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Thursday 26 February 2026
Macronix January profit surges 195%; OSE, Walton earnings rise
Despite persistent noise in the memory market, leading memory chipmaker Macronix reported a sharp surge in profitability in January 2026. The company posted preliminary pre-tax net income of NT$304 million (US$9.73 million) for the month, up 195% year on year. Net income attributable to the parent reached NT$271 million, also up 195%, with earnings per share of NT$0.15.
Thursday 26 February 2026
Samsung reportedly exits 2D NAND, converts Hwaseong Line 12 to 1c DRAM end fab
Samsung Electronics will halt 2D NAND flash production at its Hwaseong Line 12 and convert the facility into a 1c DRAM end fab, formally exiting planar NAND manufacturing and reallocating capacity toward advanced memory nodes.
Thursday 26 February 2026
YMTC's ZhiTai brand rolls out SSD lineup in Taiwan amid tight memory supply

At a time when the global memory market is marked by tight supply and surging prices, ZhiTai, the consumer brand under China's YMTC, has recently begun selling multiple SSD and storage products in Taiwan through distributors, targeting gamers, content creators, and high-performance PC builders.

Thursday 26 February 2026
Memory makers Team Group and Apacer post record profits as AI-driven demand lifts DRAM and NAND prices
Memory manufacturers Team Group and Apacer Technology reported record profits in 2025, driven by rising DRAM and NAND Flash prices and growing demand for high-capacity, high-bandwidth memory products.
Thursday 26 February 2026
Is Nvidia's GTC mystery chip a 3D IC with memory stacked on the GPU?
All eyes are on Jensen Huang ahead of the March 16–19 GTC conference. Nvidia's chief executive has promised to unveil a chip unlike anything the world has seen before —and speculation is now mounting over what that chip might actually be.
Thursday 26 February 2026
SK Hynix and Sandisk move to standardize HBF, shaking up AI memory ecosystem
SK Hynix and Sandisk have launched a consortium to standardize High Bandwidth Flash (HBF), positioning the technology as a next-generation memory layer for AI inference and heightening competition in the post-HBM era as Micron accelerates investments to strengthen its HBM4 and NAND capabilities.
Wednesday 25 February 2026
Without memory chips, Korea's semiconductor edge over China erodes, KIET warns
As the AI era accelerates, South Korea's competitive position is weakening relative to China. Even semiconductors, long a pillar of the Korean economy, are now assessed as being in a state of co-opetition rather than clear leadership.
Wednesday 25 February 2026
SK Hynix signals seller's market as memory prices set to climb all year
SK Hynix, one of the world's top three memory chip makers, told investors on a recent Goldman Sachs conference call that the global memory market has fully shifted to a "seller's market," with prices expected to climb throughout 2026.
Wednesday 25 February 2026
HP posts AI-driven revenue gains, but memory costs cloud outlook
HP reported first-quarter results for fiscal year 2026 (ending January) that exceeded expectations, driven by the Windows 11 upgrade cycle and surging demand for AI-powered PCs. Yet the company cautioned that escalating memory prices and the US trade policy uncertainties could push full-year profits to the lower end of guidance, while overall PC shipments for FY26 are expected to decline in the double digits.
Wednesday 25 February 2026
ChipMOS raises memory test prices again, signs 3-year capacity contract
ChipMOS returned to profitability in 2025 after a fourth-quarter 2025 rebound driven by memory shortages and higher test prices, and the company forecasts a stronger second-half performance in 2026 despite a weaker first quarter. The firm reported its highest quarterly revenue since the third quarter of 2022 and plans significant capital expenditure to expand testing and packaging capacity.
Wednesday 25 February 2026
Korean suppliers brace for Apple's staggered iPhone 18 rollout
Emerging reports suggest that Apple is preparing its most significant shift in iPhone release strategy in more than a decade — a recalibration shaped not only by product ambition but by mounting supply-chain constraints.
Wednesday 25 February 2026
Apple's budget MacBook set for March debut as component costs increase
Apple is expected to hold a product launch event in March 2026, with a budget MacBook anticipated to take center stage. Supply chain sources indicate volume shipments are projected to begin that same month, with some key components already delivered since late 2025. Rising prices for critical components — memory in particular — are making it harder to keep the model affordable, and could weigh on shipment volumes.
Wednesday 25 February 2026
Elon Musk recruits South Korean chip talent as HBM sparks global war
Tesla CEO Elon Musk has amplified recruitment of South Korean semiconductor talent via social media, deepening competition for engineers as global tech firms increasingly target the country's skilled workforce.
Tuesday 24 February 2026
Japan courts Samsung, SK Hynix with subsidies, but memory giants hold back
Samsung Electronics and SK Hynix have in recent years received repeated invitations from Japan's central and local governments to build semiconductor fabs, but neither has advanced the proposals, citing South Korea's domestic political environment and public sentiment.
Tuesday 24 February 2026
AI devours DRAM supply, SK’s Chey expands “monster chip” push

Artificial intelligence infrastructure spending is tightening global memory supply and reshaping the semiconductor cycle. Speaking at the 2026 Trans-Pacific Dialogue in Washington, SK Group Chairman Chey Tae-won said demand for AI memory is distorting supply chains and pledged to expand production of what he described as "monster chips."

Tuesday 24 February 2026
Apple and Samsung tighten grip on premium smartphone segment as rivals rethink product mix
Memory supply shortages and rising prices for electronics components are expected to weigh on smartphone and notebook shipments in 2026, industry sources say. Mid- to low-end smartphone vendors face pressure to cut specs or raise prices amid thin margins and price-sensitive consumers.
Tuesday 24 February 2026
Nvidia reportedly adopts tiered HBM4 supply strategy, Samsung set to secure high-end GPU orders
Just ahead of the launch of Nvidia's next-generation GPU Vera Rubin, market sources indicate that the company will differentiate high-bandwidth memory (HBM) suppliers based on product performance tiers. Analysts suggest that Samsung Electronics may exclusively supply the sixth-generation HBM4 used in the highest-end products.
Tuesday 24 February 2026
Memory chip shortage will last until mid-2026, says Acer CEO
Acer chairman and CEO Jason Chen stated that the PC industry faces multiple headwinds in 2026, with both memory chips and processors experiencing shortages and price hikes. He expects these supply issues to remain unresolved at least until mid-2026.
Monday 23 February 2026
Lenovo hits North American partners with price increases driven by memory shortage
Global memory supply shortages are forcing PC and server vendors to pass higher component costs on to customers, with Lenovo notifying North American partners of planned price adjustments on selected commercial client devices and server products from March 2026. Resellers were urged to order by February 25, 2026, and ensure delivery by February 28, 2026, to preserve current pricing.
Monday 23 February 2026
Samsung regains DRAM lead with 40% revenue jump in 4Q25, eyes HBM4 to strengthen edge
Samsung Electronics reclaimed the global DRAM market crown in 4Q25, just one year after losing it to SK Hynix. Industry watchers are closely monitoring whether Samsung can further solidify its leadership by being the first worldwide to mass-produce and ship sixth-generation high-bandwidth memory (HBM4).
Monday 23 February 2026
Kioxia sells out 2026 NAND capacity as AI demand tightens global memory supply
As the global memory market tightens under the weight of artificial intelligence (AI) demand, Japanese NAND flash maker Kioxia Holdings has emerged as one of the clearest beneficiaries of the current upcycle, with its 2026 production capacity already fully booked and supply constraints expected to persist into 2027, according to KST Components, an electronic component distributor.
Monday 23 February 2026
Weekly news roundup: memory impacts, AI infrastructure, and policy uncertainty
Below are the most-read DIGITIMES stories from the week of February 16-22, 2026.
Monday 23 February 2026
PSMC shifts beyond mature nodes to power next wave of AI memory innovation
Powerchip Semiconductor Manufacturing Corp. (PSMC) is emerging as a central manufacturing partner in a new initiative to develop next-generation AI memory, marking a strategic shift for the Taiwanese foundry from mature-node contract manufacturing toward advanced 3D integration for artificial intelligence infrastructure.
Monday 23 February 2026
Jensen Huang's missed India summit and Valentine's dinner in Korea spotlight Nvidia's shifting priorities
Nvidia CEO Jensen Huang's absence from India's AI Impact Summit and his appearance at a late-night engineer gathering in California have drawn attention to the chipmaker's strategic priorities amid intensifying competition over next-generation memory and artificial intelligence hardware.
Friday 20 February 2026
SK Group chairman Chey meets US tech leaders to secure core AI chip supply chain
SK Group Chairman Chey Tae-won recently traveled to the US for a series of high-level meetings with CEOs from Nvidia, Broadcom, Microsoft, Meta, and Google. The strategic focus extends beyond expanding high-bandwidth memory (HBM) sales; it aims for a head start in the design phase collaboration for next-generation AI chips, aiming to capture key leadership in future AI accelerator architectures.
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