Samsung Electronics is reportedly preparing to allocate much of its Pyeongtaek P4 cleanroom capacity to next-generation high-bandwidth memory (HBM) in 2027, a move that could tighten the supply of general-purpose DRAM as memory makers shift more production toward higher-value AI server products.
Huawei is using self-developed packaging technology to build ultra-high-capacity enterprise SSDs, underscoring how Chinese technology companies are increasingly turning to advanced packaging and system-level engineering to navigate US semiconductor restrictions.
Samsung Electronics' retreat from China's TV and home-appliance market is raising broader questions for South Korean industry, as Chinese companies gain ground in consumer electronics, autos and memory chips.
SK Hynix is reportedly considering opening a Seoul office and sales operation inside SK Group's Seorin Building in Jongno, Seoul, a symbolic headquarters site for the conglomerate, according to Maeil Business Newspaper and Chosun Biz.
CXMT's planned Shanghai listing is becoming more than a test of investor appetite for China's top DRAM maker. It is also putting a spotlight on whether the company's next phase of expansion can accelerate China's push to localize semiconductor equipment and materials.
AMD CEO Lisa Su said the company is satisfied with its current CoWoS supply from TSMC, while noting that memory has become another pressure point in the AI chip supply chain.
Nanya Technology plans to raise 2026 capital expenditure above NT$52 billion (US$1.64 billion), with chairman Tzou Ming-jen saying the DRAM maker will accelerate new fab construction to capture AI-led memory demand. Equipment installation is scheduled to begin in the first quarter of 2027, followed by mass production in the second half.
