Memory module maker Apacer Technology reported its consolidated financial results for the first quarter of 2026, with revenue reaching NT$7.04 billion (approx. US$223 million), gross profit NT$3.47 billion, operating profit NT$2.31 billion, net profit NT$1.86 billion, and earnings per share (EPS) of NT$14.54. Revenue, gross profit, operating profit, and net profit all hit record highs for the quarter. Compared with EPS of NT$6.7 for the full-year 2025, Apacer's first-quarter earnings alone have already exceeded last year's total.

Tesla has reached the tape-out stage for its next-generation AI chip, AI5, marking a milestone in its in-house semiconductor development and offering early signals on memory supplier positioning and demand for low-power DRAM.

Samsung Electronics is aiming to produce its first samples of next-generation high-bandwidth memory (HBM4E) as early as May, with plans to deliver the chips to Nvidia after internal validation, according to Chosun Biz.

China-based Yangtze Memory Technologies Corp (YMTC) is advancing an aggressive expansion plan that could become the world's third-largest NAND maker by 2026. The company is set to begin volume production at its third fabrication plant in Wuhan in the second half of 2026.

SK Hynix is reportedly considering reducing its planned 2026 shipments of high-bandwidth memory (HBM4) to Nvidia by about 20-30%, amid delays in ramping up Nvidia's next-generation Vera Rubin platform, according to ZDNet Korea.

Samsung Electronics has begun procuring semiconductor equipment for its P4 facility in Pyeongtaek, marking the transition of its planned 1c nanometer DRAM investment into the execution phase, according to South Korean media reports.

Taiwan's exports rose to a record high in March, supported by demand for artificial intelligence (AI) and memory-related products, according to the Ministry of Finance.