Memory chips
  • Nanya revised upward its bit shipment guidance for the third quarter
    DRAM chipmaker Nanya Technology, specialty DRAM and flash memory specialist Winbond Electronics and mask ROM and flash chipmaker Macronix International are expected to post substantial revenue growth sequentially in the third quarter, with sales for the quarter set to peak for 2019, according to market...
  • Semiconductor firm executives seeking government assistance
    Several leaders from semiconductor firms and organizations have paid a visit to Taiwan's president Tsai Ing-wen, asking the government to tackle the two biggest issues facing the country's IC industry: a lack of talent and a lack of basic research.
  • CXMT to start volume production of 8GbDDR4 and LPDDR4 by the end of 2019
    China's DRAM startup ChangXin Memory Technologies (CXMT) will operate as an IDM and start volume production of 8GbDDR4 and LPDDR4 by the end of 2019 as scheduled, according to Ping Rxuan, the firm's vice president and chief of its future technology evaluation labs.
  • Pure Storage unveils an all-flash storage using QLC SSDs
    Pure Storage at its Pure//Accelerate 2019 event launched an all-flash array storage, the FlashArray//C adopting a full-QLC-SSD configuration, looking to compete against competitors' hybrid storage combining HDD and SSD.
  • Billings among North American manufacturers of semiconductor production equipment dropped
    Billings among North American manufacturers of semiconductor production equipment dropped both sequentially and on year in August 2019, but stayed above US$2 billion, according to SEMI.
  • Semiconductor merger and acquisition activity strengthened in the first eight months of 2019
    After slowing in the past couple years, semiconductor merger and acquisition activity strengthened in the first eight months of 2019, according to IC Insights.
  • Winbond has announced its new LPDDR4X memory series
    Winbond Electronics has announced its new LPDDR4X memory series designed for the emerging AI and 5G applications, such as ADAS, smart speakers, 8K TVs, 5G mobile phones and security surveillance systems.
  • ASE Technology Holding COO Tien Wu
    The global semiconductor sector will experience constant quantitative and qualitative changes in the next 20-30 years, and heterogeneous integration will not be confined to CPU and memory chips but will also extend to domains beyond those not currently covered by Moore's Law, according to Tien Wu,...
  • TSMC chairman Mark Liu believes Moore's Law will continue to drive semiconductor growth in decades
    Some may think Moore's Law is reaching its limits, but for TSMC, it is still very much alive. The world's number one pure-play foundry is already conducting 3nm process R&D. TSMC chairman Mark Liu believes Moore's Law will continue...
  • China semiconductor firms are keenly luring talent away from chipmakers in Taiwan and South Korea
    China-based semiconductor firms are keenly luring talent away from chipmakers in Taiwan and South Korea by offering much higher pays, seeking to shorten time for technology development and narrow technological gaps with leading players, according to CY Lu, president of Taiwan-based memory chipmaker...
  • Semicon Taiwan 2019 features speakers including TSMC chairman Mark Liu
    Moore's Law will continue to drive semiconductor industry growth in decades to come, but Taiwan's IC sector is in need of sufficient engineers to support its development, according to TSMC chairman Mark Liu.
  • Adata chairman Simon Chen expressed previously optimism about the memory market next year
    The emerging AI, IoT and 5G applications will be stimulating related chip and component demand, with a rebound likely to take place in the memory market next year, according to market observers.
  • Semicon Taiwan 2019 opens
    Semicon Taiwan 2019 opens today, focusing on cutting-edge technologies, including those concerning 5G and AI, with its forums to feature heavyweight speakers from TSMC, ASE and others.
  • Semiconductor market to rebound in 2020
    The global semiconductor market sales are forecast to increase 5-7% in 2020 following a decline this year, according to SEMI.
  • Investments in new fab projects starting construction in 2020 to reach nearly US$50 billion
    Investments in new fab projects starting construction in 2020 are expected to reach nearly US$50 billion, up about US$12 billion from 2019, according to SEMI.
  • OSE has seen clear order visibility through the end of 2019
    Memory modules specialist Orient Semiconductor Electronics (OSE) is expected to see its September revenues hit an all-time high for the third consecutive month, driven by a pull-in of orders for NAND flash devices, as well as orders for EMS services, according to market watchers,
  • Total semiconductor capital expenditures are forecast to slip 8% in 2019
    Capex spending for memory ICs was the driving factor behind strong increases in industry-wide capex spending over the past two years. Most of those upgrades and expansion plans are now completed or have entered their final building phases. As a result, memory capex is forecast to account for 43% of...
  • China's move to improve self-sufficiency for semiconductors is gaining momentum
    China's move to improve self-sufficiency for semiconductors is gaining momentum - in line with the country's national policy and in the wake of the trade war with the US - with DRAM startup ChangXin Memory Technologies moving in equipment at its 12-inch fab. CXMT...
  • China developing homegrown DRAM memory
    China-based DRAM chipmaker ChangXin Memory Technologies (CXMT, formerly Innotron) has kicked off 12-inch fab equipment move-in in the third quarter, aiming to start commercial runs for part of its production lines by the end of 2019, according to industry sources.
  • The role of Taiwan's high-tech industry is expected to improve amid the trade tensions
    Trade disputes between Japan and South Korea will likely result in fundamental changes to both countries' high-tech industry supply chains, while opening the door for enhanced cooperation between the Korean and Taiwanese high-tech sectors, according to Pei-Lin Pai, VP of technology R&D for Winbond...
  • Macronix saw its revenues climb 17.2% from a year earlier
    Macronix International and Winbond Electronics have reported sequential increases in August consolidated revenues of 24.9% and 3.1%, respectively.
  • TSMC has seen strong demand for its 7nm manufacturing capacity
    The overall semiconductor market may be weak, but TSMC has seen strong demand for its 7nm manufacturing capacity, with orders, particularly those from Chinese clients, already extending to the first half of 2020, despite uncertainties...
  • Micron CEO Sanjay Mehrotra has paid a visit to China to meet executives at Tsinghua Unigroup
    Micron Technology CEO Sanjay Mehrotra recently paid a visit to China, during which he reportedly met executives at Tsinghua Unigroup, raising speculation about potential cooperation between the two companies.
  • Chip sales during the initial six months of 2019 plunged by 13.9% compared to a year earlier
    Chip sales during the initial six months of 2019 plunged by 13.9% compared to a year earlier, the biggest drop in a half since the first half of 2009, according to IHS Markit.
  • Spending on 300mm fab equipment will slowly recover in 2020 after the 2019 downturn
    Spending on 300mm fab equipment will slowly recover in 2020 after the 2019 downturn and take off in 2021 to log a new record high topping US$60 billion, only to lag again in 2022 and rebound to an all-time peak in 2023, according to SEMI.

Taiwan handsets – 2Q 2019

Taiwan LCD monitors – 2Q 2019

Taiwan small- to mid-size LCD panels – 2Q 2019

Taiwan semiconductor foundry sector, 2Q19

Global AIO PC shipment forecast and industry analysis, 2019

Global AP demand forecast, 2017-2022

© 2019 DIGITIMES Inc. All rights reserved.
Please do not republish, publicly broadcast or publicly transmit content from this website without written permission from DIGITIMES Inc. Please contact us if you have any questions.