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Thursday 28 May 2026

CXMT cleared for IPO listing; could boost China's memory supply chain

ChangXin Memory Technologies (CXMT), China's top DRAM maker, has been cleared by China's securities regulator for its highly anticipated IPO, which could raise funds worth CNY29.5 billion (approx. US$4.4 billion) for the company. The Shanghai Stock Exchange said on May 27 that it had cleared a listing review for its STAR Board.

Thursday 28 May 2026

Solidigm appoints co-CEOs to split operations and growth responsibilities

Solidigm, the enterprise storage brand under SK Hynix, announced a leadership reshuffle this spring, naming two executives as co-chief executive officers to divide responsibilities between global operations and commercial growth. One co-CEO was appointed in March 2026, and the other took office on May 1, with leadership stating the change aims to accelerate product execution and business performance amid rising demand for storage driven by artificial intelligence.

Thursday 28 May 2026

SK Hynix turns Big Tech's memory scramble into tougher supply terms

SK Hynix is using Big Tech's rush to secure artificial intelligence (AI) memory supply as leverage for tougher long-term contracts, while resisting funding structures that could give major customers influence over its fabs or equipment.

Wednesday 27 May 2026

Samsung reportedly to expand Vietnam footprint with new memory chip testing plant

Samsung Electronics plans to invest VND39 trillion (approx. US$1.5 billion) in a new semiconductor testing facility in northern Vietnam, according to documents reviewed by Reuters, marking the company's first chip testing plant in the country as global memory demand surges amid the AI boom.

Wednesday 27 May 2026

From boom-bust to structural growth? Memory's US$1 trillion moment puts AI thesis to the test

First Micron, then SK Hynix, join the trillion-dollar club, capping an extraordinary repricing of an industry once dismissed as a commodity play. The milestone is more than a valuation story: it crystallizes a structural debate about whether AI has permanently transformed memory's earnings profile, a bubble concern as Chinese rivals ramp capacity, and a sharpening geopolitical contest over who controls the bandwidth backbone of artificial intelligence.

Wednesday 27 May 2026

Global DRAM revenue surges toward US$100 billion in 1Q26 on AI-driven demand

Global DRAM revenue climbed sharply in the first quarter of 2026, approaching the US$100 billion threshold as artificial intelligence demand and tight supply conditions pushed prices higher across the memory market, according to Counterpoint Research.

Wednesday 27 May 2026

Xiaomi saw nearly 60% profit drop amid memory cost 'super cycle'

On May 26, Xiaomi Corporation reported first-quarter 2026 revenue of CNY99.1 billion (approx. US$14.6 billion) as it confronts a "super cycle" of rising memory costs. Management characterized the surge as a "new normal," opting to manage the impact through "product matrix upgrades" and operational efficiency rather than passing costs directly to consumers.

Wednesday 27 May 2026

Transcend to spotlight AI-ready enterprise SSDs and DDR5 memory at COMPUTEX 2026

Transcend announced it will exhibit enterprise solid-state drives, DDR5 7200 memory, and embedded camera modules at COMPUTEX 2026 in the Storage and Management Solutions area, saying the showcase will demonstrate integrated capabilities in AI computing storage, high-speed transmission, and reliable data processing. The firm highlighted that as AI expands to endpoint applications, performance and stability have become baseline requirements for hardware suppliers.

Wednesday 27 May 2026

SK Hynix seeks to embed cooling inside HBM to beat the heat

SK Hynix has unveiled a new high-bandwidth memory technology designed to reduce heat buildup in next-generation AI systems, as rising computing density turns thermal management into a more critical front for HBM suppliers.

Tuesday 26 May 2026

Chiplet boom puts Taiwan's InPsytech and its AI connectivity IPs in the spotlight

As the global semiconductor industry pivots toward chiplet-based designs — where multiple smaller chips are packaged together rather than built as a single monolithic die — the specialized intellectual property that makes those chips communicate reliably has become critical infrastructure. InPsytech, a Taiwanese IP design firm and subsidiary of Egis Technology, has staked its business on exactly that.

Tuesday 26 May 2026

Samsung's reported 900-layer V-NAND prototype puts NAND race with YMTC in focus

The race to dominate next-generation NAND flash memory has long been measured in layers — and Samsung Electronics appears to be pulling ahead. The South Korean chipmaker has reportedly developed a 900-layer-class V-NAND prototype, a significant leap that brings the memory industry closer to the 1,000-layer threshold as chipmakers intensify efforts to pack more storage into smaller chips while cutting power consumption.

Tuesday 26 May 2026

Samsung's P4 HBM push could worsen DRAM crunch in 2027

Samsung Electronics is reportedly preparing to allocate much of its Pyeongtaek P4 cleanroom capacity to next-generation high-bandwidth memory (HBM) in 2027, a move that could tighten the supply of general-purpose DRAM as memory makers shift more production toward higher-value AI server products.

Tuesday 26 May 2026

Huawei eyes AI storage breakthrough with DoB packaging, 245TB SSD roadmap

Huawei has released its Data Storage 2030 white paper, setting out a technology roadmap for the global storage industry over the next five to 10 years, as AI large language models drive data creation into what the company calls the yottabyte era.

Tuesday 26 May 2026
SK Hynix moves cooling directly to D2D PHY to tackle rising HBM heat challenges
Heat management has become a critical challenge as HBM technology advances, with higher stacking and faster speeds to meet surging global demand for AI data processing. Efficient control of power density in the die-to-die physical layer between HBM and GPUs is now central to next-generation HBM competitiveness and data center reliability.

Tuesday 26 May 2026
Micron expands US DDR4 output as AI keeps global supply tight
As Micron Technology's decision to restart large-scale DDR4 production in the US grabs global attention, memory-chip executives and analysts say the move is less a revival of aging technology than a strategic reshuffling of supply aimed at safeguarding critical American industries.

Tuesday 26 May 2026
ADATA outlines cloud-to-edge AI ecosystem and cost-cutting AI Scaler at COMPUTEX 2026
ADATA Technology said it will present a cloud-to-edge artificial intelligence ecosystem at COMPUTEX 2026, bringing together its enterprise storage brand TRUSTA, ADATA Industrial, gaming brand XPG, and AIoT unit ATrack to showcase hardware and software integrations across data centers, PCs, and edge devices. The company announced partnerships and cross-domain integrations with Nvidia, Intel, Advantech, Asus ROG, MSI, Gigabyte, ASRock, and Razer. It highlighted solutions aimed at reducing deployment costs and extending AI to smart living and mobility scenarios.

Tuesday 26 May 2026
Kioxia targets 2027 BiCS 10 NAND production as Samsung, SK Hynix hold back investment

Kioxia is targeting 2027 production of its 10th-generation BiCS 10 NAND, a move that could help the Japanese memory maker narrow its technology gap with Samsung Electronics and SK Hynix as the South Korean rivals delay investment in their own next-generation NAND technologies, according to ZDNet Korea.

Monday 25 May 2026

Micron maps out HBM roadmap with 2027 HBM4E debut and custom AI memory designs

Micron Technology said persistent supply constraints and accelerating AI demand are shaping its long-term technology roadmap, with 1-gamma DRAM, G9 NAND, and next-generation HBM products driving growth through 2027. The company is expanding EUV adoption, deepening collaboration with customers and foundry partners, and using multi-year supply agreements to support future capacity investments.

Monday 25 May 2026

Nvidia's Vera CPU push lifts LPDDR outlook for Samsung, SK Hynix

Nvidia's decision to sell its Vera CPU as a standalone chip could create a new source of demand for low-power DRAM, adding another pressure point to the already tight memory supply chain.

Monday 25 May 2026

Huawei bypasses 3D NAND limits with 122TB AI SSD packaging breakthrough

Huawei is using self-developed packaging technology to build ultra-high-capacity enterprise SSDs, underscoring how Chinese technology companies are increasingly turning to advanced packaging and system-level engineering to navigate US semiconductor restrictions.

Monday 25 May 2026

Samsung's China exit shows Korean brands under pressure

Samsung Electronics' retreat from China's TV and home-appliance market is raising broader questions for South Korean industry, as Chinese companies gain ground in consumer electronics, autos and memory chips.

Monday 25 May 2026

AI server boom lifts memory interface chip leader, but DDR5 risks linger

Montage Technology, a company that does not manufacture memory chips itself but instead supplies the interface chips linking CPUs and memory, has quietly emerged as one of the semiconductor sector's most valuable players during the current memory upcycle.

Sunday 24 May 2026

China smartphone sales plunge 16% around May Day holidays as memory price hikes squeeze demand

China's smartphone sales fell 16% year‑over‑year during the two weeks surrounding the 2026 May Day holiday, a drop that signals wider implications for global supply chains and consumer demand as rising memory prices push up device costs and curb upgrades, according to Counterpoint Research's China Weekly Smartphone Sell‑Out Tracker data.

Sunday 24 May 2026

Geopolitics disrupts chips — can Taiwan and South Korea cooperate to hold the line?

The global semiconductor industry is being pulled in two directions. On one side, the cost of building a single advanced chip factory has ballooned to as much as US$40 billion, concentrating production in the hands of a shrinking club of players. On the other hand, US-China technology rivalry is redrawing the map of who gets to make what — and for whom.

Sunday 24 May 2026

Micron starts producing most advanced US-made DRAM at Virginia fab, expands domestic memory supply

Micron Technology has begun manufacturing its 1-alpha (1α) DRAM process technology at its factory in Manassas, Virginia, marking what the company described as the most advanced memory technology ever produced in the US and a key milestone in its effort to expand domestic semiconductor manufacturing.

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