI demand

SK Hynix has announced its financial results for the second quarter of fiscal year 2026, reporting unprecedented growth in revenue and profitability. Driven by rapid expansion in the artificial intelligence (AI) market, the company achieved record-high margins and a significant surge in net profit, supported by both operational excellence and substantial investment gains.

Wednesday 29 July 2026
Adata profit surges tenfold on memory shortages and AI demand

Adata Technology posted record second-quarter results in 2026, as rising memory prices, aggressive procurement and tighter inventory management lifted revenue and profit to historic highs.

Wednesday 29 July 2026
From Silicon Valley to Sicily: Samsung, SK chiefs take Korea's AI supply-chain pitch to Google Camp

A high-level technology gathering in Sicily, reportedly to be attended by the leaders of two of South Korea's largest semiconductor groups, Samsung Electronics and SK Group, is drawing attention to their expanding roles across the AI infrastructure stack.

Wednesday 29 July 2026
AI, memory clients lock in long-term orders for Leading Technology
Leading Technology, the IC substrate arm of PCB giant Zhen Ding Technology Group, is pressing ahead with plans for a Hong Kong listing as AI and memory customers sign long-term supply deals that tie up Ajinomoto Build-Up Film (ABF) and bismaleimide triazine (BT) substrate capacity through 2028.
Wednesday 29 July 2026
Samsung and SK Hynix hold back on 3D IC; CXMT and Winbond gain
AI demand is driving a sharp rise in inquiries about 3D IC, but some in South Korea say the new technology is unlikely to become a fresh growth engine for Samsung Electronics and SK Hynix. Because 3D DRAM is closer to customized memory, mass production could clash with the scale-based business model that underpins the two memory leaders.
Tuesday 28 July 2026
CXMT's record IPO and Apple talks collide with US curbs as DRAM tightens

AI-driven demand is tightening the global memory market just as China's leading DRAM producer, ChangXin Memory Technologies, or CXMT, accelerates capacity expansion after a record IPO.

Tuesday 28 July 2026
SK Hynix enters LPDDR6 production race with Xiaomi first in line
SK Hynix reportedly plans to begin mass production and shipments of LPDDR6 in the second half of 2026, with Xiaomi expected to become its first customer for mobile devices. Industry sources said an early LPDDR6 launch would strengthen SK Hynix's position in premium mobile DRAM and lay the groundwork for expansion into AI server memory.
Tuesday 28 July 2026
AI memory demand lifts WF6 prices as PERIC Special Gases adopts market-based pricing
Surging demand for AI servers and advanced memory devices is tightening the global supply of tungsten hexafluoride (WF6), drawing increased attention to one of the semiconductor industry's most important specialty gases.
Tuesday 28 July 2026
Samsung eyes Chinese DRAM sourcing to cut costs, expand budget-phone share in China
Samsung Electronics is evaluating the use of lower-cost Chinese DRAM in some smartphones as it seeks to offset rising component costs and regain momentum in China's highly competitive budget handset market.
Tuesday 28 July 2026
SK Hynix's HBM paradox: DDR5 surge builds leverage for HBM4 price hikes

AI spending is broadening the memory upcycle beyond high-bandwidth memory, lifting prices for conventional DRAM, NAND flash and enterprise SSDs while reshaping earnings at SK Hynix and Samsung Electronics.